PROGRAMME / TICKETS 2025

You can view the programme for the SSI conference 2025 here.

  • Conference & exhibition: April 8 – 10, 2025
  • Conference Dinner: April 9, 2025
  • Conference Language: English
  • Conference Location: Prague Congress Centre

Check out the abstracts of the SSI speakers 2025

Conference venue 2025

The conference venue is the Prague Congress Centre. It´s located in the wider city centre of the metropolis directly at Metro C-Line Station - Vyšehrad, only two stations away from the centre of Prague.

Welcome!

Welcome to the Smart Systems Integration Conference! Our key mission is to align research, technology and dissemination activities along the entire value chain for future smart and sustainable system solutions. The Smart Systems community is joint by the system integration aspect covering the value chain from System on Chip via System in Package to System Applications – including hardware and software aspects. The conference connects participants from academia and industry as well as policy and decision makers. The three-day event is commonly organized by Fraunhofer ENAS together with the European Association on Smart Systems Integration – EPoSS to link technology and policy aspects in one event, while Silicon Saxony technically supports the conference organization.

The envisaged European autonomy on chips and the requirements for secure communication enhances the demand for joint efforts for integrated smart and sustainable system solutions on all levels. Still, the autonomy on chips must be discussed in the international context.

In an engaging and compact format, the conference provides a unique and valuable opportunity to interact with the stakeholders of the Smart Systems community along the value chain by means of technical sessions, strategy panels, job opportunities, podium discussions and exhibition booths.

Networking at the SSI

Once again, the SSI will be co-located with apc|m europe at the same place and time. A single ticket allows you to attend both conferences and increase your networking range.
A variety of networking offers enrich the scientific program: Exhibition booths of sponsors, exhibitors and companies and job opportunities enable a fruitful transfer within the community. Book your next interview with the smart system integration experts in the conference app.

PROGRAM 2025

3 days full of highlights

  • Conference Day 1 April 8, 2025
  • Conference Day 2 April 9, 2025
  • Conference Day 3 April 10, 2025
  • Central
12:00 PM - 01:00 PMREGISTRATION

apc|m and SSI participants

01:00 PM - 02:45 PMOPENING AND WELCOME I

Joint opening of the apc|m and SSI Conference 2025 in Prague | chaired by Klaus Beetz

13:00 Opening | Welcome together with apc|m
Harald Kuhn – Fraunhofer ENAS +Martin Schellenberger – Fraunhofer IISB

13:15 Greetings | Politicians from Saxony and Czech Republic
Michal Vavra – Ministry of Education, Youth and Sports, Czech Republic
Lukáš Vlček | Minister of Industry and Trade of the Czech Republic (to be confirmed)

13: 45 Keynote 1: Heterogenous Integration – Evolution of a Speciality Foundry
Volker Herbig, Vice President BU Microsystems | X-FAB MEMS Foundry GmbH

14:15 Key Note 2: Digitilization and AI as Enabler for a More Stable and Energy- Efficient Manufacturing in Europe
Yvonne Bergmann | Robert Bosch + Germar Schneider | Infineon Tech.

02:45 PM - 03:15 PMCOFFEE BREAK & EXHIBITION

Snacks & networking for apc|m and SSI participants

03:15 PM - 04:15 PMOPENING & WELCOME II

14: 45 Keynote 3: Europe quo vadis – What do we need to know for future innovations?
Dr. Christina Hirschl, Chief Executive Officer (CEO) | Silicon Austria Labs GmbH

15:15 Key Note 4: Leveraging Manufacturing Data to Predict Latent Reliability Issues in Semiconductors
Petr Lenhard | Inference Technologies

04:15 PM - 04:45 PMSPONSOR AND EXHIBITOR PITCHES

Chaired by Klaus Beetz

04:45 PM - 05:15 PMCOFFEE BREAK & EXHIBITION

Snacks & networking for apc|m and SSI participants

05:15 PM - 06:15 PMPOSTER PITCHES

SSI and apc|m poster speakers | Chaired by Christian Irmscher, Fraunhofer ENAS

SSI poster speakers:

  1. Advanced Current Measurement Sensor Enabled by Multi-Material Additive Manufacturing
    Stefan Karanovic | AVL List GmbH
  2. Influence of plasma activation on direct wafer bonding of the heterogeneous material combination LiTaO3/SiO2
    Dominic Richter | Fraunhofer ENAS / TU Chemnitz
  3. Assessment for Identification of an Optimal Wafer Bonding Process for Industrial Production of Highly Integrated MEMS Applications in a Wafer Foundry
    Roy Knechtel | Schmalkalden University of Applied Sciences
  4. Enhancing Stability and Performance in Renewable Energy Systems Through Optimization-Based Tuning of Grid-Forming Controllers
    Zaid Ali |Budapest University of Technology and Economics
  5. DNA origami stability in liquid and defect analysis
    Mathis | Janßen TU Chemnitz
  6. Electronic Gas/Vapor Sensors for Plant Monitoring
    Stella Vallejos Vargas | Institute of Microelectronics of Barcelona
  7. IoT Devices Resource Management through Extending Kubernetes Device Plugin
    George Kornaros | Hellenic Medditerranean University
  8. Wearable Devices Incorporating Multi-Modal Sensor Fusion and Machine Learning Algorithms for Monitoring and Early Detection of Seizures
    Cedric Mwangi | Kenyatta University
  9. Bridging Verification and Testing with SysMLv2: A Practical Approach for IC Development
    Christian Schott | TU Chemnitz
  10. Customized SysMLv2 Profile for Model-Driven Circuit Test Development
    Sanaz Ghazavi | TU Chemnitz
  11. Industrial Internet of Things Sensor System: Encapsulation for Robust Performance in Harsh Environments
    Katrin Unger | Silicon Austria Labs GmbH
  12. Development of a Python-Based Mastercurvecreator Tool for Viscoelastic Materials
    Harshita Sharma | Fraunhofer ENAS
  13. AI-Driven Automation for Industrial Digitalization: A Scalable Framework for Network Discovery and Digital Twin Deployment
    Alessio Viticchiè | AlphaWaves
  14. High-Fidelity Synthetic Data-Driven Machine Learning Framework for Predictive Maintenance for Three-Phase Industrial Motors
    Mujdat Soyturk | Marmara University
  15. Generative Pattern Learning for Missing Sensor Data Imputation in Industrial IoT
    Mujdat Soyturk | Marmara University
  16. Flexible Data Augmentation Methods for Federated Learning with Non IID Data Distribution
    Ferdinand | Heinrich Fraunhofer EMFT
  17. Self-Detection of Mounting Looseness with a MEMS Accelerometer
    Joris | Liebermann Fraunhofer IIS/EAS
  18. AURORA: Precision Tracking Systems for Cultural Heritage Monitoring
    Brendan O‘Flynn | University College Cork
  19. Bio-sensing system for water real-time monitoring in BioSensei project
    Elise Saoutieff | CEA-Leti
  20. Comparison and verification of control strategies of energy storage systems in DC Microgrids
    Chang-Hua Lin | National Taiwan University of Science and Technology
  21. Bio-Remote Sensing in Real-Time Thermographic Face Detection and Respiratory Rate Measurement
    Paddy French | Delft University of Technology
  22. Advanced micro integration technologies for fabrication of micro-ion-traps for a trapped-ion quantum computer
    Torsten Thieme | DEAXO GmbH
  23. Indium bump Interconnect flip chip bonding
    Travis Scott | Fine Tech
06:15 PM - 07:30 PMPOSTER RECEPTION

For all SSI and apc|m participants

  • Central
08:00 AM - 09:00 AMREGISTRATION
09:00 AM - 10:30 AMKEYNOTE SESSION

9:00 Keynote 1: tbd.
tbd. | Czech National Semiconductor Cluster

9:30 Keynote 2: System Engineering of Smart Sensors
Stefan Leidich | Robert Bosch GmbH

10:00 Keynote 3: Transistion to Smart Manufacturing
Jörg Recklies | Infineon Technologies

10:30 AM - 11:00 AMCOFFEE BREAK & EXHIBITION

Snacks & networking for apc|m and SSI participants

11:00 AM - 12:30 PMPARALLEL SESSIONS: SMART SYSTEMS INTEGRATION (TRACK 2) & APPLICATIONS OF SMART SYSTEMS (TRACK 3)

Session 1: Smart System Integration (Track 2)
Chair: Paddy French

  • 11:00 Session Opener: Performance and Energy Consumption of Smart Sensors for Vibration-Based Anomaly Detection
    Martin Lehmann | Fraunhofer IIS/EAS

  • 11:30 Smart System Integration for Photonics Based Medical Devices Perspective of Chips JU Pilot Line Project PhotonMed
    Teemu Alajoki | VTT


  • 11:50 FE approach to determine the effect of delamination in power electronic modules for automotive applications
    Jain Chacko | Fraunhofer ENAS / TUChemnitz

  • 12:10 Best Paper 2024: Silicon FET Reservoir for dynamic edge vision
    Diing Shenp Ang | Nanyang Technological University

Session 2: Applications of Smart Systems (Track 3) Chair: Sywert Brongersma

  • 11:00 Session Opener: Smart City Pilots: Advancing Sustainable Mobility and Urban Innovation
    Santiago Ferrer Jover | CT Engineering Group

  • 11:30 SenMooVe: A Platform for Sensor-based Air Quality Monitoring in Public Transport Vehicles
    Holger Döring | hd Management Consulting GmbH

  • 11:50 Smart Analytical Microtechnology for precision water monitoring
    Cecilia Jimenez-Jorquera | Institut de Microelectrònica de Barcelona / Universitat Autònoma de Barcelona
  • 12:10 The Introduction of Printed Sensors in Battery Systems to Enhance State of Health Evaluation
    Rúben Pedroso | CeNTI
12:30 PM - 02:00 PMLUNCH BREAK & EXHIBITION

Good food & networking for apc|m and SSI participants

02:00 PM - 03:50 PMPARALLEL SESSIONS: ARTIFICIAL INTELLIGENCE (TRACK 2) & SENSING (TRACK 1)

Session 3: Artificial Intelligence (Track 2)
Chair: Christoph Koegler

  • 14:00 Session Opener: tbd.

  • 14:30 Towards Fast Gaussian Process Regression Models: An FPGA-based Implementation of the RBF Kernel Matrix Computation
    Anna Zuchna | TU Chemnitz / Fraunhofer ENAS

  • 14:50 AI-driven workflow for chemical compounds classification from IR spectra of solutions
    Luca Savio | Lutech Softjam / Fraunhofer ENAS

  • 15:10 Supporting Development of AI-Based Applications in Electronic Systems Domain Using a Modular Platform ApproachDennis Hemker | Fraunhofer FIT

  • 15:30 Preprocessing Techniques to Enhance Data Quality for AI Models in EMC Analysis
    Jad Maalouly | Fraunhofer FIT / Hochschule Hamm-Lippstadt

Session 4: Sensing (Track 1)
Chair: Luis Fonseca and Sebastien Boisseau

  • 14:00 Session Opener: The Impact of Ecosystems on the Growth of the Integrated Photonics Industry
    Abdul Rahim | PhotonDelta

  • 14:30 Integration of Hydrogels on MEMS for Humidity Sensing Applications
    Alexander Kaufmann | Infineon Technologies Dresden / TUBA Freiberg

  • 14:50 Testing and Optimization of Flexible Pressure Sensors: A Drop Casting Approach with Piezoresistive Elastomers
    Michael Jank | Fraunhofer IISB

  • 15:10 Ratiometric analysis of sensor recovery time for organ health monitoring
    Avik Sett | TU Delft / Kolkata

  • 15:30 Universal PMUTs – Piezoelectric Micromachined Ultrasonic Transducers with an Automatic Wire Bond Process for Adaptive Acoustic Channels
  • Shubham Mulay | Fraunhofer ENAS / TU Chemnitz
03:50 PM - 04:30 PMCOFFEE BREAK & EXHIBITION

Snacks & networking for apc|m and SSI participants

04:30 PM - 06:00 PMPOSTERS, EXHIBITION, NETWORKING

For all SSI and apc|m participants

06:00 PM - 10:00 PMCONFERENCE DINNER AT NATIONAL HOUSE OF VINOHRADY

For apc|m and SSI participants

Address:
National House of Vinohrady
Náměstí Míru 9, 120 53 Prague 2
Czech republic

www.nardum.cz

  • Central
08:30 AM - 09:00 AMREGISTRATION
09:00 AM - 10:30 AMKEYNOTE SESSION
  • 9:00 Keynote 1: tbd.
    Gustav Kalbe | European Innovation Council

  • 9:30 Keynote 2: APECS Peak Performance in Heterogeneous Integration
    Stephan Guttowski, Managing Director | Research Fab Microelectronics Germany (FMD)

  • 10:00 Keynote 3: tbd.
    Igor Jex | Prague Technical University
10:30 AM - 11:00 AMCOFFEE BREAK & EXHIBITION

Snacks & networking for apc|m and SSI participants

11:00 AM - 12:30 PMSESSION: TECHNOLOGIES FOR QUANTUM SYSTEMS (TRACK 4)

Session 5: Technologies for Quantum Systems (Track 4)
Chair: Stefan Schulz

  • 10:30 Session Opener: Implementation of quantum technology in industrial products
    Jan Meijer | Universität Leipzig

  • 11:00 Nanolithographic waveguides, couplers and ring resonators made of Si3N4 and AlN for photonics and quantum technologies
    Julia Wecker – Fraunhofer ENAS | TU Chemnitz

  • 11:20 Superconducting Flexible Shielded Interconnects for Scalable Quantum Computing
    Martijn Goedbloed | Fraunhofer EMFT / Fraunhofer IIS

  • 11:40 DNA origami based approach for an electrically driven single photon source for contaminant detection in water
    Julia Hann | TU Chemnitz / Fraunhofer ENAS / CIC biomaGUNE
12:30 PM - 02:00 PMLUNCH & EXHIBITION

Good food & networking for apc|m and SSI participants

02:00 PM - 03:30 PMPARALLEL SESSIONS: TECHNOLOGY (TRACK 1) & SUSTAINABILITY (TRACK 3)

Session 6: Technology (Track 1)
Chair: Mathias Kühnel

  • 13:30 Session Opener: Wafel Level Technologies for System Integration
    Tino Jäger | X-FAB MEMS Foundry GmbH

  • 14:00 A novel high-speed camera system for capturing microfluidic droplets
    Veiko Rütter | Tallin University of Technology / Estonian Military Academy

  • 14:20 Influence of plasma activation on direct wafer bonding of the heterogeneous material combination LiTaO3/SiO2
    Dominic Richter | Fraunhofer ENAS / TU Chemnitz

  • 14:40 Parylene C based memristors for the realization of ultra-thin and flexible smart systems
    Franz Selbmann | Fraunhofer ENAS / TUBA Freiberg / TU Chemnitz

Session 7: Sustainability (Track 3)
Chair: Han Shao

  • 13:30 Session Opener: Vision and Roadmap for Circularity of Printed Electronics in the Automotive Sector
    Carolin Zachäus | VDI/VDE Innovation / VITO

  • 14:00 Analysis of the Carbon Footprint of Self-Powered, Wireless Sensors
    Johannes Wieczorek | Fraunhofer IIS / Fraunhofer IZM

  • 14:20 Real-time soil sensing system for farm monitoring all along FAMOSOS project
    Elise Saoutieff | CEA-Leti

  • 14:40 Innovations in façade system: Smart Solutions for Optimizing Energy Efficiency in Buildings
    Joana Gomes | CeNTI
03:30 PM - 04:00 PMCOFFEE BREAK & EXHIBITION

Snacks & networking for apc|m and SSI participants

04:00 PM - 04:30 PMCLOSING SESSION

Presentation of best poster & best paper awards

Chaired by Harald Kuhn

See you @ SSI 2025 in Prague!

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Keynote Speakers 2025

Klaus Beetz | Moderator

Klaus looks back on over three decades of experience in software and system engineering, including five years of international delegation to Eastern Europe. With degrees in mathematics and philosophy, he began his career at Nemetschek AG, a leading IT company in the AEC sector. He has gained extensive intercultural experience in international projects, particularly at the European level. His previous roles include membership on the board of the European Software Institute (ESI), the executive board of Digital Europe (DE), the steering group of the Eureka cluster ITEA, and the board of the Alliance Internet of Things Innovation (AIOTI). Since 2002, he has been with Siemens, where he led the global technology field of "Software and System Engineering." From 2011 to 2015, he served as Director for Business Creation & Entrepreneurship at EIT Digital, and from January 2020 to July 2023, he was the CEO of EIT Manufacturing. He is currently active as a board member, advisor, and speaker at various conferences.

Klaus Beetz | Moderator

Klaus looks back on over three decades of experience in software and system engineering, including five years of international delegation to Eastern Europe. With degrees in mathematics and philosophy, he began his career at Nemetschek AG, a leading IT company in the AEC sector. He has gained extensive intercultural experience in international projects, particularly at the European level. His previous roles include membership on the board of the European Software Institute (ESI), the executive board of Digital Europe (DE), the steering group of the Eureka cluster ITEA, and the board of the Alliance Internet of Things Innovation (AIOTI). Since 2002, he has been with Siemens, where he led the global technology field of "Software and System Engineering." From 2011 to 2015, he served as Director for Business Creation & Entrepreneurship at EIT Digital, and from January 2020 to July 2023, he was the CEO of EIT Manufacturing. He is currently active as a board member, advisor, and speaker at various conferences.

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Joerg ReckliesInfineon Technologies AG

Transition to SMART Manufacturing is not an on day action. From simple standardization to LLM. Look into some areas and get insides what the transision means and and where the challenges lie. What are the areas of improvement and what is the benefit for the company and the costumer.

Joerg ReckliesInfineon Technologies AG

Transition to SMART Manufacturing is not an on day action. From simple standardization to LLM. Look into some areas and get insides what the transision means and and where the challenges lie. What are the areas of improvement and what is the benefit for the company and the costumer.

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Christina HirschlSilicon Austria Labs (SAL)

Innovation and quality drive Europe's global competitiveness. The EU Chips Act boosts the semiconductor industry, reducing reliance on foreign manufacturers and strengthening technological sovereignty. However, upcoming legislation, while vital for sustainability, adds regulatory hurdles that may constrain innovation. Balancing progress with compliance is key to maintaining Europe's edge in semiconductors and beyond.

Christina HirschlSilicon Austria Labs (SAL)

Innovation and quality drive Europe's global competitiveness. The EU Chips Act boosts the semiconductor industry, reducing reliance on foreign manufacturers and strengthening technological sovereignty. However, upcoming legislation, while vital for sustainability, adds regulatory hurdles that may constrain innovation. Balancing progress with compliance is key to maintaining Europe's edge in semiconductors and beyond.

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Volker HerbigX-FAB MEMS Foundry GmbH
Volker HerbigX-FAB MEMS Foundry GmbH
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Stefan LeidichRobert Bosch GmbH

MEMS sensors are integral to modern vehicle safety and functionality, and their use has expanded significantly into consumer electronics, enabling countless daily functions. These sensors are integrated with computing units, embedded software, and communication functionalities, requiring ultra-low power operation and complex system interactions, making MEMS development a cross-domain engineering challenge. The SMP290 sensor module, which includes various components like pressure sensors, accelerometers, and BLE communication, demonstrates the need for collaboration across engineering domains to achieve reliable, low-cost, and ultra-low power operation. Looking ahead, MEMS will play a crucial role in the development of humanoid robots and the transformation of health-care, driving future market demands and innovations.

Stefan LeidichRobert Bosch GmbH

MEMS sensors are integral to modern vehicle safety and functionality, and their use has expanded significantly into consumer electronics, enabling countless daily functions. These sensors are integrated with computing units, embedded software, and communication functionalities, requiring ultra-low power operation and complex system interactions, making MEMS development a cross-domain engineering challenge. The SMP290 sensor module, which includes various components like pressure sensors, accelerometers, and BLE communication, demonstrates the need for collaboration across engineering domains to achieve reliable, low-cost, and ultra-low power operation. Looking ahead, MEMS will play a crucial role in the development of humanoid robots and the transformation of health-care, driving future market demands and innovations.

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Gustav KalbeEuropean Commission - DG Connect
Gustav KalbeEuropean Commission - DG Connect
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Dr. Stephan GuttowskiBusiness Office, Research Fab Microelectronics Germany, Fraunhofer Group for Microelectronics

The APECS pilot line strengthens European semiconductor manufacturing and chiplet innovation as part of the EU Chips Act. It enables companies to access cutting-edge technology, promotes sustainable innovation, and supports the integration of heterogeneous systems. APECS, ten partners from eight countries, provides services for research and industry, enhances quality assurance, and accelerates the market introduction of new technologies.

Dr. Stephan GuttowskiBusiness Office, Research Fab Microelectronics Germany, Fraunhofer Group for Microelectronics

The APECS pilot line strengthens European semiconductor manufacturing and chiplet innovation as part of the EU Chips Act. It enables companies to access cutting-edge technology, promotes sustainable innovation, and supports the integration of heterogeneous systems. APECS, ten partners from eight countries, provides services for research and industry, enhances quality assurance, and accelerates the market introduction of new technologies.

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Speaker

George KornarosHellenic Mediterranean University - Electrical & Computer Engineering Dept.

For real-time control and monitoring, IoT applications at the cloud/edge service layers need to gather, store, and analyze rapidly changing data streams produced by sensors. Using Google’s Kubernetes technology is one of the most effective methods to manage lightweight containers. Still, there are critical elements like resource management for IoT sensors. Without compromising the core of Kubernetes or containers, we developed a technique in this study to integrate container technology and the Kubernetes architecture into an infrastructure for controlling all types of leaf edge resource resources. Thus, we achieve to promote interoperability and simplify the administration of IoT wireless devices in diverse setups.

George KornarosHellenic Mediterranean University - Electrical & Computer Engineering Dept.

For real-time control and monitoring, IoT applications at the cloud/edge service layers need to gather, store, and analyze rapidly changing data streams produced by sensors. Using Google’s Kubernetes technology is one of the most effective methods to manage lightweight containers. Still, there are critical elements like resource management for IoT sensors. Without compromising the core of Kubernetes or containers, we developed a technique in this study to integrate container technology and the Kubernetes architecture into an infrastructure for controlling all types of leaf edge resource resources. Thus, we achieve to promote interoperability and simplify the administration of IoT wireless devices in diverse setups.

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Dominic RichterFraunhofer Enas

This presentation is about direct wafer bonding of dissimilar materials at room temperature. Room temperature bonding is of special importance for future applications because dissimilar materials (e.g. Si/LiTaO3) can be bonded without thermally induced stresses and low process costs. For this reason a high interest in roomt temperature wafer bonding arises.

Dominic RichterFraunhofer Enas

This presentation is about direct wafer bonding of dissimilar materials at room temperature. Room temperature bonding is of special importance for future applications because dissimilar materials (e.g. Si/LiTaO3) can be bonded without thermally induced stresses and low process costs. For this reason a high interest in roomt temperature wafer bonding arises.

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Anna ZuchnaTU Chemnitz

An FPGA-based accelerator design for the computation of the RBF kernel matrix is presented. After first stating the importance of Gaussian Process Regression and its need for acceleration as well as providing some theoretical basics, the key acceleration methods used are introduced and explained. Finally, first computation results of the accelerator are presented and discussed. Ongoing from this, further development steps are mentioned.

Anna ZuchnaTU Chemnitz

An FPGA-based accelerator design for the computation of the RBF kernel matrix is presented. After first stating the importance of Gaussian Process Regression and its need for acceleration as well as providing some theoretical basics, the key acceleration methods used are introduced and explained. Finally, first computation results of the accelerator are presented and discussed. Ongoing from this, further development steps are mentioned.

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Julia HannUniversity of Technology Chemnitz

This presentation will introduce the European research project GREENER and show a detailed concept of the DNA origami based single photon source to be developed in this project. This includes the fabrication and characterisation of the layer stack as well as the specially developed DNA origami design and its surface integration as a DNA origami QD hybrid.

Julia HannUniversity of Technology Chemnitz

This presentation will introduce the European research project GREENER and show a detailed concept of the DNA origami based single photon source to be developed in this project. This includes the fabrication and characterisation of the layer stack as well as the specially developed DNA origami design and its surface integration as a DNA origami QD hybrid.

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Elise SaoutieffCEA Leti

1) The cost-effective multi-platform sensing system proposed by FAMOSOS, is based on electrochemical sensing and is able to measure different continuous in-situ soil water nitrogen (N) concentrations, temperature and moisture status using automated data acquisition and wireless Lora data transmission through soil with to better prevent, track and report on soil nutrients and pollutants.

2)The European Horizon project BioSensei concept is built on the development of a microbial whole-cell-based biosensor system with real-time monitoring for detection of pollutants in watercourses. It will be able to monitor typical nutrients (nitrates and phosphates), estrogenic endocrine-disrupters, PFAS (per and polyfluoroalkyl substances) and microcystins.

This work presents an innovative BioSensei bimodal sensing system embedded within a Safe-and-Sustainable-by-Design framework all along the project.

Elise SaoutieffCEA Leti

1) The cost-effective multi-platform sensing system proposed by FAMOSOS, is based on electrochemical sensing and is able to measure different continuous in-situ soil water nitrogen (N) concentrations, temperature and moisture status using automated data acquisition and wireless Lora data transmission through soil with to better prevent, track and report on soil nutrients and pollutants.

2)The European Horizon project BioSensei concept is built on the development of a microbial whole-cell-based biosensor system with real-time monitoring for detection of pollutants in watercourses. It will be able to monitor typical nutrients (nitrates and phosphates), estrogenic endocrine-disrupters, PFAS (per and polyfluoroalkyl substances) and microcystins.

This work presents an innovative BioSensei bimodal sensing system embedded within a Safe-and-Sustainable-by-Design framework all along the project.

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Brendan O'FlynnTyndall National Institute - University College Cork

This publication, as part of the Horizon Europe AURORA project [1] ( https://www.aurora-h2020.eu/ ), describes the development of a low power consumption UltraWide Band (UWB) wireless indoor tracking device focussed on indoor localization of valuable artworks in a museum using wireless sensor network (WSN) technology. AURORA aims to advance the state of the Art in embedded tracking devices for cultural heritage artefacts, striving for minimal impact on the art object.

Brendan O'FlynnTyndall National Institute - University College Cork

This publication, as part of the Horizon Europe AURORA project [1] ( https://www.aurora-h2020.eu/ ), describes the development of a low power consumption UltraWide Band (UWB) wireless indoor tracking device focussed on indoor localization of valuable artworks in a museum using wireless sensor network (WSN) technology. AURORA aims to advance the state of the Art in embedded tracking devices for cultural heritage artefacts, striving for minimal impact on the art object.

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Jain ChackoFraunhofer ENAS

This presentation introduces an innovative approach to simulating damage propagation in power electronic modules, addressing the growing need for reliable assessment methods in an increasingly power electronic-dependent industry. It explores the initial stages of implementing a prognostic health management system, focusing on advanced modeling techniques for solder interface delamination and simulation strategies to monitor chip temperature. The method enables the evaluation of various thermal management strategies and assesses module reliability across different operating conditions. This concept aim to lay the groundwork for more comprehensive and accurate reliability assessment tools in power electronics, ultimately contributing to the development of more robust and efficient power electronic modules for wide range of applications.

Jain ChackoFraunhofer ENAS

This presentation introduces an innovative approach to simulating damage propagation in power electronic modules, addressing the growing need for reliable assessment methods in an increasingly power electronic-dependent industry. It explores the initial stages of implementing a prognostic health management system, focusing on advanced modeling techniques for solder interface delamination and simulation strategies to monitor chip temperature. The method enables the evaluation of various thermal management strategies and assesses module reliability across different operating conditions. This concept aim to lay the groundwork for more comprehensive and accurate reliability assessment tools in power electronics, ultimately contributing to the development of more robust and efficient power electronic modules for wide range of applications.

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Holger Doeringhd Management Consulting GmbH

Ensuring security and comfort in public transportation has become increasingly critical, particularly in the context of the COVID-19 pandemic. Passengers seek not only reliable transportation but also assurance of adequate space and healthy air quality.This presentation introduces a system that measures air quality in buses and trains and transmits the data in real-time to a cloud. Together with occupancy data, it can be determined when certain measures need to be taken during specific pandemic situations. These measures include activating air filtration systems, deploying additional vehicles, and providing data to passengers. Additionally, the system offers various analysis options, enabling the creation of forecasts. The hardware and software components developed for this system can be cost-effectively retrofitted in buses and trains. Public transport companies and transport associations do not need specialized IT infrastructure, because the backend system runs entirely in a cloud. The system was developed as part of the research project Semoove, which was funded by the Federal Ministry for Digital and Transport in Germany.

Holger Doeringhd Management Consulting GmbH

Ensuring security and comfort in public transportation has become increasingly critical, particularly in the context of the COVID-19 pandemic. Passengers seek not only reliable transportation but also assurance of adequate space and healthy air quality.This presentation introduces a system that measures air quality in buses and trains and transmits the data in real-time to a cloud. Together with occupancy data, it can be determined when certain measures need to be taken during specific pandemic situations. These measures include activating air filtration systems, deploying additional vehicles, and providing data to passengers. Additionally, the system offers various analysis options, enabling the creation of forecasts. The hardware and software components developed for this system can be cost-effectively retrofitted in buses and trains. Public transport companies and transport associations do not need specialized IT infrastructure, because the backend system runs entirely in a cloud. The system was developed as part of the research project Semoove, which was funded by the Federal Ministry for Digital and Transport in Germany.

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Katrin UngerSilicon Austria Labs GmbH

The validation of a novel Industrial Internet of Things (IIoT) sensor platform and a dedicated polymer encapsulation process designed to operate reliably in harsh environmental conditions will be presented. Will the device survive the harsh environmental conditions to which it has been exposed?

Katrin UngerSilicon Austria Labs GmbH

The validation of a novel Industrial Internet of Things (IIoT) sensor platform and a dedicated polymer encapsulation process designed to operate reliably in harsh environmental conditions will be presented. Will the device survive the harsh environmental conditions to which it has been exposed?

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Santiago Ferrer JoverThe CT Engineering Group

The automotive industry is rapidly transforming with new technologies, emphasizing smart cities and shared transportation infrastructures. This shift demands a new digital mobility platform. Innovations like AI, IoT, and automation are reshaping business models and promoting coordinated transportation. The vehicle, evolving into an "Internet node on wheels," exchanges data with diverse platforms emphasizing road safety. Addressing these challenges requires cross-disciplinary solutions and methods, ensuring interaction throughout the development process while meeting safety requirements for embedded real-time systems.

Target of the presentation is showing these three core technologies:
Navigation and path planning including robotic platforms.
Artificial Intelligence for high-definition digital maps taking advantage of C-V2X breakthroughs.
...and accident prevention for Vulnerable Road Users (VRUs) connecting vehicles via IoT between them and to the infraestreucture.

All in all improving transportation efficiency, enhancing safety measures, promoting multimodal transport integration, and leveraging advanced technologies to meet the challenges of modern urban mobility by Sea, Land and Air.

Santiago Ferrer JoverThe CT Engineering Group

The automotive industry is rapidly transforming with new technologies, emphasizing smart cities and shared transportation infrastructures. This shift demands a new digital mobility platform. Innovations like AI, IoT, and automation are reshaping business models and promoting coordinated transportation. The vehicle, evolving into an "Internet node on wheels," exchanges data with diverse platforms emphasizing road safety. Addressing these challenges requires cross-disciplinary solutions and methods, ensuring interaction throughout the development process while meeting safety requirements for embedded real-time systems.

Target of the presentation is showing these three core technologies:
Navigation and path planning including robotic platforms.
Artificial Intelligence for high-definition digital maps taking advantage of C-V2X breakthroughs.
...and accident prevention for Vulnerable Road Users (VRUs) connecting vehicles via IoT between them and to the infraestreucture.

All in all improving transportation efficiency, enhancing safety measures, promoting multimodal transport integration, and leveraging advanced technologies to meet the challenges of modern urban mobility by Sea, Land and Air.

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Alessio ViticchiéALPHAWAVES SRL

Our solution presents an AI-driven framework for automating network discovery, device classification, and causal inference in Industrial Control Systems. Using autonomous agents, it enables real-time scanning, unsupervised learning, and process modeling. The approach enhances Digital Twin creation, predictive maintenance, and cybersecurity while addressing challenges like real-time constraints, data sparsity, and security risks.

Alessio ViticchiéALPHAWAVES SRL

Our solution presents an AI-driven framework for automating network discovery, device classification, and causal inference in Industrial Control Systems. Using autonomous agents, it enables real-time scanning, unsupervised learning, and process modeling. The approach enhances Digital Twin creation, predictive maintenance, and cybersecurity while addressing challenges like real-time constraints, data sparsity, and security risks.

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Teemu AlajokiVTT

Photonics is a key enabling technology in the realization of modern medical devices with applications ranging from diagnostics to personalized monitoring. Smart system integration of light sources, integrated optics, advanced packaging, microfluidics etc. is required to meet the tight regulatory requirements. In this talk, perspective of Chips JU project PhotonMed is presented with a focus on multispectral photonic sensor use case.

Teemu AlajokiVTT

Photonics is a key enabling technology in the realization of modern medical devices with applications ranging from diagnostics to personalized monitoring. Smart system integration of light sources, integrated optics, advanced packaging, microfluidics etc. is required to meet the tight regulatory requirements. In this talk, perspective of Chips JU project PhotonMed is presented with a focus on multispectral photonic sensor use case.

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Shubham MulayFraunhofer institute for Electronic Nano System (ENAS) / Technical University of Chemnitz

The presentation focuses on the design, fabrication and characterization of Universal PMUTs.
The work provides a brief introduction to the world of MUTs especially the PMUTs and then dives deep into the universal PMUT technology, mainly focusing on the design, fabrication and characterization of these Universal PMUTs. The unique aspect of this work lies within the adaptive acoustic channels developed implementing the automatic wire bond technology.

Shubham MulayFraunhofer institute for Electronic Nano System (ENAS) / Technical University of Chemnitz

The presentation focuses on the design, fabrication and characterization of Universal PMUTs.
The work provides a brief introduction to the world of MUTs especially the PMUTs and then dives deep into the universal PMUT technology, mainly focusing on the design, fabrication and characterization of these Universal PMUTs. The unique aspect of this work lies within the adaptive acoustic channels developed implementing the automatic wire bond technology.

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Johannes WieczorekFraunhofer IIS

This presentation adresses the carbon footprint of self-powered wireless sensors. The power supply by a battery is compared with different solutions of using ambient energies (energy harvesting) in terms of sustainability.

Johannes WieczorekFraunhofer IIS

This presentation adresses the carbon footprint of self-powered wireless sensors. The power supply by a battery is compared with different solutions of using ambient energies (energy harvesting) in terms of sustainability.

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Mathis JanßenUniversity of Technology Chemnitz

We investigated factors influencing the stability of DNA origami assemblies, with a focus on their potential integration into smart micro- and nanoscale devices. In this study, the stability of DO structures in PBS based buffers is investigated for the first time. Decrease in structureconcentration over time as well as the occurence of defects are documented. Occuring defects were classified and a connection to simulation data was drawn. Furthermore, the 4 key methods to evaluate DO quality are presented.

Mathis JanßenUniversity of Technology Chemnitz

We investigated factors influencing the stability of DNA origami assemblies, with a focus on their potential integration into smart micro- and nanoscale devices. In this study, the stability of DO structures in PBS based buffers is investigated for the first time. Decrease in structureconcentration over time as well as the occurence of defects are documented. Occuring defects were classified and a connection to simulation data was drawn. Furthermore, the 4 key methods to evaluate DO quality are presented.

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Cedric Jeff Murage MwangiKenyatta University

The presentation explores a wearable device using multi-modal sensors (EEG, PPG, accelerometers) and machine learning (CNN, RNN, SVM) for real-time seizure detection. By integrating IoT and cloud computing, the system improves accuracy, reduces false alarms, and enables remote monitoring. This innovation enhances patient safety, autonomy, and healthcare efficiency for epilepsy management.

Cedric Jeff Murage MwangiKenyatta University

The presentation explores a wearable device using multi-modal sensors (EEG, PPG, accelerometers) and machine learning (CNN, RNN, SVM) for real-time seizure detection. By integrating IoT and cloud computing, the system improves accuracy, reduces false alarms, and enables remote monitoring. This innovation enhances patient safety, autonomy, and healthcare efficiency for epilepsy management.

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Christian SchottTechnische Universität Chemnitz

Test program development is time-consuming and lacks direct integration with design and verification workflows. Key aspect is the use of SysMLv2 as a connector between the design side—covering system abstraction, requirements, and technical specifications—and the test side, which includes test descriptions, test patterns, and execution models. This coupling intends faster test development by reducing manual steps and thus avoiding errors.

Christian SchottTechnische Universität Chemnitz

Test program development is time-consuming and lacks direct integration with design and verification workflows. Key aspect is the use of SysMLv2 as a connector between the design side—covering system abstraction, requirements, and technical specifications—and the test side, which includes test descriptions, test patterns, and execution models. This coupling intends faster test development by reducing manual steps and thus avoiding errors.

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Sanaz GhazaviChemnitz University of Technology (TU Chemnitz)

This presentation introduces a customized SysML v2 Profile for model-driven circuit test development (MDCTD). The profile intends to streamline test program creation, reduce effort and time, and ensure indepedence from specific Automatic Test Equipment (ATE). The approach involves the modeling of test setup and test methods within SysML v2, leveraging modular structure for reusablity and flexibility.

Sanaz GhazaviChemnitz University of Technology (TU Chemnitz)

This presentation introduces a customized SysML v2 Profile for model-driven circuit test development (MDCTD). The profile intends to streamline test program creation, reduce effort and time, and ensure indepedence from specific Automatic Test Equipment (ATE). The approach involves the modeling of test setup and test methods within SysML v2, leveraging modular structure for reusablity and flexibility.

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Stefan KaranovicAVL List GmbH

The presentation highlights the development of advanced current measurement sensors using multi-material Additive Manufacturing. These sensors handle high currents up to 1000A and operate under varying conditions, including high bandwidths and temperature variations. Early research shows successful production of components with excellent conductivity and strength, demonstrating the high potential of AM-enabled measurement systems for modern mobility and sustainable energy applications.

Stefan KaranovicAVL List GmbH

The presentation highlights the development of advanced current measurement sensors using multi-material Additive Manufacturing. These sensors handle high currents up to 1000A and operate under varying conditions, including high bandwidths and temperature variations. Early research shows successful production of components with excellent conductivity and strength, demonstrating the high potential of AM-enabled measurement systems for modern mobility and sustainable energy applications.

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Martijn GoedbloedFraunhofer EMFT, Munich

Upscaling of superconducting qubit based quantum computers will require an alternative for standard coax cables. Here we present a new fabrication route for polyimide- and niobium-based flex lines with a high density of shielded transmission lines, together with a space saving direct-PCB connector. Our concept relies on full roll-to-roll processing with digital maskless lithography, eliminating any limitation to the length of the flexible cables.

Martijn GoedbloedFraunhofer EMFT, Munich

Upscaling of superconducting qubit based quantum computers will require an alternative for standard coax cables. Here we present a new fabrication route for polyimide- and niobium-based flex lines with a high density of shielded transmission lines, together with a space saving direct-PCB connector. Our concept relies on full roll-to-roll processing with digital maskless lithography, eliminating any limitation to the length of the flexible cables.

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Harshita SharmaFraunhofer Institute for Electronic Nano Systems (ENAS)

The MasterCurveCreator tool represents a significant advancement in the characterization of viscoelastic materials, addressing the complexities associated with generating master curves. By automating the processes of data manipulation and the calculation of temperature-dependent shift factors, this innovative tool effectively reduces the manual effort typically required and minimizes the potential for human error. One of the core principles utilized by the MasterCurveCreator is the Time-Temperature Superposition (TTS) principle. TTS allows for the alignment of viscoelastic property data obtained at different temperatures, enabling researchers to create a single, cohesive master curve that represents material behavior across a wide range of conditions. This comprehensive characterization is essential for understanding the performance of viscoelastic materials in real-world applications, such as in the automotive, aerospace, and civil engineering industries, where materials are subjected to varying temperatures and loading frequencies. The tool not only simplifies the data alignment process but also facilitates the deduction of Prony series coefficients, which are vital for accurately modeling the time-dependent behavior of viscoelastic materials. The Prony series provides a flexible mathematical representation that captures the complex viscoelastic responses of materials, allowing for better predictions of their behavior under different stress and strain conditions.

Harshita SharmaFraunhofer Institute for Electronic Nano Systems (ENAS)

The MasterCurveCreator tool represents a significant advancement in the characterization of viscoelastic materials, addressing the complexities associated with generating master curves. By automating the processes of data manipulation and the calculation of temperature-dependent shift factors, this innovative tool effectively reduces the manual effort typically required and minimizes the potential for human error. One of the core principles utilized by the MasterCurveCreator is the Time-Temperature Superposition (TTS) principle. TTS allows for the alignment of viscoelastic property data obtained at different temperatures, enabling researchers to create a single, cohesive master curve that represents material behavior across a wide range of conditions. This comprehensive characterization is essential for understanding the performance of viscoelastic materials in real-world applications, such as in the automotive, aerospace, and civil engineering industries, where materials are subjected to varying temperatures and loading frequencies. The tool not only simplifies the data alignment process but also facilitates the deduction of Prony series coefficients, which are vital for accurately modeling the time-dependent behavior of viscoelastic materials. The Prony series provides a flexible mathematical representation that captures the complex viscoelastic responses of materials, allowing for better predictions of their behavior under different stress and strain conditions.

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Tino Jäger X-FAB MEMS Foundry GmbH

Within the presentation " Wafel Level Technologies for System Integration" the D2W integration technology Micro-Transfer Printing will be introduced and recent developments at X-FAB will be highlighted. In this context, more details on I) the preparation of transferable µASICs, II) the wafer-level die integration itself and III) subsequent metallization via Cu-RDL will be shared. In addition, Through-Silicon Vias and capabilities of varied Bonding Technologies are shown.

Tino Jäger X-FAB MEMS Foundry GmbH

Within the presentation " Wafel Level Technologies for System Integration" the D2W integration technology Micro-Transfer Printing will be introduced and recent developments at X-FAB will be highlighted. In this context, more details on I) the preparation of transferable µASICs, II) the wafer-level die integration itself and III) subsequent metallization via Cu-RDL will be shared. In addition, Through-Silicon Vias and capabilities of varied Bonding Technologies are shown.

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Luca SavioLutech Softjam
Luca SavioLutech Softjam
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Maximilian LippoldTechnische Universität Bergakademie Freiberg

A hydrogel-coated capacitive pressure sensor (Infineon DPS422) is investigated as a novel humidity sensor. The thermo-responsive pNiPMAAm hydrogel was drop-coated, causing membrane deformation upon swelling, which is read out capacitively. Initial tests show fast response times. Future work will focus on optimizing the coating process and evaluating long-term stability.

Maximilian LippoldTechnische Universität Bergakademie Freiberg

A hydrogel-coated capacitive pressure sensor (Infineon DPS422) is investigated as a novel humidity sensor. The thermo-responsive pNiPMAAm hydrogel was drop-coated, causing membrane deformation upon swelling, which is read out capacitively. Initial tests show fast response times. Future work will focus on optimizing the coating process and evaluating long-term stability.

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Avik SettTU Delft

Real-time pH and oxygen concentration sensing is critical for monitoring tissue damage and organ health; however, there is no report to date on a single device in such context that can simultaneously detect both pH and oxygen changes. This work reports the development of a single optical sensor device that can simultaneously and reversibly respond to changes in both pH and oxygen concentration. The proposed optical sensor integrates both pH and oxygen sensitive probes, and is optimized to achieve minimal cross sensitivity during simultaneous measurements. This approach enables high accuracy in early detection of chemical correlates of tissue or organ damage, improving screening and efficacy in organ transplants.

Avik SettTU Delft

Real-time pH and oxygen concentration sensing is critical for monitoring tissue damage and organ health; however, there is no report to date on a single device in such context that can simultaneously detect both pH and oxygen changes. This work reports the development of a single optical sensor device that can simultaneously and reversibly respond to changes in both pH and oxygen concentration. The proposed optical sensor integrates both pH and oxygen sensitive probes, and is optimized to achieve minimal cross sensitivity during simultaneous measurements. This approach enables high accuracy in early detection of chemical correlates of tissue or organ damage, improving screening and efficacy in organ transplants.

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Joris LiebermannFraunhofer IIS/EAS

Proper mounting is crucial for accurate acceleration measurements with MEMS sensors. This research investigates whether MEMS accelerometers are capable of assessing their mounting integrity and detecting loose bolts when attached to 3D-printed fixtures. Effects of loose mountings on vibration transmission were captured using a laser vibrometer, and a support vector machine classified MEMS data to reliably identify mounting faults.

Joris LiebermannFraunhofer IIS/EAS

Proper mounting is crucial for accurate acceleration measurements with MEMS sensors. This research investigates whether MEMS accelerometers are capable of assessing their mounting integrity and detecting loose bolts when attached to 3D-printed fixtures. Effects of loose mountings on vibration transmission were captured using a laser vibrometer, and a support vector machine classified MEMS data to reliably identify mounting faults.

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Julia WeckerFraunhofer-Institut for Electronic Nano Systems ENAS

The presentation describes the progress towards processes for design, fabrication and wafer level characterization of photonic integrated functionalities based on silicon nitride and aluminum nitride. Passive photonic components like waveguides, couplers and ring resonators are designed with the aim to combine them with standard MEMS processes.

Julia WeckerFraunhofer-Institut for Electronic Nano Systems ENAS

The presentation describes the progress towards processes for design, fabrication and wafer level characterization of photonic integrated functionalities based on silicon nitride and aluminum nitride. Passive photonic components like waveguides, couplers and ring resonators are designed with the aim to combine them with standard MEMS processes.

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Martin LehmannFraunhofer IIS/EAS

Anomaly detection in vibration signals is vital for condition monitoring in industrial and structural health applications. This study evaluates cost-effective, energy-efficient smart sensors combining MEMS accelerometers with microcontrollers against a laboratory setup. Two platforms --Arduino Nano 33 BLE and Analog Devices MAX78000 --were assessed for performance, energy consumption, and real-time anomaly detection feasibility. Results indicate that all embedded systems achieve accuracy comparable to the reference setup. Notably, the MAX78000 offers superior inference speed and processing capabilities with a modest energy trade-off. Integrated micro-electromechanical systems (MEMS) and microcontroller solutions prove to be viable, scalable alternatives for on-site condition monitoring

Martin LehmannFraunhofer IIS/EAS

Anomaly detection in vibration signals is vital for condition monitoring in industrial and structural health applications. This study evaluates cost-effective, energy-efficient smart sensors combining MEMS accelerometers with microcontrollers against a laboratory setup. Two platforms --Arduino Nano 33 BLE and Analog Devices MAX78000 --were assessed for performance, energy consumption, and real-time anomaly detection feasibility. Results indicate that all embedded systems achieve accuracy comparable to the reference setup. Notably, the MAX78000 offers superior inference speed and processing capabilities with a modest energy trade-off. Integrated micro-electromechanical systems (MEMS) and microcontroller solutions prove to be viable, scalable alternatives for on-site condition monitoring

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Dennis HemkerFraunhofer FIT - Application Center SYMILA

In this talk we show how we built a modular AI platform based on open-source tools and existing software. One of the major aims was to retain full control over the process at any point to meet unforseen requirements. Furthermore, third-party cloud dependencies should be avoided to handle even confidential data or deliver trained models on-premise. Finally, two use cases from electronic systems domain are implemented within the proposed architecture.

Dennis HemkerFraunhofer FIT - Application Center SYMILA

In this talk we show how we built a modular AI platform based on open-source tools and existing software. One of the major aims was to retain full control over the process at any point to meet unforseen requirements. Furthermore, third-party cloud dependencies should be avoided to handle even confidential data or deliver trained models on-premise. Finally, two use cases from electronic systems domain are implemented within the proposed architecture.

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Jad MaaloulyFraunhofer FIT

The presentation focuses on pre-processing techniques designed to enhance the accuracy and robustness of an AI model. The data used includes both simulated and real far-field measurements. Before the data can be utilized effectively, it must undergo several transformations, such as noise reduction, augmentation, and feature extraction.

Jad MaaloulyFraunhofer FIT

The presentation focuses on pre-processing techniques designed to enhance the accuracy and robustness of an AI model. The data used includes both simulated and real far-field measurements. Before the data can be utilized effectively, it must undergo several transformations, such as noise reduction, augmentation, and feature extraction.

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Carolin ZachäusVDI/VDE Innovation + Technik GmbH

The transition to a circular economy is key to sustainable automotive innovation. The Horizon Europe-funded UNICORN project advances functional electronics as enabler for circular mobility. This presentation outlines a vision and roadmap for integrating printed and flexible electronics, enhancing modularity, reparability, and material recovery. It highlights key pathways, lifecycle impacts, and policy recommendations for sustainable transformation.

Carolin ZachäusVDI/VDE Innovation + Technik GmbH

The transition to a circular economy is key to sustainable automotive innovation. The Horizon Europe-funded UNICORN project advances functional electronics as enabler for circular mobility. This presentation outlines a vision and roadmap for integrating printed and flexible electronics, enhancing modularity, reparability, and material recovery. It highlights key pathways, lifecycle impacts, and policy recommendations for sustainable transformation.

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Chang-Hua LinNational Taiwan University of Science and Technology

# This paper presents the development of a cloud-based monitoring system for a DC microgrid designed for community applications.
# The system integrates a simulated utility grid (SUGS), a battery energy storage system (BESS), and a solar power generation system (SPGS) with a cloud-based front-end monitoring interface.
# A Long Short-Term Memory (LSTM) model is employed to forecast the subsequent day's load curve, while a solar simulator replicates diurnal variations in solar irradiance.
# To optimize economic performance under peak and off-peak time-of-use (TOU) pricing regimes, a greedy algorithm is implemented via a local selection strategy to allocate energy optimally among the SUGS, BESS, and SPGS.
# Finally, the economic viability and technical feasibility of the proposed approach are verified through a derating case study comprising both simulations and experiments.

Chang-Hua LinNational Taiwan University of Science and Technology

# This paper presents the development of a cloud-based monitoring system for a DC microgrid designed for community applications.
# The system integrates a simulated utility grid (SUGS), a battery energy storage system (BESS), and a solar power generation system (SPGS) with a cloud-based front-end monitoring interface.
# A Long Short-Term Memory (LSTM) model is employed to forecast the subsequent day's load curve, while a solar simulator replicates diurnal variations in solar irradiance.
# To optimize economic performance under peak and off-peak time-of-use (TOU) pricing regimes, a greedy algorithm is implemented via a local selection strategy to allocate energy optimally among the SUGS, BESS, and SPGS.
# Finally, the economic viability and technical feasibility of the proposed approach are verified through a derating case study comprising both simulations and experiments.

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Cecilia Jimenez-JorqueraInstitut de Microelectrònica de Barcelona (IMB-CNM) CSIC

We propose the development of smart biochemical sensing technologies for the detection of water pollutants (e.g. nutrients) online, embedding powerful data fusion tools based on neural networks to achieve a predictive system for on-line water quality monitoring. Sensor signals are treated with neuromorphic electronics integrated in silicon chips, being therefore robust, miniaturizable and scalable in its production.

Cecilia Jimenez-JorqueraInstitut de Microelectrònica de Barcelona (IMB-CNM) CSIC

We propose the development of smart biochemical sensing technologies for the detection of water pollutants (e.g. nutrients) online, embedding powerful data fusion tools based on neural networks to achieve a predictive system for on-line water quality monitoring. Sensor signals are treated with neuromorphic electronics integrated in silicon chips, being therefore robust, miniaturizable and scalable in its production.

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Diing Shenp AngNanyang Technological University Singapore

Edge computing systems urgently require innovative solutions for rapid processing of complex multidimensional AI data so as to minimize latency. In this presentation, we will show that electronic traps in the gate oxide of a logic Si transistor, previously deemed undesirable and suppressed during every technology cycle development, may be harnessed for the computation of spatiotemporal signals in real time. We will present a case study showing the prospects of how a simple array of logic Si transistors may completely bridge the gap between a dynamic vision sensor and established light weight models (e.g., ResNet) already developed for static image data.

Diing Shenp AngNanyang Technological University Singapore

Edge computing systems urgently require innovative solutions for rapid processing of complex multidimensional AI data so as to minimize latency. In this presentation, we will show that electronic traps in the gate oxide of a logic Si transistor, previously deemed undesirable and suppressed during every technology cycle development, may be harnessed for the computation of spatiotemporal signals in real time. We will present a case study showing the prospects of how a simple array of logic Si transistors may completely bridge the gap between a dynamic vision sensor and established light weight models (e.g., ResNet) already developed for static image data.

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Roy KnechtelSchmalkalden University of Applied Sciences

Wafer bonding, the process of stacking and joining processed substrates, is a key step in MEMS manufacturing and smart systems integration. It enables the realization of 3-dimensional chip structures for protecting, sealing and completion of MEMS and their integration with CMOS driving and signal processing electronics. In recent years, the requirements on wafer bonding technologies increased. The main aspects are: smaller bond frame sizes to enable smaller chips for mobile applications, but more importantly cost reductions, high vacuum sealing and electrical contacts between the wafers. On the one hand, established wafer bonding processes such as glass frit bonding are reaching their limits. On the other hand, the introduction of novel wafer bonding processes in production lines is very challenging. This study was carried out to identify the most suitable wafer bonding process for different applications in a wafer foundry. 

Roy KnechtelSchmalkalden University of Applied Sciences

Wafer bonding, the process of stacking and joining processed substrates, is a key step in MEMS manufacturing and smart systems integration. It enables the realization of 3-dimensional chip structures for protecting, sealing and completion of MEMS and their integration with CMOS driving and signal processing electronics. In recent years, the requirements on wafer bonding technologies increased. The main aspects are: smaller bond frame sizes to enable smaller chips for mobile applications, but more importantly cost reductions, high vacuum sealing and electrical contacts between the wafers. On the one hand, established wafer bonding processes such as glass frit bonding are reaching their limits. On the other hand, the introduction of novel wafer bonding processes in production lines is very challenging. This study was carried out to identify the most suitable wafer bonding process for different applications in a wafer foundry. 

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Joana GomesCentre for Nanotechnology and Smart Materials (CeNTI)

The presentation will begin with a brief description of CeNTI, highlighting the different research departments, as well as the technological areas and focuses. This will be followed by an overview of the Illiance project, and subsequently, the iPower subproject. Within the iPower subproject, various technologies are under development. An update on the progress of these developments will be provided, and the results achieved will be presented.

Joana GomesCentre for Nanotechnology and Smart Materials (CeNTI)

The presentation will begin with a brief description of CeNTI, highlighting the different research departments, as well as the technological areas and focuses. This will be followed by an overview of the Illiance project, and subsequently, the iPower subproject. Within the iPower subproject, various technologies are under development. An update on the progress of these developments will be provided, and the results achieved will be presented.

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Veiko RütterTallinn University of Technology

Image-based detection is vital to a range of droplet microfluidics applications in biotechnology. A high enough image resolution and throughput in terms of framerate are necessary to capture and analyze droplet formation. In this work we demonstrate a setup based on a low-cost camera chip and FPGA to achieve an imaging throughput of ~150 fps at a resolution adequate to visualize individual droplets.

Veiko RütterTallinn University of Technology

Image-based detection is vital to a range of droplet microfluidics applications in biotechnology. A high enough image resolution and throughput in terms of framerate are necessary to capture and analyze droplet formation. In this work we demonstrate a setup based on a low-cost camera chip and FPGA to achieve an imaging throughput of ~150 fps at a resolution adequate to visualize individual droplets.

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Franz SelbmannFraunhofer Institute for Electronic Nano Systems ENAS

The presentation provides an overview about Parylene as a memristive material to establish memristors that can be directly integrated into the previously developed ultra-thin Parylene based packaging platform for flexible smart systems. Particularly, memristive test architectures used for the detailed analysis of the impact of the different parameters on the memristive properties are presented.

Franz SelbmannFraunhofer Institute for Electronic Nano Systems ENAS

The presentation provides an overview about Parylene as a memristive material to establish memristors that can be directly integrated into the previously developed ultra-thin Parylene based packaging platform for flexible smart systems. Particularly, memristive test architectures used for the detailed analysis of the impact of the different parameters on the memristive properties are presented.

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Kianoush RasselsTU Delft

Bio-Remote Sensing in Real-Time Thermographic Face Detection and Respiratory Rate Measurement

Kianoush RasselsTU Delft

Bio-Remote Sensing in Real-Time Thermographic Face Detection and Respiratory Rate Measurement

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Ferdinand HeinrichFraunhofer EMFT

We present a software tool for testing federated learning when data is limited. The key idea is to use data augmentation to artificially create multiple non-IID client datasets. This can then be used to test how different the client data can be for federated learning to still work. And which fedarted aggregation strategy best works with the challenges of the dataset.

Ferdinand HeinrichFraunhofer EMFT

We present a software tool for testing federated learning when data is limited. The key idea is to use data augmentation to artificially create multiple non-IID client datasets. This can then be used to test how different the client data can be for federated learning to still work. And which fedarted aggregation strategy best works with the challenges of the dataset.

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Torsten ThiemeDEAXO GmbH

Advanced micro integration technologies for fabrication of micro-ion-traps for a trapped-ion quantum computer

Torsten ThiemeDEAXO GmbH

Advanced micro integration technologies for fabrication of micro-ion-traps for a trapped-ion quantum computer

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Abdul RahimEcosystem Manager

The integrated photonics industry focuses on combining photonic functions onto a single chip to enhance optical communication, imaging, and computing. Its success relies on a collaborative ecosystem involving academic research, industry partnerships, government support, and infrastructure development. This talk will explore how ecosystems like PhotonDelta contribute to this growth through stakeholder collaboration, scalable manufacturing, and support for startups. We will also address current challenges in the PIC industry and proactive initiatives for a brighter future in photonic integration.

Abdul RahimEcosystem Manager

The integrated photonics industry focuses on combining photonic functions onto a single chip to enhance optical communication, imaging, and computing. Its success relies on a collaborative ecosystem involving academic research, industry partnerships, government support, and infrastructure development. This talk will explore how ecosystems like PhotonDelta contribute to this growth through stakeholder collaboration, scalable manufacturing, and support for startups. We will also address current challenges in the PIC industry and proactive initiatives for a brighter future in photonic integration.

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Fazeel ZohairFinetech GmbH & Co. KG

Indium bump interconnect technology

Fazeel ZohairFinetech GmbH & Co. KG

Indium bump interconnect technology

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Michael JankFraunhofer Institute for Integrated Systems and Device Technology IISB

The presentation summarizes our work on flexible large-area pressure sensors for integration with battery cells. Together with temperature sensors and combined in an array matrix, they allow for health monitoring of individual cells and avoidance of critical failures. The optimization of a piezoresistive functional layer processed by drop casting gives an insight in process development and technological integration.

Michael JankFraunhofer Institute for Integrated Systems and Device Technology IISB

The presentation summarizes our work on flexible large-area pressure sensors for integration with battery cells. Together with temperature sensors and combined in an array matrix, they allow for health monitoring of individual cells and avoidance of critical failures. The optimization of a piezoresistive functional layer processed by drop casting gives an insight in process development and technological integration.

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Mujdat SoyturkMarmara University

High-Fidelity Synthetic Data-Driven Machine Learning Framework for Predictive Maintenance of Three-Phase Industrial Motors

Generative Pattern Learning for Missing Sensor Data Imputation in Industrial IoT

Mujdat SoyturkMarmara University

High-Fidelity Synthetic Data-Driven Machine Learning Framework for Predictive Maintenance of Three-Phase Industrial Motors

Generative Pattern Learning for Missing Sensor Data Imputation in Industrial IoT

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Conference Chairs

  • Harald Kuhn, Institute Director Fraunhofer ENAS
  • Wolfgang Dettmann, Vice President R&D Funding,
    Infineon Technologies (Acting)
  • Milan Semmler, Vice President of Czech National Semiconductor Cluster (z.s.)
  • Radek Holy (Vice rector, Czech Technical University in Prague (CTU) and Vice President of Czech National Semiconductor Cluster (z.s.)

Core team

The conference is prepared by a core team of high-ranking experts from industry as well as from basic and applied research organisations:

  • Boisseau Sébastien, Univ. Grenoble Alpes, CEA, Leti
  • Sywert Brongersma, IMEC
  • Wolfgang Dettmann, Infineon Technologies AG
  • Adrian Dinescu, IMT Bucharest
  • Albrecht Donat, Siemens AG
  • Luis Fonseca, Centro Nacional de Microelectronica (CNM-IMB)
  • Jens Förstner, Uni Paderborn
  • Paddy French, TU Delft
  • Francesco Gennaro, STMicroelectronics
  • Thomas Hammer, Siemens Erlangen
  • Christian Hedayat, Fraunhofer ENAS
  • Ulrich Heinkel, Chemnitz University of Technology, ZfM
  • Karla Hiller, Chemnitz University of Technology
  • Antonio Imbruglia, STMicroelectronics
  • Michael Jank, Technology IISB
  • Yvonne Joseph, TU Bergakademie Freiberg
  • Norman Kachel, B. Braun Melsungen AG
  • Jyrki Kiihamäki, VTT
  • Christoph Koegler, Infineon Technologies AG
  • Matthias Kühnel, Robert Bosch GmbH
  • Steffen Kurth, Fraunhofer ENAS
  • Jan Langer, Fraunhofer ENAS
  • Antonio Lionetto, STMicroelectronics
  • Kari Mäki , VTT Technical Research Centre of Finland Ltd.
  • Harald Mathis, Fraunhofer-Institut für Angewandte Informationstechnik FIT
  • Dirk Mayer, Fraunhofer EAS – Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EAS
  • Harald Pötter, Fraunhofer IZM
  • Parvaneh Rahimi, TU Freiberg
  • Sven Rzepka, Fraunhofer ENAS
  • Michael Scholles, Fraunhofer IPMS
  • Stefan Schulz, Fraunhofer ENAS
  • Han Shao, Tyndall
  • Yukio Suzuki, Tohoku University
  • Bart Vandevelde, IMEC
  • Bernhard Wunderle, Chemnitz University of Technology

Testimonials

Voices from our conference chairs as well as core team members and reasons for you to attend SSI!

Thomas Otto
Thomas OttoFraunhofer ENAS

Smart systems are the key to meet tomorrow's challenges in all aspects of life. Attend the main European conference in this field - the Smart Systems Integration Conference and Exhibition.

Stefan Finkbeiner
Stefan FinkbeinerEPoSS/ Bosch Sensortec

Digitization is not only increasingly entering our lifes, it is a real game changer! There will be not only advances in individual components and subsystems necessary, especially connectivity and implementation of intelligence “at the edge” integrated in smart modules and systems will be the key. To be successful in future, interdisciplinary approaches are required more than ever.

Rainer Günzler
Rainer GünzlerHahn-Schickard

“A side effect of Corona is the breakthrough of point-of-care diagnostics based on microfluidics.”

Thomas Hammer
Thomas HammerSiemens

“Smart system integration is key to highly automated distribution grids coupling the energy sector with mobility, industry & domestic use. At SSI 2023 you can meet the experts for discussing your interdisciplinary challenge!”

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