SSI and apc|m poster speakers
SSI poster speakers:
- Max Huber| Fraunhofer ENAS: Influence of surface roughness on water diffusion in the direct wafer bonding interface
- Stefan Karanovic | AVL List GmbH: Advanced Current Measurement Sensor Enabled by Multi-Material Additive Manufacturing
- Dominic Richter | Fraunhofer ENAS/TU Chemnitz: Influence of plasma activation on direct wafer bonding of the heterogeneous material combination LiTaO3/SiO2
- Roy Knechtel | Schmalkalden University of Applied Sciences: Assessment for Identification of an Optimal Wafer Bonding Process for Industrial Production of Highly Integrated MEMS Applications in a Wafer Foundry
- Zaid Ali | Budapest University of Technology and Economics: Enhancing Stability and Performance in Renewable Energy Systems Through Optimization-Based Tuning of Grid-Forming Controllers
- Eunchong Park | Sungkyunkwan University: Latent Diffusion Model-based Plasma Etching Endpoint Detection with Optical Emission Spectroscopy
- Mathis Janßen | TU Chemnitz: DNA origami stability in liquid and defect analysis
- Mario Costanza | IPES, Tyndall National Institute: Simulation Framework for the Design of Energy-Autonomous IOT Applications
- Stella Vallejos Vargas | Institute of Microelectronics of Barcelona: Electronic Gas/Vapor Sensors for Plant Monitoring
- George Kornaros | Hellenic Medditerranean University: IoT Devices Resource Management through Extending Kubernetes Device Plugin
- Cedric Mwangi | Kenyatta University: Wearable Devices Incorporating Multi-Modal Sensor Fusion and Machine Learning Algorithms for Monitoring and Early Detection of Seizures
- Ali Kareem Abdulrazzaq | TU Chemnitz: Bridging Verification and Testing with SysMLv2: A Practical Approach for IC Development
- Sanaz Ghazavi | TU Chemnitz: Customized SysMLv2 Profile for Model-Driven Circuit Test Development
- Katrin Unger | Silicon Austria Labs GmbH: Industrial Internet of Things Sensor System: Encapsulation for Robust Performance in Harsh Environments
- Harshita Sharma | Fraunhofer ENAS: Development of a Python-Based Mastercurvecreator Tool for Viscoelastic Materials
- Elfi Fertl | Infineon Technologies AG Neubiberg: Beam Steering with AURIX microcontroller vs. Additional Loudspeaker with PSoC microcontroller
- Xiangzhen Kong |Eindhoven University of Technology: Developing A Digital Twin For Predicting Visual Comfort In Office Environments: An Experimental Approach
- Alessio Viticchiè | AlphaWaves: AI-Driven Automation for Industrial Digitalization: A Scalable Framework for Network Discovery and Digital Twin Deployment
- Anılcan Erciyes | Marmara University: High-Fidelity Synthetic Data-Driven Machine Learning Framework for Predictive Maintenance of Three-Phase Industrial Motors
- Binaman Amuri | Marmara University: Generative Pattern Learning for Missing Sensor Data Imputation in Industrial IoT
- Jaehyeon Kim | Sungkyunkwan University: Root Cause Analysis of Plasma Process from Optical Emission Spectroscopy Signals with Recurrent Neural Network
- Ferdinand Heinrich | Fraunhofer EMFT: Flexible Data Augmentation Methods for Federated Learning with Non-IID Data Distribution
- Joris Liebermann | Fraunhofer IIS/EAS: Self-Detection of Mounting Looseness with a MEMS Accelerometer
- Brendan O‘Flynn | University College Cork: AURORA: Precision Tracking Systems for Cultural Heritage Monitoring
- Elise Saoutieff | University Grenoble Alpes: Bio-sensing system for water real-time monitoring in BioSensei project
- Chang-Hua Lin | National Taiwan University of Science and Technology: Comparison and verification of control strategies of energy storage systems in DC Microgrids
- Chang-Hua Lin | National Taiwan University of Science and Technology: Compensation Techniques for Voltage Detection in Battery Management Systems
- Paddy French | Delft University of Technology: Bio-Remote Sensing in Real-Time Thermographic Face Detection and Respiratory Rate Measurement
- Abdelatif Mariche | Budapest University of Technology and Economics: Photonics and Quantum Technology Relevant Properties of Nitrogen-Vacancy Centers in Diamond
- Torsten Thieme | DEAXO GmbH: Advanced micro integration technologies for fabrication of micro-ion-traps for a trapped-ion quantum computer
- Travis Scott | Fine Tech: Indium bump Interconnect flip chip bonding