After a digital Smart Systems Integration Conference in 2021, the SSI community will hopefully meet again in presence in Grenoble in 2022. We kindly invite you to present your recent developments in the field of Smart Systems Integration and system solutions there. The conference will cover topics along the whole value chain starting from MEMS/ NEMS, photonics, microfluidics or printed technologies for sensor manufacturing up to complete smart systems with embedded intelligence and to different application scenarios.

Digitization is not only increasingly entering our lifes, it is a real game changer! There will be not only advances in individual components and subsystems necessary, especially connectivity and implementation of intelligence “at the edge” integrated in smart modules and systems will be the key. To be successful in future, interdisciplinary approaches are required more than ever.

The conference will therefore cover all aspects and technology readiness levels. Key enablers and key technologies will be addressed as well as new design concepts and embedded intelligence as well as specific application domains (mobility, energy, industry, agrifood, biomedical applications, and healthy living). Beyond research topics, EPoSS as co-organizer will organize sessions on strategy and business creation as well as on impact resulting from European funded projects in the domain.

In an engaging and compact format, the conference will provide a unique and valuable opportunity to interact with the stakeholders of the Smart Systems community along the value chain by means of technical sessions, strategy panels and exhibition booths.
Research and technology organisations, small and mid-sized enterprises and industry will share their latest approaches and the results.
On behalf of the whole committee – we are looking forward to receiving your abstracts.

Conference Chairs

Prof. Thomas OttoFraunhofer ENAS
Prof. Thomas OttoFraunhofer ENAS
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Stefan FinkbeinerBosch Sensortec GmbH/EPoSS Chairman
Stefan FinkbeinerBosch Sensortec GmbH/EPoSS Chairman
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Sebastien DauvéCEA LETI
Sebastien DauvéCEA LETI
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Core team

▪Alan O‘Riordan, Tyndal
▪Albrecht Donat, Siemens AG
▪Antonio Lionetto, STMicroelectronics
▪Christian Wagner, Fraunhofer ENAS
▪Christoph Koegler, T-Systems Multimedia Solutions
▪Elisabeth Steimetz, EPoSS
▪Harald Poetter, Fraunhofer IZM
▪Klas Brinkfeld, RISE
▪Luis Fonseca, Centro Nacional de Microelectronica (CNM-IMB-CSIC)
▪Jean-Philippe Polizzi, CEA LETI
▪Jochen Langheim, STMicroelectronics / EURIPIDES
▪Martina Vogel, Fraunhofer ENAS
▪Matthias Kuehnel, Robert Bosch GmbH
▪Paddy French, TU Delft
▪Rainer Günzler, Hahn-Schickard
▪Roland Doerr, microTEC Suedwest
▪Sven Rzepka, Fraunhofer ENAS
▪Sywert Brongersma, IMEC
▪Thomas Dietrich, IVAM
▪Thomas Hammer, Siemens AG
▪Thomas Otto, Fraunhofer ENAS
▪Wolfgang Dettmann, Infineon Technologies AG

Scientific Committee

▪ Prof. Adrian Dinescu, IMT
▪ Alfredo Tafuri, MESAP
▪ Dr. Antonio Imbruglia, ST Microelectronics
▪ Ben van der Zon, HigTech NL
▪ Prof. Carles Cané, CNM Cnm.Csic
▪ Prof. Christian Becker, TU Hamburg Haarburg
▪ Dr. Christian Hedayat, Fraunhofer ENAS
▪ Dr. Emmanuelle Pauliac-Vaujour, CEA Leti
▪ Dr. Francesco Gennaro, ST Microelectronics
▪ Prof. Gerd Griepentrog, TU Darmstadt
▪ Prof. Gerwin Gelinck, TNO
▪ Dr. Jyrki Kiihamaki, MST BW
▪ Prof. Kari Mäki, VTT
▪ Prof. Karla Hiller, TU Chemnitz
▪ Prof. Larraitz Anorga, Biolanhealth
▪ Dr. Marcello Coppola, ST Microelectronics
▪ Prof. Marco Liserre, Universität Kiel
▪ Prof. Martin März, Fraunhofer IISB
▪ Dr. Michael Scholles, Fraunhofer IPMS
▪ Prof. Ran Liu Fudan, University Shanghai
▪ Uwe Schwarz, XFAB
▪ Prof. Willem van Driel, TU Delft
▪ Prof. Yvonne Joseph, TU Bergakademie Freiberg