SSI and apc|m poster speakers

SSI poster speakers:

  • Max Huber| Fraunhofer ENAS: Influence of surface roughness on water diffusion in the direct wafer bonding interface
  • Stefan Karanovic | AVL List GmbH: Advanced Current Measurement Sensor Enabled by Multi-Material Additive Manufacturing
  • Dominic Richter | Fraunhofer ENAS/TU Chemnitz: Influence of plasma activation on direct wafer bonding of the heterogeneous material combination LiTaO3/SiO2
  • Roy Knechtel | Schmalkalden University of Applied Sciences: Assessment for Identification of an Optimal Wafer Bonding Process for Industrial Production of Highly Integrated MEMS Applications in a Wafer Foundry
  • Zaid Ali | Budapest University of Technology and Economics: Enhancing Stability and Performance in Renewable Energy Systems Through Optimization-Based Tuning of Grid-Forming Controllers
  • Eunchong Park | Sungkyunkwan University: Latent Diffusion Model-based Plasma Etching Endpoint Detection with Optical Emission Spectroscopy
  • Mathis Janßen | TU Chemnitz: DNA origami stability in liquid and defect analysis
  • Mario Costanza | IPES, Tyndall National Institute: Simulation Framework for the Design of Energy-Autonomous IOT Applications
  • Stella Vallejos Vargas | Institute of Microelectronics of Barcelona: Electronic Gas/Vapor Sensors for Plant Monitoring
  • George Kornaros | Hellenic Medditerranean University: IoT Devices Resource Management through Extending Kubernetes Device Plugin
  • Cedric Mwangi | Kenyatta University: Wearable Devices Incorporating Multi-Modal Sensor Fusion and Machine Learning Algorithms for Monitoring and Early Detection of Seizures
  • Ali Kareem Abdulrazzaq | TU Chemnitz: Bridging Verification and Testing with SysMLv2: A Practical Approach for IC Development
  • Sanaz Ghazavi | TU Chemnitz: Customized SysMLv2 Profile for Model-Driven Circuit Test Development
  • Katrin Unger | Silicon Austria Labs GmbH: Industrial Internet of Things Sensor System: Encapsulation for Robust Performance in Harsh Environments
  • Harshita Sharma | Fraunhofer ENAS: Development of a Python-Based Mastercurvecreator Tool for Viscoelastic Materials
  • Elfi Fertl | Infineon Technologies AG Neubiberg: Beam Steering with AURIX microcontroller vs. Additional Loudspeaker with PSoC microcontroller
  • Xiangzhen Kong |Eindhoven University of Technology: Developing A Digital Twin For Predicting Visual Comfort In Office Environments: An Experimental Approach
  • Alessio Viticchiè | AlphaWaves: AI-Driven Automation for Industrial Digitalization: A Scalable Framework for Network Discovery and Digital Twin Deployment
  • Anılcan Erciyes | Marmara University: High-Fidelity Synthetic Data-Driven Machine Learning Framework for Predictive Maintenance of Three-Phase Industrial Motors
  • Binaman Amuri | Marmara University: Generative Pattern Learning for Missing Sensor Data Imputation in Industrial IoT
  • Jaehyeon Kim | Sungkyunkwan University: Root Cause Analysis of Plasma Process from Optical Emission Spectroscopy Signals with Recurrent Neural Network
  • Ferdinand Heinrich | Fraunhofer EMFT: Flexible Data Augmentation Methods for Federated Learning with Non-IID Data Distribution
  • Joris Liebermann | Fraunhofer IIS/EAS: Self-Detection of Mounting Looseness with a MEMS Accelerometer
  • Brendan O‘Flynn | University College Cork: AURORA: Precision Tracking Systems for Cultural Heritage Monitoring
  • Elise Saoutieff | University Grenoble Alpes: Bio-sensing system for water real-time monitoring in BioSensei project
  • Chang-Hua Lin | National Taiwan University of Science and Technology: Comparison and verification of control strategies of energy storage systems in DC Microgrids
  • Chang-Hua Lin | National Taiwan University of Science and Technology: Compensation Techniques for Voltage Detection in Battery Management Systems
  • Paddy French | Delft University of Technology: Bio-Remote Sensing in Real-Time Thermographic Face Detection and Respiratory Rate Measurement
  • Abdelatif Mariche | Budapest University of Technology and Economics: Photonics and Quantum Technology Relevant Properties of Nitrogen-Vacancy Centers in Diamond
  • Torsten Thieme | DEAXO GmbH: Advanced micro integration technologies for fabrication of micro-ion-traps for a trapped-ion quantum computer
  • Travis Scott | Fine Tech: Indium bump Interconnect flip chip bonding

Recommended Articles