The Smart Systems Integration Conference intends to cover all aspects of system integration, from System on Chip (SoC) via System in Package (SiP) to System of Systems (SoS) – both, hardware and software aspects . Its key mission is to connect the smart systems community and to align research activities along the whole value chain for future smart and sustainable system solutions.

The conference connects researchersconnects researchers from academia and industry as well as policy and decision makers. The three-day event is commonly organised by Fraunhofer ENAS together with the European Association on Smart Systems Integration – EPoSS to link technology and policy aspects in one event. It is technically supported by Silicon Saxony.

The envisaged European autonomy on chips and the requirements for secure communication, politically and financially subsided by the European Chips act, enhances the demand for joint efforts for integrated Smart and sustainable System solutions on all levels. A special topic session at the Smart Systems Integration 2023 will be dedicated to security of smart systems. This session will address connectivity and secure intelligence at the edge will be as key challenges to implement secure smart systems in everyday life and to increase their social acceptance. Beyond research and development topics, EPoSS as a co-organiser will hold sessions on strategy and business creation as well as on impact resulting from European funded projects in the domain of SSI.

In an engaging and compact format, the conference provides a unique and valuable opportunity to interact with the stakeholders of the smart systems community along the value chain by means of technical sessions comprising talks and poster pitches, strategy panels, podium discussions and exhibition booths. RTOs, SMEs and industry share their latest approaches and results.

Conference Chairs

Prof. Thomas OttoFraunhofer ENAS
Prof. Thomas OttoFraunhofer ENAS
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Dr. Stefan FinkbeinerBosch Sensortec GmbH/EPoSS Chairman
Dr. Stefan FinkbeinerBosch Sensortec GmbH/EPoSS Chairman
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Prof. Harald KuhnFraunhofer ENAS
Prof. Harald KuhnFraunhofer ENAS
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Core team

▪Dr. Alan O‘Riordan, Tyndal
▪Dr. Albrecht Donat, Siemens AG
▪Dr. Antonio Lionetto, STMicroelectronics
▪Prof. Bart Vandervelde, IMEC
▪Dr. Christian Wagner, Fraunhofer ENAS
▪Christoph Koegler, Infineon Technologies
▪Dr. Elisabeth Steimetz, EPoSS
▪Harald Pötter, Fraunhofer IZM
▪Dr. Jean-Philippe Polizzi, CEA Leti
▪Dr. Klas Brinkfeldt, RISE
▪Dr. Luis Fonseca, Centro Nacional de Microelectronica (CNM-IMB-CSIC)
▪Dr. Matthias Kuehnel, Robert Bosch GmbH
▪Prof. Paddy French, TU Delft
▪Dr. Rainer Günzler, Hahn-Schickard
▪Prof. Sven Rzepka, Fraunhofer ENAS
▪Dr. Sywert Brongersma, IMEC
▪Dr. Thomas Dietrich, IVAM
▪Dr. Thomas Hammer, Siemens AG
▪Prof. Thomas Otto, Fraunhofer ENAS
▪Dr. Wolfgang Dettmann, Infineon Technologies AG

Scientific Committee

▪ Prof. Adrian Dinescu, IMT
▪ Dr. Alfredo Tafuri, MESAP
▪ Dr. Antonio Imbruglia, ST Microelectronics
▪ Prof. Christian Becker, TU Hamburg Haarburg
▪ Dr. Christian Hedayat, Fraunhofer ENAS
▪ Dr. Emmanuelle Pauliac-Vaujour, CEA Leti
▪ Dr. Francesco Gennaro, ST Microelectronics
▪ Prof. Gerwin Gelinck, TNO
▪ Dr. Han Shao, Tyndall Ireland
▪ Dr. Jank Michael, Fraunhofer IISB
▪ Prof. Jean-Philippe Polizzi, CEA Leti
▪ Dr. Jyrki Kiihamaki, MST BW
▪ Prof. Kari Mäki, VTT
▪ Prof. Karla Hiller, TU Chemnitz
▪ Prof. Larraitz Anorga, Biolanhealth
▪ Dr. Marcello Coppola, ST Microelectronics
▪ Dr. Marios Sofocleous, University of Cyprus
▪ Prof. Masaya Toda, Tohoku University
▪ Dr. Michael Scholles, Fraunhofer IPMS
▪ Dr. Norman Kachel, B. Braun Melsungen AG
▪ Dr. Parvaneh Rahimi, TU Bergakademie Freiberg
▪ Prof. Ran Liu, Fudan University Shanghai
▪ Prof. Ricardo Groppo, Ideas&Motion S.r.l.
▪ Prof. Sven Rzepka, Fraunhofer ENAS
▪ Dr. Uwe Schwarz, XFAB
▪ Dr. Viktor Pankratius, Bosch Sensortec GmbH
▪ Prof. Willem van der Zon, HigTech NL
▪ Prof. Willem van Driel, TU Delft
▪ Prof. Yvonne Joseph, TU Bergakademie Freiberg