Conference venue

The Bruges Meeting & Convention Centre (BMCC)
Beursplein 1, 8000 Brugge
www.bmccbruges.com


Programme 2023

The current conference programme is available for you to download!

  • Conference Day 1 March 28, 2023
  • Conference Day 2 March 29, 2023
  • Conference Day 3 March 30, 2023
  • Central
  • Meeting 6
  • Meeting 7-8
Registration
08:00 AMRegistration
09:00 AM - 07:00 PM21st European Advanced Process Control and Manufacturing (apc|m) Conference

Co-located conference (Your SSI ticket is also valid for the apc|m conference.)
For more information, please click here: Home – APCM europe (apcm-europe.eu)

12:00 PM - 08:00 PMEPoSS Pre-event (only for EPoSS members)

separate registration is required

will take place in Meeting 6 and 7-8 – Level 3

see tab “Meeting 6” and “Meeting 7-8”

01:30 PM - 07:00 PMPoster and Exhibition
Registration & Lunch
12:00 PM - 01:00 PMRegistration & Lunch

takes place in front of Meeting 6 and Meeting 7-8

WG Transportation
01:00 PM - 01:45 PMWG Transportation
WG Food, Agriculture and Natural Resources
01:45 PM - 02:30 PMWG Food, Agriculture and Natural Resources
Coffee Break
02:30 PM - 03:00 PMCoffee Break

takes place in front of Meeting 6 and Meeting 7-8

WG Green ECS
03:00 PM - 03:45 PMWG Green ECS
WG AI at the Edge
03:45 PM - 04:30 PMWG AI at the Edge
Coffee Break
04:30 PM - 04:45 PMCoffee Break

takes place in front of Meeting 6 and Meeting 7-8

KeyTech: ECS SRIA 2024; TF Adv. Packaging (CSA)
04:45 PM - 06:00 PMKeyTech: ECS SRIA 2024; TF Adv. Packaging (CSA)
EPoSS Dinner
07:30 PMEPoSS Dinner
Registration & Lunch
12:00 PM - 01:00 PMRegistration & Lunch

takes place in front of Meeting 6 and Meeting 7-8

WG Healthy Living
01:00 PM - 01:45 PMWG Healthy Living
WG Factory Automation
01:45 PM - 02:30 PMWG Factory Automation
Coffee Break
02:30 PM - 03:00 PMCoffee Break

takes place in front of Meeting 6 and Meeting 7-8

TF EDIH
03:00 PM - 03:45 PMTF EDIH
WG Energie
03:45 PM - 04:30 PMWG Energie
Coffee Break
04:30 PM - 04:45 PMCoffee Break

takes place in front of Meeting 6 and Meeting 7-8

EPoSS Dinner
07:30 PMEPoSS Dinner
  • Central
  • Poster pitches
  • Meeting 4&5
  • Auditorium A
Registration & Come together
08:00 AMRegistration & Come together
Keynote-Session
08:50 AM - 10:40 AMKeynote-Session By Chairs: Wolfgang Dettmann, Thomas Otto, Harald Kuhn

will take place in Auditorium 1 – Level 1

Welcome & Opening
08:50 AM - 09:10 AMWelcome & Opening By Thomas Otto, Harald Kuhn & Wolfgang Dettmann
Keynote: Chips4EU initiative – Pilot lines and regional investments
09:10 AM - 09:40 AMKeynote: Chips4EU initiative – Pilot lines and regional investments By Francisco IbanezEuropean Commission
Keynote: 3D System Integration Technology: enabling Heterogenous System Scaling
09:40 AM - 10:10 AMKeynote: 3D System Integration Technology: enabling Heterogenous System Scaling By Eric BeyneIMEC
Keynote: Neural implants go small, smart and flexible
10:10 AM - 10:40 AMKeynote: Neural implants go small, smart and flexible By Wouter SerdijnTU Delft
Coffee break
10:40 AM - 11:10 AMCoffee break
Presentations
11:00 AM - 12:15 PMPresentations

see tab “Auditorium 1” and “Meeting 4&5”

Lunch break + 7 poster pitches Track I
12:30 PM - 02:00 PMLunch break + 7 poster pitches Track I

see tab “Poster pitches”

Presentations
02:00 PM - 03:30 PMPresentations

see tab “Auditorium 1” and “Meeting 4&5”

Coffee break
03:30 PM - 04:00 PMCoffee break
13 Poster pitches Track II + networking + coffee
04:00 PM - 04:30 PM13 Poster pitches Track II + networking + coffee

see tab “Poster pitches”

Presentations
04:30 PM - 06:05 PMPresentations

see tab “Auditorium 1” and “Meeting 4&5”

06:15 PMConference dinner

Walk to Conference dinner @de halve maan

09:00 AM - 06:00 PM21st European Advanced Process Control and Manufacturing (apc|m) Conference

Co-located conference (Your SSI ticket is also valid for the apc|m conference.)

For more information, please click here: Home – APCM europe (apcm-europe.eu)

Poster pitches part 1
01:45 PM - 02:00 PMPoster pitches part 1

Chairs: Thomas Blaudeck & Christian Wagner

Hollow microneedle fabrication and characterization for interstitial fluid extraction in minimally invasive sensors
01:45 PM - 01:47 PMHollow microneedle fabrication and characterization for interstitial fluid extraction in minimally invasive sensors By Tom EnderleinFraunhofer ENAS

Track 1 // Poster Island: 1

Microfabricated three-electrode system integrated with an enzyme-like nanomaterial for the detection of phenolic compounds
01:47 PM - 01:49 PMMicrofabricated three-electrode system integrated with an enzyme-like nanomaterial for the detection of phenolic compounds By Livia DinuNational Institute of Research and Development for Microtechnology

Track 1 // Poster Island: 1

Doping effect of nitrogen on nano-crystalline graphite films over the electrochemical sensing properties
01:49 PM - 01:52 PMDoping effect of nitrogen on nano-crystalline graphite films over the electrochemical sensing properties By Marius StoianIMT Bucharest

Track 1 // Poster Island: 1

Chemoresistive sensors arrays for Smart Agriculture applications
01:52 PM - 01:54 PMChemoresistive sensors arrays for Smart Agriculture applications By Pachiu CristinaIMT Bucharest

Track 1 // Poster Island: 1

Surface acoustic wave sensors based on molecularly imprinted biopolymer for environmental applications
01:54 PM - 01:56 PMSurface acoustic wave sensors based on molecularly imprinted biopolymer for environmental applications By Angela BaracuIMT Bucharest

Track 1 // Poster Island: 1

Modelling and Characterization of an Electro-Thermal MEMS Device for Gas Properties Determination
01:56 PM - 01:58 PMModelling and Characterization of an Electro-Thermal MEMS Device for Gas Properties Determination By Philipp RaimannHahn-Schickard research

Track 1 // Poster Island: 1

Carbon based printed thermoelectric generator on paper for cold-chain monitoring
01:58 PM - 02:00 PMCarbon based printed thermoelectric generator on paper for cold-chain monitoring By Lorenzo PimpolariInstitute of Microelectronics of Barcelona

Track 1 // Poster Island: 1

Poster pitches part 2
04:00 PM - 04:30 PMPoster pitches part 2

Chairs: Bart Vandevelde & Wolfgang Dettmann

Design and analysis of Power aware IoT wireless sensor nodes for structural-health and asset-monitoring applications
04:00 PM - 04:02 PMDesign and analysis of Power aware IoT wireless sensor nodes for structural-health and asset-monitoring applications By Eoin AhernTyndall National Institute, University College Cork

Track 2 // Poster Island: 2

Broadband Far-Field Estimation of a Spherical Dipole using Near-Field Scanning Data up to 1 GHz
04:02 PM - 04:04 PMBroadband Far-Field Estimation of a Spherical Dipole using Near-Field Scanning Data up to 1 GHz By Dominik SchröderFraunhofer ENAS

Track 2 // Poster Island: 2

WORKER4.0: a new concept of textile exoskeleton to support industrial processes
04:04 PM - 04:06 PMWORKER4.0: a new concept of textile exoskeleton to support industrial processes By José SalgadoCeNTI - Centre for Nanotechnology and Smart Materials

Track 2 // Poster Island: 5

CAD2DETECT: on the use of synthetic data generation for multi-object detection and tracking
04:06 PM - 04:08 PMCAD2DETECT: on the use of synthetic data generation for multi-object detection and tracking By Taoufik BourganaFlanders Make

Track 2 // Poster Island: 5

CAD2POSE – Overview of a pipeline for object detection and pose estimation for use in industrial applications.
04:08 PM - 04:10 PMCAD2POSE – Overview of a pipeline for object detection and pose estimation for use in industrial applications. By Joris de HoogFlanders Make

Track 3 // Poster Island: 5

CAD2DEFECT, an end-to-end defect detection pipeline for use in the manufacturing industry
04:10 PM - 04:12 PMCAD2DEFECT, an end-to-end defect detection pipeline for use in the manufacturing industry By Guillaume GrimardFlanders Make

Track 3 // Poster Island: 5

Ultra-Precise Deposition for Integrating Next-Generation Electronic Systems
04:12 PM - 04:14 PMUltra-Precise Deposition for Integrating Next-Generation Electronic Systems By Jan Albert ZienkiewiczXTPL SA

Track 2 // Poster Island: 4

TSiCV based Silicon Carbide Interposer Technology
04:14 PM - 04:16 PMTSiCV based Silicon Carbide Interposer Technology By Piotr MackowiakFraunhofer IZM

Track 2 // Poster Island: 4

RF models for Through SiC Vias for highly integrated Interposer Technology
04:16 PM - 04:18 PMRF models for Through SiC Vias for highly integrated Interposer Technology By Julia-Marie KöszegiFraunhofer IZM

Track 2 // Poster Island: 2

Simulation driven investigation of production related thermo-mechanical effects for the behavior of a SO16 System-in-Package sensor
04:18 PM - 04:20 PMSimulation driven investigation of production related thermo-mechanical effects for the behavior of a SO16 System-in-Package sensor By Heiner MoellerFraunhofer ENAS

Track 2 // Poster Island: 4

Detection of Sensor-To-Sensor Variations Using Explainable AI
04:20 PM - 04:22 PMDetection of Sensor-To-Sensor Variations Using Explainable AI By Sarah SeifiInfineon Technologies Munich

Track 2 // Poster Island: 4

Early exiting with compressible activations for efficient Neural Network inference
04:22 PM - 04:24 PMEarly exiting with compressible activations for efficient Neural Network inference By Jona BeysensSwiss Center for Electronics and Microtechnology (CSEM)

Track 2 // Poster Island: 4

Reducing Energy Consumption of Wearable Sensors by Efficient Piecewise Linear Approximation Algorithms
04:24 PM - 04:26 PMReducing Energy Consumption of Wearable Sensors by Efficient Piecewise Linear Approximation Algorithms By Florian GrützmacherUniversity of Rostock

Track 2 // Poster Island: 4

Structural Generation of Virtual Prototypes for Smart Sensor Development in SystemC-AMS from Simulink Models
04:26 PM - 04:28 PMStructural Generation of Virtual Prototypes for Smart Sensor Development in SystemC-AMS from Simulink Models By Alexandra KüsterBosch Sensortec

Track 2 // Poster Island: 4

ONN-Based On-chip Learning for Obstacle Avoidance on Mobile Robot
04:28 PM - 04:30 PMONN-Based On-chip Learning for Obstacle Avoidance on Mobile Robot By Madeleine AbernotLIRMM University of Montpellier

Track 2 // Poster Island: 5

Track I – Components of Smart Systems            Novel devices for smart systems
11:00 AM - 12:15 PMTrack I – Components of Smart Systems Novel devices for smart systems

Chairs: Paddy French + Matthias Kühnel

Bendable and Stretchable Sensor for WearableSystems
11:00 AM - 11:15 AMBendable and Stretchable Sensor for Wearable
Systems
By Joerg FroemelTohoku University
A Smart Illuminance Sensor for the Perception and Classification of Ambient Lighting Conditions
11:20 AM - 11:35 AMA Smart Illuminance Sensor for the Perception and Classification of Ambient Lighting Conditions By Georg BrunnhoferAVL List GmbH
Power Enhanced All-Si Based Micro-Thermoelectric Generators (µTEGs) By Heat Sink Integration
11:40 AM - 11:55 AMPower Enhanced All-Si Based Micro-Thermoelectric Generators (µTEGs) By Heat Sink Integration By Alex Rodriguez-IglesiasConsejo Superior de Investigaciones Científicas (CSIC)
Ceramic Micro PEM Fuel Cell Systems For Self-Supplying Miniaturized Systems (EMIKRO)
12:00 PM - 12:15 PMCeramic Micro PEM Fuel Cell Systems For Self-
Supplying Miniaturized Systems (EMIKRO)
By Adrian GoldbergFraunhofer IKTS
Lunch break + 7 poster pitches Track I
12:30 PM - 02:00 PMLunch break + 7 poster pitches Track I

see tab “Poster pitches”

Track II – System integration aspects concerning hardware and software                                   Power conversion and reliability design
02:00 PM - 03:30 PMTrack II – System integration aspects concerning hardware and software Power conversion and reliability design

Chairs: Bart Vandevelde + Thomas Hammer

Reliability Improvement of Electronic Components with Design of Experiments Influence of Design Parameters on Fatigue Life
02:00 PM - 02:15 PMReliability Improvement of Electronic Components with Design of Experiments Influence of Design Parameters on Fatigue Life By Markus KäßBMW AG
An AI Architecture for Power MOS Rds-on-driven Lifetime Estimation
02:20 PM - 02:35 PMAn AI Architecture for Power MOS Rds-on-driven Lifetime Estimation By Carmelo PinoSTMicroelectronics
Fully Integrated Energy Harvesting Application Using Chip-Scale Thermoelectric Generator Technology
02:40 PM - 02:55 PMFully Integrated Energy Harvesting Application Using Chip-Scale Thermoelectric Generator Technology By Eoin AhernTyndall National Institute
Health Index Modeling for Trustable ElectronicSensor Systems in an Autonomous Application
03:00 PM - 03:15 PMHealth Index Modeling for Trustable Electronic
Sensor Systems in an Autonomous Application
By Omar MohammedUniversity of Siegen
Coffee break
03:30 PM - 04:00 PMCoffee break
Track I – Components of Smart Systems        Novel processes for smart systems
04:30 PM - 06:05 PMTrack I – Components of Smart Systems Novel processes for smart systems

Chairs: Luis Fonseca + Jean Philippe Polizzi

Towards Roll-to-Roll Manufacturing of Wearable Sensors
04:30 PM - 04:45 PMTowards Roll-to-Roll Manufacturing of Wearable Sensors By Teemu AlajokiVTT
Fabrication and Integration of Quantum Dot Based Emitters for Smart Mechanical Watches
04:50 PM - 05:05 PMFabrication and Integration of Quantum Dot Based Emitters for Smart Mechanical Watches By Jörn LangenickelTechnical University Chemnitz
Force-Controlled Micropipetting as a Tool forStructured Deposition of Quantum Dots fromAqueous Dispersions
05:10 PM - 05:25 PMForce-Controlled Micropipetting as a Tool for
Structured Deposition of Quantum Dots from
Aqueous Dispersions
By Gopinath ManoharanTU Chemnitz
Large Matrix Array Aperture for 3D Vascular Imaging Capture
05:30 PM - 05:45 PMLarge Matrix Array Aperture for 3D Vascular Imaging Capture By Quorentin ColasVermon SA
MEMS Resonator Vacuum Sealed by SiliconMigration Wafer Level Packaging without Getter
05:50 PM - 06:05 PMMEMS Resonator Vacuum Sealed by Silicon
Migration Wafer Level Packaging without Getter
By Yukio SuzukiTohoku University
Track IV – Strategy and Business Creation Advanced packaging
11:00 AM - 12:15 PMTrack IV – Strategy and Business Creation Advanced packaging

Chairs: Sophie Cordeiro

Advanced Packaging in Europe: Enabling a New Generation of Silicon Systems
11:00 AM - 11:15 AMAdvanced Packaging in Europe: Enabling a New Generation of Silicon Systems By Jean-Marc YannouTechnical Director ASE Europe
Challenges in advanced packaging for automotive applications
11:20 AM - 11:35 AMChallenges in advanced packaging for automotive applications By Przemek GromalaBosch
Booster packaging intitiative in France Alps region: a model for Europe?
11:40 AM - 11:55 AMBooster packaging intitiative in France Alps region: a model for Europe? By Renaud de LangladeR&D project leader NOVAPAK technologies
Market forecast for advanced packaging
12:00 PM - 12:15 PMMarket forecast for advanced packaging By Stefan ChitoragaYole
Lunch break + 7 poster pitches Track I
12:30 PM - 02:00 PMLunch break + 7 poster pitches Track I

see tab “Poster pitches”

Track IV – Strategy and Business CreationAdvanced packaging
02:00 PM - 03:30 PMTrack IV – Strategy and Business Creation
Advanced packaging

Chairs: Przemyslaw Gromala + Renaud de Langlade

Advanced Packaging and HeterogeneousIntegration – are Key Enabler for ElectronicSystems
02:00 PM - 02:15 PMAdvanced Packaging and Heterogeneous
Integration – are Key Enabler for Electronic
Systems
By Rolf AschenbrennerFraunhofer IZM
Semiconductor Packaging, Assembly, andTest in Europe: Landscape – Positioning –Challenges for Advanced Packaging
02:20 PM - 02:35 PMSemiconductor Packaging, Assembly, and
Test in Europe: Landscape – Positioning –
Challenges for Advanced Packaging
By Steffen KröhnertESPAT Consulting
Pitches + Panel discussion with all invited speakers
02:45 PM - 03:30 PMPitches + Panel discussion with all invited speakers

25 min pitches

Panel until Coffee Break

Coffee break
03:30 PM - 04:00 PMCoffee break
Track III – Application Domains: Mobility, Energy, Industry, Biomedical, Healthy Living Novel sensing concepts for different applications
04:30 PM - 06:05 PMTrack III – Application Domains: Mobility, Energy, Industry, Biomedical, Healthy Living Novel sensing concepts for different applications

Thomas Hammer + Sywert Brongersma

Integrated Smart Systems – The Key to get aDigital Twin of a Real High-Tech Fab
04:30 PM - 04:45 PMIntegrated Smart Systems – The Key to get a
Digital Twin of a Real High-Tech Fab
By Torsten ThiemeDEAXO GmbH
A Flood of Problems Drained – Fixing Valves The Smart Way
04:50 PM - 05:05 PMA Flood of Problems Drained – Fixing Valves The Smart Way By Christoph KoeglerInfineon Technologies Dresden GmbH & Co. KG
3D Conform Radar System For Detection OfMotion And Falls In Spatial Application
05:10 PM - 05:25 PM3D Conform Radar System For Detection Of
Motion And Falls In Spatial Application
By Christian Bernd TschobanFraunhofer IZM
Greenhouse Monitoring with Biocompatible Humidity Sensor for Smart Farming
05:30 PM - 05:45 PMGreenhouse Monitoring with Biocompatible Humidity Sensor for Smart Farming By Moritz SchlagmannInfineon Technologies AG
Revolutionary Air Quality Sensor Offers Unseen Possibilities Measuring Local PM2.5 Pollution Enabling a Healthier Life
05:50 PM - 06:05 PMRevolutionary Air Quality Sensor Offers Unseen Possibilities Measuring Local PM2.5 Pollution Enabling a Healthier Life By Amit SrivatsaBosch Sensortec
  • Central
  • Poster pitches
  • Meeting 4&5
  • Auditorium A
Registration, Conference location open
08:00 AMRegistration, Conference location open

with Keynote Session

Chairs: Wolfgang Dettmann, Harald Kuhn

Keynote: From the Internet of Things to the Internet of Trust
09:00 AM - 09:30 AMKeynote: From the Internet of Things to the Internet of Trust By Marc VauclairNXP semiconductors
Keynote: Electronic Control Systems for Decentralized Renewable Energy
09:30 AM - 10:00 AMKeynote: Electronic Control Systems for Decentralized Renewable Energy By Thomas HammerSiemens AG
Presentation of the Thomas Gessner Award
10:00 AM - 10:30 AMPresentation of the Thomas Gessner Award
Coffee break + 5 poster pitches Track III
10:30 AM - 11:10 AMCoffee break + 5 poster pitches Track III

see tab “Poster pitches”

Presentations
11:10 AM - 12:30 PMPresentations

Track V – Cyber security of smart systems
Chairs: Wolfgang Dettmann

Challenges and Technologies towards Trusted Electronics
11:10 AM - 11:35 AMChallenges and Technologies towards Trusted Electronics By Matthias HillerFh AISEC, Cybersecurity Lab
Relay Station Attacks on different RFID access systems
11:35 AM - 12:00 PMRelay Station Attacks on different RFID access systems By Laura PistoriusUniv. Appl. Sci. Mittweida
Podium discussion
12:00 PM - 12:30 PMPodium discussion

with Marc Vauclair, NXP / Matthias Hiller, Fh AISEC

Lunch break
12:30 PM - 01:30 PMLunch break
12 Poster pitches Track III + V + networking session in the poster / exhibition area + coffee
01:30 PM - 02:30 PM12 Poster pitches Track III + V + networking session in the poster / exhibition area + coffee

see tab “Poster pitches”

Presentations
02:30 PM - 03:45 PMPresentations

see tab “Auditorium 1” and “Meeting 4&5”

MAIN HALL: End of conference + announcement best poster award
04:00 PM - 04:15 PMMAIN HALL: End of conference + announcement best poster award By Harald KuhnFraunhofer ENAS
City tour apc|m + SSI
04:30 PM - 05:30 PMCity tour apc|m + SSI
05:30 PMFarewell @City Hall Bruges – Gothic Hall

Final Get Togehter for all conference participants

09:00 AM - 04:00 PM21st European Advanced Process Control and Manufacturing (apc|m) Conference

Co-located conference (Your SSI ticket is also valid for the apc|m conference.)

For more information, please click here: Home – APCM europe (apcm-europe.eu)

Poster pitches part 1
11:00 AM - 11:06 AMPoster pitches part 1

Chairs: Christian Hedayat & Christian Wagner

Knowledge-based approach for sustainable problem solving based on 8D in the automotive industry
11:00 AM - 11:02 AMKnowledge-based approach for sustainable problem solving based on 8D in the automotive industry By Martin KempelRobert Bosch GmbH - Powertrain Solutions

Track 3 // Poster Island: 5

Open Access Database of Industry 5.0 Tasks for the Development of AI-based Classifier to Enable True Collaborative Robotics
11:02 AM - 11:04 AMOpen Access Database of Industry 5.0 Tasks for the Development of AI-based Classifier to Enable True Collaborative Robotics By Matteo MenolottoTyndall National Institute, University College Cork

Track 3 // Poster Island: 5

AI-based Task Classification with Pressure Insoles for Occupational Safety in Industry 5.0
11:04 AM - 11:06 AMAI-based Task Classification with Pressure Insoles for Occupational Safety in Industry 5.0 By Patricia O'SullivanTyndall National Institute, University College Cork

Track 3 // Poster Island: 5

Poster pitches part 2
01:30 PM - 01:50 PMPoster pitches part 2

Chairs: Han Shao & Christian Wagner

Marine Data Analytics: Machine Learning Algorithms to Optimize Seaweed Growth
01:30 PM - 01:32 PMMarine Data Analytics: Machine Learning Algorithms to Optimize Seaweed Growth By Brendan O'FlynnTyndall National Institute, University College Cork

Track 3 // Poster Island: 2

Environmentally friendly and cost-efficient monitoring system for plant and agricultural fields
01:32 PM - 01:34 PMEnvironmentally friendly and cost-efficient monitoring system for plant and agricultural fields By Sven VoigtFraunhofer ENAS

Track 3 // Poster Island: 2

Ultra-Low-Power Fully-Digital Audio-DAC for Hearing Aid Application in 22 nm FDSOI Technology
01:34 PM - 01:36 PMUltra-Low-Power Fully-Digital Audio-DAC for Hearing Aid Application in 22 nm FDSOI Technology By Marcel JotschkeFraunhofer EAS/IIS

Track 3 // Poster Island: 4

Mild Cognitive Impairment Assessment as Basis for Safe, Inclusive and Human-Centered Mobility in Road Transport and Aerospace Domains
01:36 PM - 01:38 PMMild Cognitive Impairment Assessment as Basis for Safe, Inclusive and Human-Centered Mobility in Road Transport and Aerospace Domains By Eric ArmengaudArmengaud Innovate GmbH

Track 3 // Poster Island: 5

Automotive integration of smart road condition detection system
01:38 PM - 01:40 PMAutomotive integration of smart road condition detection system By Dietrich DumlerFraunhofer EMFT

Track 3 // Poster Island: 5

Cable detection and position estimation in a camera-based drone guidance system for autonomous sensor node attachment on transmission lines
01:42 PM - 01:44 PMCable detection and position estimation in a camera-based drone guidance system for autonomous sensor node attachment on transmission lines By Thorsten HerdFraunhofer ENAS

Track 3 // Poster Island: 2

Miniaturized Smart Systems Securing Credence Attributes and Responsibility in Products and Supply Chains
01:44 PM - 01:46 PMMiniaturized Smart Systems Securing Credence Attributes and Responsibility in Products and Supply Chains By Marlen G. ArnoldChemnitz University of Technology

Track 5 // Poster Island: 6

MEMS-based Fingerprinting Architecture for Trustworthy Electronics
01:46 PM - 01:48 PMMEMS-based Fingerprinting Architecture for Trustworthy Electronics By Katja MeinelChemnitz University of Technology

Track 5 // Poster Island: 6

Trustworthy Electronics – Advanced Packaging Contributions to Secure Technology
01:48 PM - 01:50 PMTrustworthy Electronics – Advanced Packaging Contributions to Secure Technology By Karl- Friedrich BeckerFraunhofer IZM

Track 5 // Poster Island: 6

Track II – System integration aspects concerning hardware and software                                      Data fusion and multi sensing
02:30 PM - 03:45 PMTrack II – System integration aspects concerning hardware and software Data fusion and multi sensing

Chairs: Christoph Koegler + Christian Hedayat

Comparison of Artificial and Spiking Neural Networks for Ambient-Assisted Living
02:30 PM - 02:45 PMComparison of Artificial and Spiking Neural Networks for Ambient-Assisted Living By Victor PazminoFZI Research Center for Information Technology
Additive Manufacturing Enabled Sensor System Integration for Advanced Automotive Thermal Conditioning and Flow Rate Measurement
02:50 PM - 03:05 PMAdditive Manufacturing Enabled Sensor System Integration for Advanced Automotive Thermal Conditioning and Flow Rate Measurement By Stefan KaranovicAVL List GmbH
Integration of Monitoring and Actuation Electronics in a Smart Roofs Waterproofing System
03:10 PM - 03:25 PMIntegration of Monitoring and Actuation Electronics in a Smart Roofs Waterproofing System By José SalgadoCeNTI - Centre for Nanotechnology and Smart Materials
Comparison Of Approaches For Gesture Recognition With Mems Ultrasonic Transducers
03:30 PM - 03:45 PMComparison Of Approaches For Gesture Recognition With Mems Ultrasonic Transducers By Elfi FertlInfineon Technologies AG Neubiberg, Germany
Track III – Application Domains: Mobility, Energy, Industry, Biomedical, Healthy Living Smart systems for mobility
02:30 PM - 03:45 PMTrack III – Application Domains: Mobility, Energy, Industry, Biomedical, Healthy Living Smart systems for mobility

Chairs: Harald Pötter & Antonio Lionetto

Intelligent Combo-System for Advanced Driving Monitoring of the Car Driver in Next Generation Cars
02:30 PM - 02:45 PMIntelligent Combo-System for Advanced Driving Monitoring of the Car Driver in Next Generation Cars By Francesco RundoSTMicroelectronics
Advanced Sensor Technologies and System Integration Methods for Innovative Automotive Test Systems
02:50 PM - 03:05 PMAdvanced Sensor Technologies and System Integration Methods for Innovative Automotive Test Systems By Andreas KlugAVL List GmbH
Power Components For Present and Future E-Mobility Systems
03:10 PM - 03:25 PMPower Components For Present and Future E-Mobility Systems By Antonio ImbrugliaSTMicroelectronics
AI-Supported Tree Detection using Sensor Data Fusion for a Land Surveying Robot
03:30 PM - 03:45 PMAI-Supported Tree Detection using Sensor Data Fusion for a Land Surveying Robot By Benjamin HeibutzkiFraunhofer ENAS

Keynote Speakers 2023

Marc VauclairCTO Fellow, NXP Semiconductors

The presentation sketches the mutations and the challenges introduced by the advent of ubiquitous Internet of Things solutions. Our society is increasingly reliant on smart devices and services, from home automation to manufacturing, medicine, finance and transport. These billions of inter-connected devices with sensors and actuators, reachable almost instantaneously through the ubiquitous Internet from any location and any other device in the world, are collectively called the Internet of Things (IoT). All too often, “reachable” means reachable by unauthorized entities as well as intended users. Consequently, as a society and global economy, we have become very exposed to a plethora of new IoT security-related threats that never existed before, some of which have the potential to impact profoundly on our way of life.

Marc VauclairCTO Fellow, NXP Semiconductors

The presentation sketches the mutations and the challenges introduced by the advent of ubiquitous Internet of Things solutions. Our society is increasingly reliant on smart devices and services, from home automation to manufacturing, medicine, finance and transport. These billions of inter-connected devices with sensors and actuators, reachable almost instantaneously through the ubiquitous Internet from any location and any other device in the world, are collectively called the Internet of Things (IoT). All too often, “reachable” means reachable by unauthorized entities as well as intended users. Consequently, as a society and global economy, we have become very exposed to a plethora of new IoT security-related threats that never existed before, some of which have the potential to impact profoundly on our way of life.

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Wouter SerdijnProfessor of Bioelectronics, Delft University of Technology

The active medical implants will soon become flexible, both structurally and functionally. In this presentation, I will address how we can shape this change in packaging, encapsulation and functionality paradigms and how you can truly feel better.

Wouter SerdijnProfessor of Bioelectronics, Delft University of Technology

The active medical implants will soon become flexible, both structurally and functionally. In this presentation, I will address how we can shape this change in packaging, encapsulation and functionality paradigms and how you can truly feel better.

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Thomas HammerSenior Principal Research Scientist for "Sustainable Energy & Infrastructure", Siemens AG, Technology

Electronic Control Systems for Decentralized Renewable Energy Infrastructure
Decarbonization of the energy system requires sector coupling and rapidly ramping up decentralized renewable energy (DRE) supply. The challenges this poses for the transmission and distribution infrastructure are analyzed. DRE system solutions addressing these challenges and Smart System Integration opportunities are outlined. Project examples reviewing the actual status and research and innovation opportunities in the field of DRE supply and storage including hydrogen will be presented.

Thomas HammerSenior Principal Research Scientist for "Sustainable Energy & Infrastructure", Siemens AG, Technology

Electronic Control Systems for Decentralized Renewable Energy Infrastructure
Decarbonization of the energy system requires sector coupling and rapidly ramping up decentralized renewable energy (DRE) supply. The challenges this poses for the transmission and distribution infrastructure are analyzed. DRE system solutions addressing these challenges and Smart System Integration opportunities are outlined. Project examples reviewing the actual status and research and innovation opportunities in the field of DRE supply and storage including hydrogen will be presented.

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Eric BeyneSenior Fellow, VP R&D, 3D System Integration Program Director, imec

As electronic systems become more complex and CMOS scaling becomes more specialized, a variety of heterogenous device technologies will be required to realize them. The highly successful system-on-chip (SoC) design methodology of complex systems will need to evolve to an effectively “3D-SoC” heterogeneous system design methodology. This requires a functional partitioning of the systems in separate die (“chiplets”) that require high bandwidth, low latency, and low energy 2.5D and 3D integration technologies to “reconstitute” the systems. A broad range of possible technologies is available to realize this. Proposing a hierarchical view of the 3D interconnect fabric, we define a 3D interconnect technology landscape, that extends from the package-level all the way to the transistor level, spanning eight orders of magnitude in 3D interconnect density. This landscape is highly dynamic, as each technology has its own roadmap and scaling roadmap. This presentation will cover imec’s contributions to this 3D interconnect scaling technology in the areas of die-to-wafer and wafer-to-wafer stacking.

Eric BeyneSenior Fellow, VP R&D, 3D System Integration Program Director, imec

As electronic systems become more complex and CMOS scaling becomes more specialized, a variety of heterogenous device technologies will be required to realize them. The highly successful system-on-chip (SoC) design methodology of complex systems will need to evolve to an effectively “3D-SoC” heterogeneous system design methodology. This requires a functional partitioning of the systems in separate die (“chiplets”) that require high bandwidth, low latency, and low energy 2.5D and 3D integration technologies to “reconstitute” the systems. A broad range of possible technologies is available to realize this. Proposing a hierarchical view of the 3D interconnect fabric, we define a 3D interconnect technology landscape, that extends from the package-level all the way to the transistor level, spanning eight orders of magnitude in 3D interconnect density. This landscape is highly dynamic, as each technology has its own roadmap and scaling roadmap. This presentation will cover imec’s contributions to this 3D interconnect scaling technology in the areas of die-to-wafer and wafer-to-wafer stacking.

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Francisco Ibanez

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Francisco Ibanez

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Speakers 2023

Markus KäßPhD Student, BMW AG

Mechanical load is a significant impact on the solder fatigue life of printed circuit board (PCB) components. This contribution discusses both the effects of the mechanical load itself and the interactions with other parameters. Results of a design of experiments are shown and discussed.

Markus KäßPhD Student, BMW AG

Mechanical load is a significant impact on the solder fatigue life of printed circuit board (PCB) components. This contribution discusses both the effects of the mechanical load itself and the interactions with other parameters. Results of a design of experiments are shown and discussed.

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Katja MeinelScientific employee, Chemnitz University of Technology

A fingerprint architecture for use as a hardware security component is presented. This is based on a micro-electro-mechanical system (MEMS), which acts as a physically unclonable function (PUF) and is used to generate a fingerprint. This should allow electronic components to be clearly identified and thus ensure protection against unauthorized exchange or manipulation. The key is generated and checked via fingerprint electronics connected to the MEMS, which is implemented using an FPGA.

Katja MeinelScientific employee, Chemnitz University of Technology

A fingerprint architecture for use as a hardware security component is presented. This is based on a micro-electro-mechanical system (MEMS), which acts as a physically unclonable function (PUF) and is used to generate a fingerprint. This should allow electronic components to be clearly identified and thus ensure protection against unauthorized exchange or manipulation. The key is generated and checked via fingerprint electronics connected to the MEMS, which is implemented using an FPGA.

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Matteo MenolottoSenior Postdoctoral Researcher, Tyndall National Institute, University College Cork

Collaborative robots have intrinsic high task flexibility and scalability with reduced commissioning costs respect to classic automation. However, their level of collaboration is hugely limited by the human-robot interfaces design and by safety regulations. Using motion capture technology to track the worker and feed this information to the robot could improve the collaborative behavior of the robot, itself, maximizing productivity and ensuring the adequate level of safety.
This work presents the creation of an open access database of motion tracking data of the hand, collected from two different motion capture technology while performing several industry 4.0 related tasks.
Preliminary results on the comparison between the two datasets to train AI-based task classifiers are also presented. The ultimate goal in fact is to develop a real-time task classification strategy able to reliably identify the task the operator is performing with minimal sensing technology.

Matteo MenolottoSenior Postdoctoral Researcher, Tyndall National Institute, University College Cork

Collaborative robots have intrinsic high task flexibility and scalability with reduced commissioning costs respect to classic automation. However, their level of collaboration is hugely limited by the human-robot interfaces design and by safety regulations. Using motion capture technology to track the worker and feed this information to the robot could improve the collaborative behavior of the robot, itself, maximizing productivity and ensuring the adequate level of safety.
This work presents the creation of an open access database of motion tracking data of the hand, collected from two different motion capture technology while performing several industry 4.0 related tasks.
Preliminary results on the comparison between the two datasets to train AI-based task classifiers are also presented. The ultimate goal in fact is to develop a real-time task classification strategy able to reliably identify the task the operator is performing with minimal sensing technology.

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Torsten ThiemeChief Development Officer (CDO), DEAXO GmbH

Building construction of high-tech fabs by means of BIM (Building Information Modeling) creates the fundamentals for a digital twin of the real fab. The result is the model of a production facility with a high transparency. But it is only a static model. Furthermore, you can use this model as a fundamental for integrating the data of the fab in operation. This requires the application of Smart Integrated Systems to obtain all measurement data and data analyses. This is prerequisite to get to a well working digital twin of a running fab. By means of that you can create a cyber-physical system.

Torsten ThiemeChief Development Officer (CDO), DEAXO GmbH

Building construction of high-tech fabs by means of BIM (Building Information Modeling) creates the fundamentals for a digital twin of the real fab. The result is the model of a production facility with a high transparency. But it is only a static model. Furthermore, you can use this model as a fundamental for integrating the data of the fab in operation. This requires the application of Smart Integrated Systems to obtain all measurement data and data analyses. This is prerequisite to get to a well working digital twin of a running fab. By means of that you can create a cyber-physical system.

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Christoph KöglerDirector Innovation, Digitalization & AI, Infineon Technologies

Eavesdropping on robots: How a tiny acoustic sensor can do the work of a highly trained maintenance specialist. Infineon, GlobalFoundries and others are collaborating to implement predictive maintenance for the overhead hoist transport system used in highly automated semiconductor fabs.

Christoph KöglerDirector Innovation, Digitalization & AI, Infineon Technologies

Eavesdropping on robots: How a tiny acoustic sensor can do the work of a highly trained maintenance specialist. Infineon, GlobalFoundries and others are collaborating to implement predictive maintenance for the overhead hoist transport system used in highly automated semiconductor fabs.

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Sven VoigtGroup leader "Hybrid Sensors and Systems", Fraunhofer ENAS

A cost-efficiently produced and environmentally friendly sensor system for plants and agriculture fields is presented. The system continuously measures soil temperature, soil tension and, in the future, leaf wetness and nitrate concentration in the soil. A gateway collects the data transmitted wireless by the distributed sensor devices in the fields and brings it to a central server running an expert system. Due to the biodegradable and inert materials used, the sensor system can remain in the field after the harvest season and does not have to be recollected.

Sven VoigtGroup leader "Hybrid Sensors and Systems", Fraunhofer ENAS

A cost-efficiently produced and environmentally friendly sensor system for plants and agriculture fields is presented. The system continuously measures soil temperature, soil tension and, in the future, leaf wetness and nitrate concentration in the soil. A gateway collects the data transmitted wireless by the distributed sensor devices in the fields and brings it to a central server running an expert system. Due to the biodegradable and inert materials used, the sensor system can remain in the field after the harvest season and does not have to be recollected.

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Joris de HoogResearcher, Flanders Make

We present a end-to-end solution for the training of vision based pose estimation networks, based on the synthetic images. By sampling real-world application details (surface texture of objects, background, ambient lighting and others), we can generate quasi photo realistic images with perfect annotations. We then show the usefulness of this approach by applying it to an interesting industrial case study.

Joris de HoogResearcher, Flanders Make

We present a end-to-end solution for the training of vision based pose estimation networks, based on the synthetic images. By sampling real-world application details (surface texture of objects, background, ambient lighting and others), we can generate quasi photo realistic images with perfect annotations. We then show the usefulness of this approach by applying it to an interesting industrial case study.

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Jona BeysensR&D Engineer, CSEM

Hierarchical Machine Learning (ML) can be achieved by splitting an ML model in parts and running it on multiple devices in a network. However, this can result in significantly large intermediate feature maps (activations) that need to be communicated over the network. In this paper, we present a novel entropy-based technique that learns to intelligently compress activations during training and efficiently encodes them during inference. We show that in an early-exit configuration, entropy regularization with Huffman coding can greatly reduce the communication overhead, with a minimal loss in classification accuracy.

Jona BeysensR&D Engineer, CSEM

Hierarchical Machine Learning (ML) can be achieved by splitting an ML model in parts and running it on multiple devices in a network. However, this can result in significantly large intermediate feature maps (activations) that need to be communicated over the network. In this paper, we present a novel entropy-based technique that learns to intelligently compress activations during training and efficiently encodes them during inference. We show that in an early-exit configuration, entropy regularization with Huffman coding can greatly reduce the communication overhead, with a minimal loss in classification accuracy.

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Patricia O'SullivanPhD Candidate, Tyndall National Institute

In the study, fifteen participants were asked to wear pressure insoles while carrying out three different industry tasks: manual handling, assembly, and pick and place. Statistical and task-specific features were extracted from the data collected, and were used to train a machine learning classifier to identify the task based on plantar pressure of the participants. Task detection, in conjunction with weight assessment of the manipulated object or tool, are key elements in biomechanical models for human endurance, which are also related to fatigue prevention research. Pressure insoles can be included in the wearing equipment of smart workers and be fully integrated within a wireless sensing framework of an industry 5.0 setting, leading to the comprehensive overview and monitoring of the safety status of the industry worker.

Patricia O'SullivanPhD Candidate, Tyndall National Institute

In the study, fifteen participants were asked to wear pressure insoles while carrying out three different industry tasks: manual handling, assembly, and pick and place. Statistical and task-specific features were extracted from the data collected, and were used to train a machine learning classifier to identify the task based on plantar pressure of the participants. Task detection, in conjunction with weight assessment of the manipulated object or tool, are key elements in biomechanical models for human endurance, which are also related to fatigue prevention research. Pressure insoles can be included in the wearing equipment of smart workers and be fully integrated within a wireless sensing framework of an industry 5.0 setting, leading to the comprehensive overview and monitoring of the safety status of the industry worker.

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Stefan KaranovicResearch Engineer Emerging Technologies, AVL List GmbH

Fuel cell (FC) electric vehicles are rapidly gaining importance in the automotive industry, leading to a industry need for precise and efficient test systems. One key component of FC test systems is the hydrogen thermal conditioning unit, for which several optimization approaches through multi-material additive manufacturing (AM) and sensor embedding will be presented and discussed. Aside from novel thermal management concepts, an innovative AM-enabled sensor system for precise gas flow rate measurement in harsh and dynamically changing conditions will be described. The results underline the high potential of AM-enabled measurement systems for the application in automotive test and measurement solutions.

Stefan KaranovicResearch Engineer Emerging Technologies, AVL List GmbH

Fuel cell (FC) electric vehicles are rapidly gaining importance in the automotive industry, leading to a industry need for precise and efficient test systems. One key component of FC test systems is the hydrogen thermal conditioning unit, for which several optimization approaches through multi-material additive manufacturing (AM) and sensor embedding will be presented and discussed. Aside from novel thermal management concepts, an innovative AM-enabled sensor system for precise gas flow rate measurement in harsh and dynamically changing conditions will be described. The results underline the high potential of AM-enabled measurement systems for the application in automotive test and measurement solutions.

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Guillaume GrimardAssociate application engineer, Flanders Make

Presentation of the defect detection pipeline that was developed within the PILS project by the vision team withing Flanders Make in cooperation with EDM from the university of Hasselt.

Guillaume GrimardAssociate application engineer, Flanders Make

Presentation of the defect detection pipeline that was developed within the PILS project by the vision team withing Flanders Make in cooperation with EDM from the university of Hasselt.

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Elfi FertlPhD Candidate, Infineon Technologies AG Munich/Neubiberg

Proof of suitability of ultrasound in versatile ways for simple hand gesture recognition with MEMS ultrasonic transducers. Presentation of pipelines from data acquisition to gesture recognition. Assessment of hardware necessities for different types of gestures. Comparison of different data formats for storage and processing of the acquired data, along with algorithms for hand gesture recognition and verification of the need for machine learning for the task.

Elfi FertlPhD Candidate, Infineon Technologies AG Munich/Neubiberg

Proof of suitability of ultrasound in versatile ways for simple hand gesture recognition with MEMS ultrasonic transducers. Presentation of pipelines from data acquisition to gesture recognition. Assessment of hardware necessities for different types of gestures. Comparison of different data formats for storage and processing of the acquired data, along with algorithms for hand gesture recognition and verification of the need for machine learning for the task.

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Teemu AlajokiResearch Team Leader, VTT

-In this work, we present latest achievements at VTT within manufacturing of wearable electronics
-This includes sensor solutions that are based on printing of wirings and direct assembly of electronics components directly on elastic, soft substrates such as thermoplastic polyurethane (TPU); and hybrid approach, in which electronics are placed on a separate re-usable module and attached to a disposable patch using snap connectors.
-In particular, we will focus on roll-to-roll printing and post-processing steps such as lamination, cutting and via formation in realization of a fully functional single-lead wireless ECG sensor patch utilizing the hybrid approach.

Teemu AlajokiResearch Team Leader, VTT

-In this work, we present latest achievements at VTT within manufacturing of wearable electronics
-This includes sensor solutions that are based on printing of wirings and direct assembly of electronics components directly on elastic, soft substrates such as thermoplastic polyurethane (TPU); and hybrid approach, in which electronics are placed on a separate re-usable module and attached to a disposable patch using snap connectors.
-In particular, we will focus on roll-to-roll printing and post-processing steps such as lamination, cutting and via formation in realization of a fully functional single-lead wireless ECG sensor patch utilizing the hybrid approach.

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Moritz SchlagmannPhD Candidate, Sensor Development, Infineon Technologies AG

We were enabling smart farming applications with bio-compatible microclimate and leaf wetness sensing for disease prediction. Therefore, we took the next step, tested the developed sensor under relevant greenhouse conditions, and compared them to state-of-the-art sensors. With these results and findings, we want to develop an advanced demonstrator.

Moritz SchlagmannPhD Candidate, Sensor Development, Infineon Technologies AG

We were enabling smart farming applications with bio-compatible microclimate and leaf wetness sensing for disease prediction. Therefore, we took the next step, tested the developed sensor under relevant greenhouse conditions, and compared them to state-of-the-art sensors. With these results and findings, we want to develop an advanced demonstrator.

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Amit SrivatsaProduct Manager, Optical Sensors, Bosch Sensortec GmbH

Air pollution is a serious global problem impacting health of many people every year. A major component of this pollution consists of fine dust known as particulate matter designated as PM2.5, which are solid and liquid particles smaller than 2.5 µm.
Bosch Sensortec innovation brings to you a revolutionary miniaturization of PM2.5 air quality sensor making it the world's smallest. It is a natural fit for ultra-compact loT based smart home and smart building devices.
In this presentation, after briefly touching the air pollution problem, the functionality and benfits of Bosch Sensortec's new particulate matter sensor will be presented.

Amit SrivatsaProduct Manager, Optical Sensors, Bosch Sensortec GmbH

Air pollution is a serious global problem impacting health of many people every year. A major component of this pollution consists of fine dust known as particulate matter designated as PM2.5, which are solid and liquid particles smaller than 2.5 µm.
Bosch Sensortec innovation brings to you a revolutionary miniaturization of PM2.5 air quality sensor making it the world's smallest. It is a natural fit for ultra-compact loT based smart home and smart building devices.
In this presentation, after briefly touching the air pollution problem, the functionality and benfits of Bosch Sensortec's new particulate matter sensor will be presented.

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Martin KempelProgram Manager for Artificial Intelligence in Manufacturing, Robert Bosch GmbH - Powertrain Soutions

The electrification of the powertrain is leading to profound changes in the automotive industry. However, manufacturing must continue to maintain high quality standards.
Despite the widespread use of advanced methods for preventive QM management, nonconformities still occur. This presentation will introduce a novel KG-based and interactive IT application for managing nonconformities using problem solving in 8D.

Martin KempelProgram Manager for Artificial Intelligence in Manufacturing, Robert Bosch GmbH - Powertrain Soutions

The electrification of the powertrain is leading to profound changes in the automotive industry. However, manufacturing must continue to maintain high quality standards.
Despite the widespread use of advanced methods for preventive QM management, nonconformities still occur. This presentation will introduce a novel KG-based and interactive IT application for managing nonconformities using problem solving in 8D.

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Carmelo PinoAdv Senior Engineer, STMicroelectronics

We propose a method based on Artificial Intelligence techniques that allows to
estimate the lifetime of a Power MOSFET starting from the evaluation of the its RDS_on. The model is capable to make predictions for understand when the device may stop working well.

Carmelo PinoAdv Senior Engineer, STMicroelectronics

We propose a method based on Artificial Intelligence techniques that allows to
estimate the lifetime of a Power MOSFET starting from the evaluation of the its RDS_on. The model is capable to make predictions for understand when the device may stop working well.

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Alex Rodriguez-IglesiasPhD Student, Consejo Superior de Investigaciones Científicas

The Internet of Things is becoming a keystone for the prosperity of our society. Powering the microscale sensors of the loT nodes with long-term autonomy in a sustainable manner is a majo challenge that needs to be tackled. In this presentation I will present our approach to that problem, profiting waste heat sources by means of microthermoelectric generators based completely on silicon, a low cost and environmentally sound material.

Alex Rodriguez-IglesiasPhD Student, Consejo Superior de Investigaciones Científicas

The Internet of Things is becoming a keystone for the prosperity of our society. Powering the microscale sensors of the loT nodes with long-term autonomy in a sustainable manner is a majo challenge that needs to be tackled. In this presentation I will present our approach to that problem, profiting waste heat sources by means of microthermoelectric generators based completely on silicon, a low cost and environmentally sound material.

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Tom EnderleinResearch assistant, Technische Universität Chemnitz / Center for Microtechnologies

The presentation summarizes the design and fabrication of hollow polymer microneedles (MN) on flexible substrates. The MN sheets are the key microfluidic elements for the extraction of interstitial fluid in a wearable and minimally invasive sensor patch. The interstitial fluid is a rich source of relevant biomarkers, which surrounds the cells and tissues of the body and its composition is very similar to blood. Therefor it is an ideal candidate for continuous health monitoring applications. Further, we present the results of successful MN penetration experiments and their capabilities towards liquid extraction and transportation. The work presented was performed within the EU H2020 Research and Innovation Action project "SIXTHSENSE", Grant agreement ID: 883315.

Tom EnderleinResearch assistant, Technische Universität Chemnitz / Center for Microtechnologies

The presentation summarizes the design and fabrication of hollow polymer microneedles (MN) on flexible substrates. The MN sheets are the key microfluidic elements for the extraction of interstitial fluid in a wearable and minimally invasive sensor patch. The interstitial fluid is a rich source of relevant biomarkers, which surrounds the cells and tissues of the body and its composition is very similar to blood. Therefor it is an ideal candidate for continuous health monitoring applications. Further, we present the results of successful MN penetration experiments and their capabilities towards liquid extraction and transportation. The work presented was performed within the EU H2020 Research and Innovation Action project "SIXTHSENSE", Grant agreement ID: 883315.

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Philipp RaimannScientific staff, PhD Student, Hahn-Schickard

This work presents the modelling and characterization of a miniaturized thermal gas sensor. In the proposed measurement technique, a polysilicon heater placed on a thin membrane is excited with a periodic heating voltage and the resulting temperature response is measured in the frequency domain using thermopiles and a lock-in amplifier. A thermal lumped
element model allows to interpret the gas specific temperature signal yielding the estimation of thermal conductivity and volumetric heat capacity. With this approach, we aim to fundamentally improve the gas sensing performance by increasing
sensitvity and selectivity of existing thermal devices.

Philipp RaimannScientific staff, PhD Student, Hahn-Schickard

This work presents the modelling and characterization of a miniaturized thermal gas sensor. In the proposed measurement technique, a polysilicon heater placed on a thin membrane is excited with a periodic heating voltage and the resulting temperature response is measured in the frequency domain using thermopiles and a lock-in amplifier. A thermal lumped
element model allows to interpret the gas specific temperature signal yielding the estimation of thermal conductivity and volumetric heat capacity. With this approach, we aim to fundamentally improve the gas sensing performance by increasing
sensitvity and selectivity of existing thermal devices.

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Lorenzo PimpolariPostdoctoral researcher, Insitute of Microelectronics of Barcelona (IMB-CNM)

My presentation focuses on the development of a carbon-based printed thermoelectric generator on paper substrate for cold-chain monitoring. The presentation will initially discuss the preparation of ink to achieve good thermoelectric properties. Then, a thermoelectric characterization of materials printed on paper starting from the previously optimized ink will be described. Finally, a first prototype thermoelectric generator will be presented.

Lorenzo PimpolariPostdoctoral researcher, Insitute of Microelectronics of Barcelona (IMB-CNM)

My presentation focuses on the development of a carbon-based printed thermoelectric generator on paper substrate for cold-chain monitoring. The presentation will initially discuss the preparation of ink to achieve good thermoelectric properties. Then, a thermoelectric characterization of materials printed on paper starting from the previously optimized ink will be described. Finally, a first prototype thermoelectric generator will be presented.

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Andreas KlugDirector Global Research & Technology - Instrumentation & Test Systems, AVL List GmbH

In this contribution selected novel research results and developments related to advanced sensor technologies and system integration methods for innovative automotive test systems will be presented. After a general introduction, novel electronic- and photonic-based sensor concepts and measurement solutions in areas including e-mobility and ADAS/AD will be described. In addition, selected use cases and research results of novel sensor concepts and (pre-)development components enabled by Additive Manufacturing (AM) will be discussed.

Andreas KlugDirector Global Research & Technology - Instrumentation & Test Systems, AVL List GmbH

In this contribution selected novel research results and developments related to advanced sensor technologies and system integration methods for innovative automotive test systems will be presented. After a general introduction, novel electronic- and photonic-based sensor concepts and measurement solutions in areas including e-mobility and ADAS/AD will be described. In addition, selected use cases and research results of novel sensor concepts and (pre-)development components enabled by Additive Manufacturing (AM) will be discussed.

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Georg BrunnhoferSenior Research Engineer, AVL List GmbH

A Smart Illuminance Sensor is presented which is a stand-alone measurement device detecting solar and artificial light to perceive and categorize adverse light conditions or critical illumination scenarios & scenes. With respect to ADAS/AD applications on driving vehicles, the Smart Illuminance Sensor determines the direction of sunlight or any other artificial illumination source with respect to the vehicle in real-time. It is based on photosensitive sensor units aligned in a 4-quadrant arrangement from which the directivity/diffusivity of the impinging light is deduced to distinguish direct light from diffuse light situations (e.g.: bright/sunny daylight vs. shadows) or adverse lighting conditions (e.g.: night or thunderstorms).

Georg BrunnhoferSenior Research Engineer, AVL List GmbH

A Smart Illuminance Sensor is presented which is a stand-alone measurement device detecting solar and artificial light to perceive and categorize adverse light conditions or critical illumination scenarios & scenes. With respect to ADAS/AD applications on driving vehicles, the Smart Illuminance Sensor determines the direction of sunlight or any other artificial illumination source with respect to the vehicle in real-time. It is based on photosensitive sensor units aligned in a 4-quadrant arrangement from which the directivity/diffusivity of the impinging light is deduced to distinguish direct light from diffuse light situations (e.g.: bright/sunny daylight vs. shadows) or adverse lighting conditions (e.g.: night or thunderstorms).

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Quorentin ColasEngineer Process developement, Vermon SA

Three-dimensional ultrasound has initially been used to address volumetric imaging for diagnostic purposes and represents the leading-edge technological orientation in both transducer and IC (integrated circuit) architecture and design. However, new applications are coming up like biomarker measurements, preoperative navigation, real time surgery guidance or therapeutic procedures where 3D ultrasound modalities are key.
This paper presents an ongoing development where a large 8MHz matrix transducer has been assembled with multiple ASIC dies in a reconfigurable way, capable to fully image the upper carotid window.

Quorentin ColasEngineer Process developement, Vermon SA

Three-dimensional ultrasound has initially been used to address volumetric imaging for diagnostic purposes and represents the leading-edge technological orientation in both transducer and IC (integrated circuit) architecture and design. However, new applications are coming up like biomarker measurements, preoperative navigation, real time surgery guidance or therapeutic procedures where 3D ultrasound modalities are key.
This paper presents an ongoing development where a large 8MHz matrix transducer has been assembled with multiple ASIC dies in a reconfigurable way, capable to fully image the upper carotid window.

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Heiner MöllerLeader of Group “System Reliability” within Department MMC, Fraunhofer ENAS

Harsh environment conditions and different mission profiles create challenging thermos-mechanical requirements for appropriate sensor devices. Furthermore, influences from the specific design or production related tolerances have to be taken into account. A simulation-driven investigation of production related thermos-mechanical effects for an AMR sensor-based current measurement device will be presented. As the device is designed as a molded SO16 System-in-Package (SiP) it undergoes different process and curing steps during the manufacturing process. A resulting deviation of the final offset voltage of the sensor cells can lead to a manifestation of a sensor calibration inaccuracy. The aim was to examine the strain distribution at the AMR sensor surface along the process chain.

Heiner MöllerLeader of Group “System Reliability” within Department MMC, Fraunhofer ENAS

Harsh environment conditions and different mission profiles create challenging thermos-mechanical requirements for appropriate sensor devices. Furthermore, influences from the specific design or production related tolerances have to be taken into account. A simulation-driven investigation of production related thermos-mechanical effects for an AMR sensor-based current measurement device will be presented. As the device is designed as a molded SO16 System-in-Package (SiP) it undergoes different process and curing steps during the manufacturing process. A resulting deviation of the final offset voltage of the sensor cells can lead to a manifestation of a sensor calibration inaccuracy. The aim was to examine the strain distribution at the AMR sensor surface along the process chain.

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Sarah SeifiPhD, Infineon Technologies AG & Technical University Munich

With the growing concern for air quality and its impact on human health, interest in environmental gas monitoring has increased. However, chemi-resistive gas sensing devices are plagued by issues of sensor reproducibility during manufacturing. To adress this, this work proposes a novel approach for detecting sensor-to-sensor variations in sensing devices using the explainable AI (XAI) method of SHapley Additive exPlanations (SHAP). This is achieved by identifying sensors that contribute the most to environmental gas concentration estimation via machine learning, and measuring the similarity of feature rankings between sensors to flag deviations or outliers.Overall, the results show that our approach improves the understanding of sensor behavior, successfully detects sensor deviations down to 5-10% from the normal behavior, and leads to more efficient model preparation and calibration. Our method provides a novel solution for identifying deviating sensors, linking inconsistencies in hardware to sensor-to-sensor variations in the manufacturing process on an AI model-level.

Sarah SeifiPhD, Infineon Technologies AG & Technical University Munich

With the growing concern for air quality and its impact on human health, interest in environmental gas monitoring has increased. However, chemi-resistive gas sensing devices are plagued by issues of sensor reproducibility during manufacturing. To adress this, this work proposes a novel approach for detecting sensor-to-sensor variations in sensing devices using the explainable AI (XAI) method of SHapley Additive exPlanations (SHAP). This is achieved by identifying sensors that contribute the most to environmental gas concentration estimation via machine learning, and measuring the similarity of feature rankings between sensors to flag deviations or outliers.Overall, the results show that our approach improves the understanding of sensor behavior, successfully detects sensor deviations down to 5-10% from the normal behavior, and leads to more efficient model preparation and calibration. Our method provides a novel solution for identifying deviating sensors, linking inconsistencies in hardware to sensor-to-sensor variations in the manufacturing process on an AI model-level.

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Madeleine AbernotPh.D. Student, LIRMM - University of Montpellier - CNRS

This presentation focuses on neuromorphic Oscillatory Neural Networks (ONNs) based on an FPGA implementation of ONN. In particular, we propose a solution to perform on-chip learning with the ONN on FPGA to perform obstacle avoidance on a mobile robot equipped with proximity sensors. We consider training the ONN for obstacle avoidance depending on its response to the environment.

Madeleine AbernotPh.D. Student, LIRMM - University of Montpellier - CNRS

This presentation focuses on neuromorphic Oscillatory Neural Networks (ONNs) based on an FPGA implementation of ONN. In particular, we propose a solution to perform on-chip learning with the ONN on FPGA to perform obstacle avoidance on a mobile robot equipped with proximity sensors. We consider training the ONN for obstacle avoidance depending on its response to the environment.

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Florian GrützmacherResearcher, University of Rostock

In our paper we study the energy saving effect of approximating sensor signals with piecewise linear approximation techniques on smart wearable sensor platforms in order to reduce the amount of sensor data that has to be transmitted wirelessly. Due to the reduction on the sensor sub-system itself power consumption can be significantly reduced while important signal information for gesture and activity recognition can be preserved.

Florian GrützmacherResearcher, University of Rostock

In our paper we study the energy saving effect of approximating sensor signals with piecewise linear approximation techniques on smart wearable sensor platforms in order to reduce the amount of sensor data that has to be transmitted wirelessly. Due to the reduction on the sensor sub-system itself power consumption can be significantly reduced while important signal information for gesture and activity recognition can be preserved.

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Marcel JotschkeResearcher, Fraunhofer IIS/EAS

This presentation covers a fully-digital sigma-delta digital-to-analog converter (DAC) for hearing aids. The design is first synthesized on FPGA hardware. After verification, it is manufactured in 22 nm FDSOI CMOS technology. We present two different topologies and measurement results.

Marcel JotschkeResearcher, Fraunhofer IIS/EAS

This presentation covers a fully-digital sigma-delta digital-to-analog converter (DAC) for hearing aids. The design is first synthesized on FPGA hardware. After verification, it is manufactured in 22 nm FDSOI CMOS technology. We present two different topologies and measurement results.

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Eoin AhernResearch Engineer, Tyndall National Institute, Ireland

The project integrates a novel design of TEG (provided by Analog Devices) into a simple ultra-low power wireless sensor node. The TEGs are developed at chip-scale (<25mm2) and this makes them more suitable for mass-manufacturing and wearable technologies compared to off-the-shlf TEGs. The presentation details the design, testing, integration and future potential of this technology.

Eoin AhernResearch Engineer, Tyndall National Institute, Ireland

The project integrates a novel design of TEG (provided by Analog Devices) into a simple ultra-low power wireless sensor node. The TEGs are developed at chip-scale (<25mm2) and this makes them more suitable for mass-manufacturing and wearable technologies compared to off-the-shlf TEGs. The presentation details the design, testing, integration and future potential of this technology.

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Julia-Marie KöszegiGroup Manager Communication Module Development, Fraunhofer IZM

The presentations discusses the properties (dimensions, material, RF) of through SiC vias für interposer technologies in comparison the TSVs. The propagation of RF modes (slow wave, dielectric-quasi-TEM and skin-effect) is calculated. Equivalent circuit and full-wave simulation models are discussed.

Julia-Marie KöszegiGroup Manager Communication Module Development, Fraunhofer IZM

The presentations discusses the properties (dimensions, material, RF) of through SiC vias für interposer technologies in comparison the TSVs. The propagation of RF modes (slow wave, dielectric-quasi-TEM and skin-effect) is calculated. Equivalent circuit and full-wave simulation models are discussed.

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Antonio lmbrugliaFunded Projects Advanced Design Program Manager, STMicroelectronics

The e-mobility is our future.
1. greater efficiency of the transport system
2. lower environmental impact thanks to the reduction of traffic and the pollution it causes.
Electric cars are key to shifting energy use in transportation away from fossil fuels and towards renewables.
Power conversion and traction electronics in electric cars require devices with high-temperature and high-voltage performance.
So the main topic of discussion will on power electronics technologies that enable e-mobility giving power, efficiency, innovation.

Antonio lmbrugliaFunded Projects Advanced Design Program Manager, STMicroelectronics

The e-mobility is our future.
1. greater efficiency of the transport system
2. lower environmental impact thanks to the reduction of traffic and the pollution it causes.
Electric cars are key to shifting energy use in transportation away from fossil fuels and towards renewables.
Power conversion and traction electronics in electric cars require devices with high-temperature and high-voltage performance.
So the main topic of discussion will on power electronics technologies that enable e-mobility giving power, efficiency, innovation.

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Marius StoianScientific Researcher, IMT Bucharest

Nanostructured carbon can be used as transducer material for electrochemical probes for different analytes, such as polycyclic aromatic hydrocarbons (PAH). The doping of the nanostructured graphite layers with heteroatoms, like nitrogen, during the PECVD growth, improves the electrochemical properties of the carbon material deposited on silicon, in terms of electron transfer or pretreatment requirements. The N-doped nanocrystalline graphite layers (NCG) with different dopant precursor gas flows (ammonia) were tested against different aromatic hydrocarbons, showing the highest affinity for anthracene sensing among them. The N-NCG material with the lowest ammonia flow, in combination with graphite nanowalls, enabled the record of high current intensities in presence of anthracene at different concentrations in electrolyte solution based on lithium perchlorate in acetonitrile/water (v/v: 80/20), to obtain a calibration curve for anthracene quantification as electrochemical probe developed from nanostructured carbon materials.

Marius StoianScientific Researcher, IMT Bucharest

Nanostructured carbon can be used as transducer material for electrochemical probes for different analytes, such as polycyclic aromatic hydrocarbons (PAH). The doping of the nanostructured graphite layers with heteroatoms, like nitrogen, during the PECVD growth, improves the electrochemical properties of the carbon material deposited on silicon, in terms of electron transfer or pretreatment requirements. The N-doped nanocrystalline graphite layers (NCG) with different dopant precursor gas flows (ammonia) were tested against different aromatic hydrocarbons, showing the highest affinity for anthracene sensing among them. The N-NCG material with the lowest ammonia flow, in combination with graphite nanowalls, enabled the record of high current intensities in presence of anthracene at different concentrations in electrolyte solution based on lithium perchlorate in acetonitrile/water (v/v: 80/20), to obtain a calibration curve for anthracene quantification as electrochemical probe developed from nanostructured carbon materials.

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Benjamin HeibutzkiResearch assistant, Fraunhofer ENAS

Using trees as an example, the presentation shows how three-dimensional objects can be recognised and localised. This is done by sensor data fusion. Data from a self-developed panoramic camera and a stereoscopic multispectral camera as well as a commercial DGPS and a digital compass are fused. By combining these sensors and using AI-supported algorithms, real trees can be reliably detected and localised with an accuracy of a few square decimetres for a specific application on a land surveying robot.

Benjamin HeibutzkiResearch assistant, Fraunhofer ENAS

Using trees as an example, the presentation shows how three-dimensional objects can be recognised and localised. This is done by sensor data fusion. Data from a self-developed panoramic camera and a stereoscopic multispectral camera as well as a commercial DGPS and a digital compass are fused. By combining these sensors and using AI-supported algorithms, real trees can be reliably detected and localised with an accuracy of a few square decimetres for a specific application on a land surveying robot.

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Angela Mihaela BaracuScientific Researcher, National Institute for Research and Development in Microtechnologies-IMT Bucharest

This paper presents the preliminary results for developing a sensor based on a Molecularly Imprinted Biopolymer
(MIP)-Surface Acoustic Wave (SAW) device for highly sensitive detection of glyphosate (Gly). The SAW delay line
configuration-based sensor was manufactured on B-LiTaO3 piezoelectric substrate, using the surface micromachining technology. The operation frequency of the sensor was 121 MHz. The MIP film was electrochemically deposited on gold sensing area using the cyclic voltammetry (CV) technique. The MIP was successfully integrated with the SAW device and characterized as Gly recognition element, proving to be a reliable method for on-site herbicide detection.

Angela Mihaela BaracuScientific Researcher, National Institute for Research and Development in Microtechnologies-IMT Bucharest

This paper presents the preliminary results for developing a sensor based on a Molecularly Imprinted Biopolymer
(MIP)-Surface Acoustic Wave (SAW) device for highly sensitive detection of glyphosate (Gly). The SAW delay line
configuration-based sensor was manufactured on B-LiTaO3 piezoelectric substrate, using the surface micromachining technology. The operation frequency of the sensor was 121 MHz. The MIP film was electrochemically deposited on gold sensing area using the cyclic voltammetry (CV) technique. The MIP was successfully integrated with the SAW device and characterized as Gly recognition element, proving to be a reliable method for on-site herbicide detection.

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Omar MohammedResearch Associate, University of Siegen

The work is intended to specify a risk value for a given system, i.e., a lane-keeping robot.
The robot's functional task is to stay between two given lanes base on the camera frame that is fed to the system as the input. The input will be disturbed using a fault injection tool that represents some of the real-world hardware or environmental faults. A health index will be determined according to the risk value and the injected type and intensity of the fault.
According to the health index, the robot will carry out a necessary control action for ensuring the safety of the system.

Omar MohammedResearch Associate, University of Siegen

The work is intended to specify a risk value for a given system, i.e., a lane-keeping robot.
The robot's functional task is to stay between two given lanes base on the camera frame that is fed to the system as the input. The input will be disturbed using a fault injection tool that represents some of the real-world hardware or environmental faults. A health index will be determined according to the risk value and the injected type and intensity of the fault.
According to the health index, the robot will carry out a necessary control action for ensuring the safety of the system.

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Matthias HillerHead of Department Hardware Security, Fraunhofer AISEC

Electronics supply chains span around the globe and typically involve a larger number of partners. From a security perspective it is challenging to verify that a final product is free of weaknesses and backdoors, and does not contain gray market components. This talk addresses vulnerabilities along the supply chain and presents technologies to increase the trustworthiness of electronics.

Matthias HillerHead of Department Hardware Security, Fraunhofer AISEC

Electronics supply chains span around the globe and typically involve a larger number of partners. From a security perspective it is challenging to verify that a final product is free of weaknesses and backdoors, and does not contain gray market components. This talk addresses vulnerabilities along the supply chain and presents technologies to increase the trustworthiness of electronics.

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Thorsten HerdStudent Assistant, Fraunhofer ENAS

We elaborated a proof of concept for a drone guidance system for the application of sensor node attachment on power lines. A vision-based positioning system has been developed that includes a camera cable detection algorithm and a simplified stereo-matching approach. The positioning system has been implemented in python and tested in a simulation environment.

Thorsten HerdStudent Assistant, Fraunhofer ENAS

We elaborated a proof of concept for a drone guidance system for the application of sensor node attachment on power lines. A vision-based positioning system has been developed that includes a camera cable detection algorithm and a simplified stereo-matching approach. The positioning system has been implemented in python and tested in a simulation environment.

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Livia Alexandra Dinu2nd Degree Researcher, National Institute for R&D in Microtechnologies (IMT-Bucharest), Romania

This paper proposes a sensing system that is based on a microfabricated gold three-electrode device (AuE) integrated with Fe2O3 nanoparticles (NPs) loaded on graphene (GR), as nanozyme for the electrochemical sensor for detection of tannic acid (TA). The nanozyme Fe2O3/GR was structurally, morphologically, compositional and electrochemically characterized. Further, the response characteristics (such as limit of detection, sensitivity, etc) for the oxidation of TA was assessed using the DPV technique with the Fe2O3/GR-Au sensor. Finally the developed nanozyme based sensor was validated by measuring the TA, in presence of possible interfering species and from surface water samples.

Livia Alexandra Dinu2nd Degree Researcher, National Institute for R&D in Microtechnologies (IMT-Bucharest), Romania

This paper proposes a sensing system that is based on a microfabricated gold three-electrode device (AuE) integrated with Fe2O3 nanoparticles (NPs) loaded on graphene (GR), as nanozyme for the electrochemical sensor for detection of tannic acid (TA). The nanozyme Fe2O3/GR was structurally, morphologically, compositional and electrochemically characterized. Further, the response characteristics (such as limit of detection, sensitivity, etc) for the oxidation of TA was assessed using the DPV technique with the Fe2O3/GR-Au sensor. Finally the developed nanozyme based sensor was validated by measuring the TA, in presence of possible interfering species and from surface water samples.

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Rolf AschenbrennerDeputy Director, Head of Department SIIT, Fraunhofer IZM

Advanced Packaging and Heterogeneous Integration – are Key Enabler for Electronic Systems

With the loss of impetus of Moore’s law, the dramatic shift in geopolitical assessment of the semiconductor industry’s position and the tendency of the US and Europe to pull back advanced electronics expertise to their respective main lands, have resulted in a significant push for the role of advanced packaging and an increasing importance of heterogeneous integration. Alongside the path to pursue integration on Si platforms, novel approaches to use chiplet concepts and substrateless integration with much larger fabrication sizes than the established 300mm wafer format are not just emerging, but rushing to mainstream acceptance. This presentation will describe the value of advanced packaging as an HI platform. Key features in leading edge 2D and 3D technologies, such as wafer and panel level technologies will be described and new package developments from SoC to chiplet architecture will be presented. From the perspective of R&D for heterogenous integration and packaging as well as for early technology adopters, this spells a bright future, pushing the envelope on innovation advancement significantly.

Rolf AschenbrennerDeputy Director, Head of Department SIIT, Fraunhofer IZM

Advanced Packaging and Heterogeneous Integration – are Key Enabler for Electronic Systems

With the loss of impetus of Moore’s law, the dramatic shift in geopolitical assessment of the semiconductor industry’s position and the tendency of the US and Europe to pull back advanced electronics expertise to their respective main lands, have resulted in a significant push for the role of advanced packaging and an increasing importance of heterogeneous integration. Alongside the path to pursue integration on Si platforms, novel approaches to use chiplet concepts and substrateless integration with much larger fabrication sizes than the established 300mm wafer format are not just emerging, but rushing to mainstream acceptance. This presentation will describe the value of advanced packaging as an HI platform. Key features in leading edge 2D and 3D technologies, such as wafer and panel level technologies will be described and new package developments from SoC to chiplet architecture will be presented. From the perspective of R&D for heterogenous integration and packaging as well as for early technology adopters, this spells a bright future, pushing the envelope on innovation advancement significantly.

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Joerg FroemelAssoc. Prof., Tohoku University

In this presentation we show the combination of the ability of electrochemical sensing and mechanical bending sensing in flexible fibers. The fibers were functionalized with sensing membranes, which could successfully detect electrolytes and others by electrochemical sensing. The bending sensing was done by integrated stress-impedance strain sensing elements.

Joerg FroemelAssoc. Prof., Tohoku University

In this presentation we show the combination of the ability of electrochemical sensing and mechanical bending sensing in flexible fibers. The fibers were functionalized with sensing membranes, which could successfully detect electrolytes and others by electrochemical sensing. The bending sensing was done by integrated stress-impedance strain sensing elements.

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José Alberto Fernandes SalgadoHardware Developer, CeNTI

1) Roof structures are evolving to provide new waterproofing materials that increase the comfort of homes and roofs lifespan. Some of the market roof solutions present durability issues and may result in watertightness losses and consequent water infiltration causing anomalies. This presentation will explain the goal of the Smart Roof System, which is to develop a water-based polymeric membrane that presents equivalent technical performance to the best solutions of waterproofing liquid membrane solvent-based using an innovative reinforcing textile structure. This structure comprises the integration of an active heating system with temperature and moisture sensors and an eletronic system capable of monitoring the sensor data and activate the heating system. The resultant product mitigates cracking and reduces durability problems of the water-based polymeric membrane.

2) STVgoDIGITAL PPS4 – Worker aims to develop disruptive solutions based on sensory and active components within a garment to support repetitive movements that may cause injuries and/or pain to seamstresses. A textile-based exoskeleton with ergonomics concerns and a challenging textile-based implementation was developed to reduce  the physical efforts required to perform diferente sewing operations inindustrial process. Besides, it would correspond to essential biomechanical specifications to adapt to the human body and avoid common trade-offs related to human-device interfaces.The textile-based exoskeleton that will support the transition to Worker 4.0 generation integrates: a) a sensing system for the detection of movements in real-time, to make it possible to identify the ergonomic posture of the worker, as well as the risk associated with the execution of repetitive working tasks; b) an actuation system to increase body strength and support the upper limb segments correctly, reducing physical efforts and fatigue, eliminating unnecessary movements, and contributing to develop a better ergonomic assessment of the working postures and layout; and finally c) learning and actuation algorithms, with some degree of variability, focused on several movement natures, such as the abduction and elevation of the upper limbs.

José Alberto Fernandes SalgadoHardware Developer, CeNTI

1) Roof structures are evolving to provide new waterproofing materials that increase the comfort of homes and roofs lifespan. Some of the market roof solutions present durability issues and may result in watertightness losses and consequent water infiltration causing anomalies. This presentation will explain the goal of the Smart Roof System, which is to develop a water-based polymeric membrane that presents equivalent technical performance to the best solutions of waterproofing liquid membrane solvent-based using an innovative reinforcing textile structure. This structure comprises the integration of an active heating system with temperature and moisture sensors and an eletronic system capable of monitoring the sensor data and activate the heating system. The resultant product mitigates cracking and reduces durability problems of the water-based polymeric membrane.

2) STVgoDIGITAL PPS4 – Worker aims to develop disruptive solutions based on sensory and active components within a garment to support repetitive movements that may cause injuries and/or pain to seamstresses. A textile-based exoskeleton with ergonomics concerns and a challenging textile-based implementation was developed to reduce  the physical efforts required to perform diferente sewing operations inindustrial process. Besides, it would correspond to essential biomechanical specifications to adapt to the human body and avoid common trade-offs related to human-device interfaces.The textile-based exoskeleton that will support the transition to Worker 4.0 generation integrates: a) a sensing system for the detection of movements in real-time, to make it possible to identify the ergonomic posture of the worker, as well as the risk associated with the execution of repetitive working tasks; b) an actuation system to increase body strength and support the upper limb segments correctly, reducing physical efforts and fatigue, eliminating unnecessary movements, and contributing to develop a better ergonomic assessment of the working postures and layout; and finally c) learning and actuation algorithms, with some degree of variability, focused on several movement natures, such as the abduction and elevation of the upper limbs.

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Dietrich DumlerProject Manager, PhD Candidat, Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT

This contribution presents a new approach for optically assessing hazardous road conditions, such as ice patches and wet surfaces, which can easily be integrated with commercially available CMOS image sensors, boosting the safety features of selected Advanced Driver Assistance Systems (ADAS). After a basic introduction to the novel sensor solution, the process of the integration of the system behind the windshield of a test vehicle will be described. Finally the problems encountered that have to be solved before the sensor system can be used in a modern ADAS will be discussed.

Dietrich DumlerProject Manager, PhD Candidat, Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT

This contribution presents a new approach for optically assessing hazardous road conditions, such as ice patches and wet surfaces, which can easily be integrated with commercially available CMOS image sensors, boosting the safety features of selected Advanced Driver Assistance Systems (ADAS). After a basic introduction to the novel sensor solution, the process of the integration of the system behind the windshield of a test vehicle will be described. Finally the problems encountered that have to be solved before the sensor system can be used in a modern ADAS will be discussed.

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Marlen Gabriele ArnoldFull Professor - Corporate Environmental Management and Sustainability, Technische Universität Chemnitz

Security has evolved as a technological driving force for smart systems. To date, product safety in terms of authenticity of components and other hardware elements of the value chain is realized by analogue and digital methods. Using these technologies fraud is still happening as these technologies do not work for supply chains including goods beyond the component level, e.g. raw or biodegradable materials or a transient morphology. Responsibility and sustainability attributes in the value chain are closely linked to credence attributes. In order to understand how miniaturized smart systems can contribute to secure credence attributes and responsibility in products and along supply chains a SWOT analysis will be presented.

Marlen Gabriele ArnoldFull Professor - Corporate Environmental Management and Sustainability, Technische Universität Chemnitz

Security has evolved as a technological driving force for smart systems. To date, product safety in terms of authenticity of components and other hardware elements of the value chain is realized by analogue and digital methods. Using these technologies fraud is still happening as these technologies do not work for supply chains including goods beyond the component level, e.g. raw or biodegradable materials or a transient morphology. Responsibility and sustainability attributes in the value chain are closely linked to credence attributes. In order to understand how miniaturized smart systems can contribute to secure credence attributes and responsibility in products and along supply chains a SWOT analysis will be presented.

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Christian Bernd TschobanHead of Radar Frontends & Modules Group

Society is getting older and older, especially in Europe. Technical aids will have to support home care in future. The focus is on the monitoring of the persons and their daily movements. Within this publication for the first time a concept for the application of multiple radars for a home automation application in an age object is presented, the conversion as well as the validation is described.

Christian Bernd TschobanHead of Radar Frontends & Modules Group

Society is getting older and older, especially in Europe. Technical aids will have to support home care in future. The focus is on the monitoring of the persons and their daily movements. Within this publication for the first time a concept for the application of multiple radars for a home automation application in an age object is presented, the conversion as well as the validation is described.

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Adrian GoldbergScientist and project manager, Fraunhofer Institut for Ceramic Technology and Systems

This contribution shows the development of a micro fuel cell system based on the ceramic multilayer technology. All necessary components, like the hydrogen tank based on metal hydrides, a planar fuel cell stack, as well as necessary micro valves in multilayers are manufactured. The target size of the system is similar to a rechargeable lithium button battery (CR2450) and can substitute these. By use of metal hydrides as hydrogen storage, power densities of up to 290 Wh/l can be achieved and exceed combined with extended operating temperatures and increased cycle stability, the lithium battery (CR2450) by more than 50%. By the potential of miniaturization of the ceramic energy system and the scalability to the specific application dimensions and performance, completely new possibilities are offered as a longterm stable energy storage, for example in the field of autonomous sensor systems for the Internet of Things (IoT).

Adrian GoldbergScientist and project manager, Fraunhofer Institut for Ceramic Technology and Systems

This contribution shows the development of a micro fuel cell system based on the ceramic multilayer technology. All necessary components, like the hydrogen tank based on metal hydrides, a planar fuel cell stack, as well as necessary micro valves in multilayers are manufactured. The target size of the system is similar to a rechargeable lithium button battery (CR2450) and can substitute these. By use of metal hydrides as hydrogen storage, power densities of up to 290 Wh/l can be achieved and exceed combined with extended operating temperatures and increased cycle stability, the lithium battery (CR2450) by more than 50%. By the potential of miniaturization of the ceramic energy system and the scalability to the specific application dimensions and performance, completely new possibilities are offered as a longterm stable energy storage, for example in the field of autonomous sensor systems for the Internet of Things (IoT).

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Alexandra KüsterDoctoral student, Bosch Sensortec GmbH

I will present an approach to automatically translate Simulink models into SystemC-AMS components thereby preserving the model's structure and hierarchy. It is shown that the generated models do not significantly suffer from performance loss. The approach allows the reuse of models from exploration tests for virtual prototypes that are highly used for hardware/software integration.

Alexandra KüsterDoctoral student, Bosch Sensortec GmbH

I will present an approach to automatically translate Simulink models into SystemC-AMS components thereby preserving the model's structure and hierarchy. It is shown that the generated models do not significantly suffer from performance loss. The approach allows the reuse of models from exploration tests for virtual prototypes that are highly used for hardware/software integration.

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Cristina PachiuNational Institute for Research and Development in Microtechnologies -IMT Bucharest

We present the preliminary results related to synthesizing nanocrystalline graphene fluorinated layers and designing an array of resistive RH sensors based on these layers.These sensitive layers are obtained by different plasma treatments (Ar, Ar-CH3, and Ar-CF4). The morphology and the composition of the sensing layers are investigated through Scanning Electron Microscopy (SEM), Atomic Force Microscopy (AFM), and RAMAN spectroscopy. The RH sensors were fabricated using MEMS technology. These results potentially support further work to optimize the sensing structures to better humidity response in time to develop the resistive sensors for modern agriculture.

Cristina PachiuNational Institute for Research and Development in Microtechnologies -IMT Bucharest

We present the preliminary results related to synthesizing nanocrystalline graphene fluorinated layers and designing an array of resistive RH sensors based on these layers.These sensitive layers are obtained by different plasma treatments (Ar, Ar-CH3, and Ar-CF4). The morphology and the composition of the sensing layers are investigated through Scanning Electron Microscopy (SEM), Atomic Force Microscopy (AFM), and RAMAN spectroscopy. The RH sensors were fabricated using MEMS technology. These results potentially support further work to optimize the sensing structures to better humidity response in time to develop the resistive sensors for modern agriculture.

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Karl-Frierdrich BeckerGoup Manager Assembly & Encapsulation, Fraunhofer IZM

Trustworthiness of electronics components and systems has become a mandatory subject that needs to be addressed in microelectronics manufacturing, because trustworthy electronic systems enable reliability, safety and security of the functions provided. Due to the importance of these systems in our everyday life, this effort is seen as a basis to achieve sovereignty on economic and social level. Typically, this topic is dealt with on chip or software level. But also packaging offers relevant contributions to ensure trustworthiness, where three main topics in the field are discussed here:
A) Detection of counterfeit components
B) Protective structures as technological buildings blocks (Protection/Obfuscation)
C) Infrastructural measures to ensure trustworthiness during manufacturing
This publication will showcase some of the solutions found during advanced packaging research and will thus provide examples for the implementation of measures towards trustworthy electronics with a strong focus on packaging technologies.

Karl-Frierdrich BeckerGoup Manager Assembly & Encapsulation, Fraunhofer IZM

Trustworthiness of electronics components and systems has become a mandatory subject that needs to be addressed in microelectronics manufacturing, because trustworthy electronic systems enable reliability, safety and security of the functions provided. Due to the importance of these systems in our everyday life, this effort is seen as a basis to achieve sovereignty on economic and social level. Typically, this topic is dealt with on chip or software level. But also packaging offers relevant contributions to ensure trustworthiness, where three main topics in the field are discussed here:
A) Detection of counterfeit components
B) Protective structures as technological buildings blocks (Protection/Obfuscation)
C) Infrastructural measures to ensure trustworthiness during manufacturing
This publication will showcase some of the solutions found during advanced packaging research and will thus provide examples for the implementation of measures towards trustworthy electronics with a strong focus on packaging technologies.

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Eric ArmengaudCEO, Armengaud Innovate GmbH

Mild Cognitive Impairement screening to better understand cognitive abilities of the driver, and adapt autonomous driving functions accordingly, in order to improve road safety, driver acceptance, and inclusiness of mobility.

Eric ArmengaudCEO, Armengaud Innovate GmbH

Mild Cognitive Impairement screening to better understand cognitive abilities of the driver, and adapt autonomous driving functions accordingly, in order to improve road safety, driver acceptance, and inclusiness of mobility.

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Brendan O'FlynnHead of Group - Wireless Sensor Networks, Tyndall National Institute

Aquaculture farming faces challenges to increase production while maintaining welfare of livestock, efficiently use of resources, and being environmentally sustainable.
This research focuses on developing an resource constrained embedded system and associated artificial neural network that can estimate wave height using acceleration and
angular velocity data recorded by a low cost IMU sensors

Brendan O'FlynnHead of Group - Wireless Sensor Networks, Tyndall National Institute

Aquaculture farming faces challenges to increase production while maintaining welfare of livestock, efficiently use of resources, and being environmentally sustainable.
This research focuses on developing an resource constrained embedded system and associated artificial neural network that can estimate wave height using acceleration and
angular velocity data recorded by a low cost IMU sensors

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Gopinath ManoharanStudent, Research Assistant, TU Chemnitz

Quantum Dots(Ag-In-S) is deposited in plasma enhanced gold substrates using force-controlled Fluid-FM technique and micro-pipetting technique. Functional and morphological analysis of the QDs are carried out using Atomic Force Microscope, Optical Microscope, Fluorescene Microscope, PL Microscope.

Gopinath ManoharanStudent, Research Assistant, TU Chemnitz

Quantum Dots(Ag-In-S) is deposited in plasma enhanced gold substrates using force-controlled Fluid-FM technique and micro-pipetting technique. Functional and morphological analysis of the QDs are carried out using Atomic Force Microscope, Optical Microscope, Fluorescene Microscope, PL Microscope.

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Piotr MackowiakGroup Manager Microsensors, Fraunhofer IZM

This paper describes the research on the development on SiC Interposer technology with Through SiC Vias (TSiCV). It demonstrates a SiC Interposer with the Flip-Chip assembled Chips with different thicknesses. It gives an overview over the different approaches of via formation and describes the fabrication of a SiC Interposer and highlights the differences between the via formation between silicon and silicon carbide.

Piotr MackowiakGroup Manager Microsensors, Fraunhofer IZM

This paper describes the research on the development on SiC Interposer technology with Through SiC Vias (TSiCV). It demonstrates a SiC Interposer with the Flip-Chip assembled Chips with different thicknesses. It gives an overview over the different approaches of via formation and describes the fabrication of a SiC Interposer and highlights the differences between the via formation between silicon and silicon carbide.

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Yukio SuzukiAssociate Professor, Tohoku University

MEMS resonators were vacuum-encapsulated at single Pa by Silicon Migration Sealing (SMS) technology. The tuning-fork resonators were fabricated on a 6-inch SOI wafer and capped with a cap wafer with submicron release holes by direct bonding. After SMS, the encapsulated device was capacitively driven and sensed, and the Q factor showed 18432.8 after 430 ℃ 27 hr. After long term annealing at temperature as low as 145 ℃, the Q factor of the device reached 36759.9. Judging from the Q factor, the vacuum level of the sealed cavity is improved from 8 Pa to 1.5 Pa.

Yukio SuzukiAssociate Professor, Tohoku University

MEMS resonators were vacuum-encapsulated at single Pa by Silicon Migration Sealing (SMS) technology. The tuning-fork resonators were fabricated on a 6-inch SOI wafer and capped with a cap wafer with submicron release holes by direct bonding. After SMS, the encapsulated device was capacitively driven and sensed, and the Q factor showed 18432.8 after 430 ℃ 27 hr. After long term annealing at temperature as low as 145 ℃, the Q factor of the device reached 36759.9. Judging from the Q factor, the vacuum level of the sealed cavity is improved from 8 Pa to 1.5 Pa.

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Taoufik BourganaResearch engineer, Flanders Make

We Leverage synthetic data generation in the context of object detection, and demonstrate
robustness of trained models with respect to :
• Complex and cluttered backgrounds
• Varying exposure/lighting conditions
• Occlusion resistant

Taoufik BourganaResearch engineer, Flanders Make

We Leverage synthetic data generation in the context of object detection, and demonstrate
robustness of trained models with respect to :
• Complex and cluttered backgrounds
• Varying exposure/lighting conditions
• Occlusion resistant

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Jörn LangenickelScientific employee, TU Chemnitz

In this work, we present the combination of two emerging technologies A Quantum Dot based light emitting diode (QD-LED) with an ultrathin and highly flexible Parylene printed circuit board (PCB) to equip a purely mechanical watch with smart features. Doing so, the target application is the pressure monitoring during diving and alerting the user in the event of an exceeded pressure change rate.

Jörn LangenickelScientific employee, TU Chemnitz

In this work, we present the combination of two emerging technologies A Quantum Dot based light emitting diode (QD-LED) with an ultrathin and highly flexible Parylene printed circuit board (PCB) to equip a purely mechanical watch with smart features. Doing so, the target application is the pressure monitoring during diving and alerting the user in the event of an exceeded pressure change rate.

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Jean-Marc YannouTechnical Director, Europe, ASE Group

Title: Advanced Packaging in Europe: Enabling a New Generation of Silicon Systems

Demand for new efficiencies in the semiconductor design and manufacturing process is propelling the crucial role of packaging to deliver on requirements related to power, performance, and miniaturization. During his keynote, Jean-Marc Yannou will explore the heterogeneous integration and chiplet era, and describe how advanced packaging technologies are enabling highly complex system integration solutions across automotive, power, and sensor markets. He will then turn his attention to Europe, and delve deeper into regional market and technology nuances and the packaging creativity accelerating a smarter and more sustainable world for generations to come.

Jean-Marc YannouTechnical Director, Europe, ASE Group

Title: Advanced Packaging in Europe: Enabling a New Generation of Silicon Systems

Demand for new efficiencies in the semiconductor design and manufacturing process is propelling the crucial role of packaging to deliver on requirements related to power, performance, and miniaturization. During his keynote, Jean-Marc Yannou will explore the heterogeneous integration and chiplet era, and describe how advanced packaging technologies are enabling highly complex system integration solutions across automotive, power, and sensor markets. He will then turn his attention to Europe, and delve deeper into regional market and technology nuances and the packaging creativity accelerating a smarter and more sustainable world for generations to come.

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Stefan ChitoragaTechnology and Market Analyst, Yole Group

I will speak about Advanced Packaging Technology & Market trends. I will share its market forecast for the coming years. I will also present its supply chain and its importance.

Stefan ChitoragaTechnology and Market Analyst, Yole Group

I will speak about Advanced Packaging Technology & Market trends. I will share its market forecast for the coming years. I will also present its supply chain and its importance.

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Jan Albert ZienkiewiczBusiness Development Specialist, XTPL S.A.

In our presentation, we will show how the Ultra-Precise Deposition (UPD) technique (see: Scientific
Reports 12(1), 2022, p. 1-18) approaches the main challenges of additive manufacturing for system
integration on the microscale. These challenges include: 1. Development of materials that can be
reliably printed and offer the desired electrical and mechanical properties; 2. Controlling the printing
process. Ensuring the printed structures are deposited in the correct locations and forming the desired
shapes; 3. Tackle manufacturing complexity, which increases with the complexity of the circuits.

Jan Albert ZienkiewiczBusiness Development Specialist, XTPL S.A.

In our presentation, we will show how the Ultra-Precise Deposition (UPD) technique (see: Scientific
Reports 12(1), 2022, p. 1-18) approaches the main challenges of additive manufacturing for system
integration on the microscale. These challenges include: 1. Development of materials that can be
reliably printed and offer the desired electrical and mechanical properties; 2. Controlling the printing
process. Ensuring the printed structures are deposited in the correct locations and forming the desired
shapes; 3. Tackle manufacturing complexity, which increases with the complexity of the circuits.

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Renaud de LangladePresident, NovaPack Technologies

The "BOOSTER PACKAGING", funded by the French Alps Region, was a CSA to guide the Region on how to promote and support this crucial subset of the Chips Industry, map the eco-system, technologies, SWOT, quantification.
With the ultimate goal to suggest policies for the Region to implement. Methodology is described.
One of the output was the foundation for a nation-wide extension and this caught the attention of the Commissionner to use this as a bottom-up industry driven guidance for the EU CHIPS ACT and reserve funds for a "PACKAGING ACT".

Renaud de LangladePresident, NovaPack Technologies

The "BOOSTER PACKAGING", funded by the French Alps Region, was a CSA to guide the Region on how to promote and support this crucial subset of the Chips Industry, map the eco-system, technologies, SWOT, quantification.
With the ultimate goal to suggest policies for the Region to implement. Methodology is described.
One of the output was the foundation for a nation-wide extension and this caught the attention of the Commissionner to use this as a bottom-up industry driven guidance for the EU CHIPS ACT and reserve funds for a "PACKAGING ACT".

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Laura PistoriusReferent for Cybersecurity, Hochschule Mittweida

The presentation covers the work that has been done in association with the paper. The methods used and the results are described. The paper is characterized by the very practical approach. This should also be the focus of the presentation.

Laura PistoriusReferent for Cybersecurity, Hochschule Mittweida

The presentation covers the work that has been done in association with the paper. The methods used and the results are described. The paper is characterized by the very practical approach. This should also be the focus of the presentation.

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Dominik SchröderResearch assistant, Fraunhofer ENAS

This publication presents the results of the near-field to far-field transformation in the use-case of a spherical dipole used a reference object. The dipole has a comb generator with 10 MHz comb frequency to emit a broadband electromagnetic signal for test and characterization purposes. The tangential near-fields on the Huygens-Box of the dipole are captured at a minimum distance of 1 cm to the sphere. The results of near-field scans are presented and compared to those of a simulation model.

Dominik SchröderResearch assistant, Fraunhofer ENAS

This publication presents the results of the near-field to far-field transformation in the use-case of a spherical dipole used a reference object. The dipole has a comb generator with 10 MHz comb frequency to emit a broadband electromagnetic signal for test and characterization purposes. The tangential near-fields on the Huygens-Box of the dipole are captured at a minimum distance of 1 cm to the sphere. The results of near-field scans are presented and compared to those of a simulation model.

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Steffen KröhnertPresident & Founder, ESPAT-Consulting

Semiconductor Packaging, Assembly, and Test in Europe: Landscape - Positioning - Challenges for Advanced Packaging": While the packaging industry in other regions of this world is adapting latest advanced packaging technologies such as 2.5D Interposer, 3DIC, Silicon Bridge, Embedded and Fan-Out Wafer- and Panel Level Packaging, Direct D2W and W2W Hybrid Bonding, our European independent Packaging, Assembly, and Test Service Providers (SPAT-SPs) can't even offer Fan-In Wafer Level Packaging/ WLCSP to its customers. European IDMs and Foundries, of course, have these capabilities, but are working captive only. "From Lab-to-Fab" transfer does not work well in Europe. We are facing an innovation barrier here. The gap between our leading-edge packaging R&D and package manufacturing in Europe is large and further increasing. As an opportunity and threat at the same time, the packaging industry is highly competitive. Electronics Manufacturing Services (EMS) are moving upstream in the value chain taking over typical Outsources Semiconductor Assembly, and Test (OSAT) Standard Packaging (SP) business. Foundries and Material Manufacturers are moving upstream in the value chain entering OSAT Advanced Packaging (AP) business. What does it mean for Europe and the targeted higher regional supply chain independency?

Steffen KröhnertPresident & Founder, ESPAT-Consulting

Semiconductor Packaging, Assembly, and Test in Europe: Landscape - Positioning - Challenges for Advanced Packaging": While the packaging industry in other regions of this world is adapting latest advanced packaging technologies such as 2.5D Interposer, 3DIC, Silicon Bridge, Embedded and Fan-Out Wafer- and Panel Level Packaging, Direct D2W and W2W Hybrid Bonding, our European independent Packaging, Assembly, and Test Service Providers (SPAT-SPs) can't even offer Fan-In Wafer Level Packaging/ WLCSP to its customers. European IDMs and Foundries, of course, have these capabilities, but are working captive only. "From Lab-to-Fab" transfer does not work well in Europe. We are facing an innovation barrier here. The gap between our leading-edge packaging R&D and package manufacturing in Europe is large and further increasing. As an opportunity and threat at the same time, the packaging industry is highly competitive. Electronics Manufacturing Services (EMS) are moving upstream in the value chain taking over typical Outsources Semiconductor Assembly, and Test (OSAT) Standard Packaging (SP) business. Foundries and Material Manufacturers are moving upstream in the value chain entering OSAT Advanced Packaging (AP) business. What does it mean for Europe and the targeted higher regional supply chain independency?

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Ticket prices 2023

Registration is open now.

Please note that the Smart Systems Integration (SSI) Conference will be held at the same time with the European Advanced Process Control and Manufacturing (apc|m) Conference. The 3-day ticket allows you to attend both conferences.

Speaker/Committee (3-day-ticket)

569,00/ person / excl. VAT
  • Only bookable for speakers, poster presenters and committee members
  • Get access to the exhibition and all sessions of SSI & apcm conference
  • Conference dinner @ De Halve Maan Brewery on March 29, 2023 included
  • Farewell @City Hall Bruges – Gothic Hall on March 30, 2023 included

Regular (3-day-ticket)

899,00/ person / excl. VAT
  • Get access to the exhibition and all sessions of SSI & apcm conference
  • Conference dinner @ De Halve Maan Brewery on March 29, 2023 included
  • Farewell @City Hall Bruges – Gothic Hall on March 30, 2023 included

Student (3-day-ticket)

269,00/ person / excl. VAT
  • Bookable for students only (student card required)
  • Get access to the exhibition and all sessions of SSI & apcm conference
  • Farewell @City Hall Bruges – Gothic Hall on March 30, 2023 included

EPoSS Pre-event - Tuesday

0,00/ person
  • Only for EPoSS members (please use EPoSS-code)
  • Sessions, workshop and ExCom-Meeting
  • Evening event

Day Ticket - Tuesday

329,00/ person / excl. VAT
  • Get access to the exhibition and all sessions of apcm conference

Day Ticket - Wednesday

429,00/ person / excl. VAT
  • Get access to the exhibition and all sessions of SSI & apcm conference
  • Without conference dinner

Conference dinner ticket (Additionally)

149,00/ person / excl. VAT
  • Valid for the conference dinner on March 29, 2023

Day Ticket - Thursday

429,00/ person / excl. VAT
  • Get access to the exhibition and all sessions of SSI & apcm conference
  • Farewell @City Hall Bruges – Gothic Hall on March 30, 2023 included

Travel

We can recommend the following partner hotels for your stay during the conference.

Hotels via Booking.com

Unfortunately, all our partner hotels are now fully booked. You can find more hotels in Bruges under this weblink (booking.com).

Testimonials

Voices from our conference chairs as well as core team members and reasons for you to attend SSI!

Thomas Otto
Thomas OttoFraunhofer ENAS

Smart systems are the key to meet tomorrow's challenges in all aspects of life. Attend the main European conference in this field - the Smart Systems Integration Conference and Exhibition.

Stefan Finkbeiner
Stefan FinkbeinerEPoSS/ Bosch Sensortec

Digitization is not only increasingly entering our lifes, it is a real game changer! There will be not only advances in individual components and subsystems necessary, especially connectivity and implementation of intelligence “at the edge” integrated in smart modules and systems will be the key. To be successful in future, interdisciplinary approaches are required more than ever.

Rainer Günzler
Rainer GünzlerHahn-Schickard

“A side effect of Corona is the breakthrough of point-of-care diagnostics based on microfluidics.”

Thomas Hammer
Thomas HammerSiemens

“Smart system integration is key to highly automated distribution grids coupling the energy sector with mobility, industry & domestic use. At SSI 2023 you can meet the experts for discussing your interdisciplinary challenge!”

CALL FOR PAPERS

TIMELINE

Abstract submission started September 15th, 2022

Deadline for abstract submission (extended): November 30th, 2022

Abstract acceptance: Early January!

Deadlines for scientific papers:
▪ Selection by Committee December 16th, 2022
▪ Submission of Full Paper February 10th, 2023
▪ First Peer Review February 28th, 2023
▪ First revision Revised Paper March 24th, 2023

SUBMISSION OPPORTUNITIES

There are two opportunities for paper submission:
Scientific papers can be submitted for publication in IEEE
Explore ®. Full scientific papers (min. 4 pages) undergo a rigorous
peer review process.
It is possible to publish a non-scientific paper in the conference
proceedings, only.
Industry and European projects are kindly encouraged to submit contributions for oral presentation and optionally submit a paper.

Conference language: English

SELECTION PROCESS

The committee will review all the abstracts. Submitted abstracts are selected for oral or poster presentation. Conference proceedings will be available online.

Oral and Poster Presentations:
Two parallel sessions will be held at the conference. To highlight the networking aspect special focus is on poster presentations, in parallel to selected oral presentations. Poster authors will have the possibility to present their posters in a dedicated session as well as throughout the conference. All scientific oral and poster presentations will be included in the conference proceedings. The proceedings will be additionally published open access.

TRACKS

Track 1: Recent developments in the building blocks (components) of Smart Systems
This track contains new and innovative components of smart systems without any technology limitations, however a clear link to applications via further system integration.

• Single components and new sensor technologies
• Advanced micro/nano and smart power technologies
• Novel concepts for smart sensing, control, actuation and energy supply
• Smart low-cost approaches including roll-to-roll
technologies and printed functionalities
• Disruptive innovations in terms of functionality, accuracy,
autonomy, automation, cost, size
• Novel topics of smart systems, such as quantum sensing,
photonic integrated circuits and new materials

Track 2: System integration aspects concerning hardware and software
This track is focused on the different integration aspects like:

• Integration of different functionalities (energy management, communication,
data analysis, knowledge based data processing, …)
• Green, environmentally-friendly, recyclable aspects of system integration
• 2.5/3D integration, interconnect technologies and packaging the electronics and
all associated sensors/actuators etc.
• Heterogeneous integration for Smart Systems
• Software integration, firmware
• Reliability and security aspects (methodologies and concepts for reliability,
safety, and security)

Track 3: Application Domains
This track covers all application domains from healthy living, food, biomedical to mobility, energy and industry.

• Smart Systems with a TRL level of min. 6
for dedicated application within the different domains
This includes:
• AI based smart sensor systems and networks, control units and drives incl. aspects such as power electronics, as well as communication systems for all application fields
• Secure, reliable, decentralized, multi-modal systems
• Ultra-flexible, high-performing, energy and resource efficient, and collaborative systems for different applications
• Digital twins supporting from design to customer service

Track 4: Strategy and Business Creation
Policy talks will be invited. The Call for Papers is open for following topics:

• Smart System solutions created by start-ups and SMEs
• Results of industrial partners and impact gained in funded European projects
• Standardization topics
• Presentations of European and local networks CSAs related to SSI topics, Digital Innovation Hubs

Track 5 – Special track of SSI 2023: Security of Smart Systems
This track is a special track for the SSI2023. It will be introduced by a general keynote and can be extended by a panel of experts. Companies and RTOs working in this field are encouraged to submit an abstract.

• Hardware encryption, key generation and storage, authenticity of integrated circuits, prevention of hardware attacks
• Software security and integrity, AI security, signal and input validation, firmware hardening
• System and IoT security, considering the function of the system as a whole, communication security, quantum communication

On behalf of the whole committee – we are looking forward to receiving your innovative abstracts.

Contact Us

Don’t hesitate to get in touch!

Send Message

If you have any questions or just want to get in touch, use the form below. We look forward to hearing from you!

    General conditions of participation:
    If there are any changes to your participation, please refer to our general conditions of participation.

    Look Back 2022

    On April 27th and 28th, the Smart Systems Integration Conference & Exhibition, SSI for short, took place. More than 100 participants from all over Germany, Europe and the world attended the event in Grenoble, France, which was diversified as well as exciting. Highly interesting keynotes, a total of 70 speakers spread over five tracks, 15 technical sessions, a poster session and an exhibitor pitch session dealt intensively with Smart Systems along the entire value chain. The participants took advantage of the numerous insights, best practices, presentations, keynotes and demonstrations to network intensively afterwards. Finally yet importantly, the Thomas Gessner Award was presented for the third time during the event.

    On April 27th, the two conference chairs Dr. Stefan Finkbeiner (Bosch Sensortec) and Prof. Thomas Otto (Fraunhofer ENAS) opened the now 15th Smart Systems Integration Conference at the Maison MINATEC in Grenoble/France. Organized by Fraunhofer ENAS, EPoSS – – European Association on Smart Systems Integration and Silicon Saxony, this year’s SSI conference and exhibition also put the spotlight on Smart Systems. Thanks to the support of the SSI core team, the scientific committee and the two main sponsors Bosch Sensortec and Critical Manufacturing, the SSI once again offered a diversified conference and supporting program for the more than 100 participants. 70 technical papers in 15 sessions dealt intensively with a total of five technological tracks. Joint excursions and conference dinner after eventful hours of technical exchange offered all participants the best opportunity to get to know each other better.

    The high-ranked keynote speeches covered the full thematic scope of the SSI. They were held by Bert De Colvenaer, Executive Director of KDT Joint Undertaking (“From ECSEL to KDT to CHIPS JU”); Laurent Remont, Vicepresident of Sensor Solutions at Infineon Technologies (“Sense-compute-connect-power: a holistic sensor system approach to enable greener, easier and safer life”); Olivier Faynot, Silicon Department Head of CEA-Leti (“Overcoming the Data Deluge Challenges with Greener Electronics”), Andrea Onetti, Executive Vice President of ST Microelectronics Srl Italy (“Making micromirrors system integration friendly: thin-film piezo technology”), and Harald Kuhn, Director of Fraunhofer ENAS and Director of the Center for Microtechnologies at TU Chemnitz (“Smart Systems will create the future”).

    The participants were offered a free choice of topics in the five conference tracks “Key Enablers for Next Generation Smart Systems”, “Key Technologies for Smart Systems”, “Application Domains: Mobility, Energy, Industry”, “Application Domains: Food, Biomedical, Healthy Living” or “Strategy and Business Creation” – as well as the best input from experts in the respective fields. The topics were oriented along the complete value chain of Smart Systems and addressed the Technology Readiness Levels (TRL) between 1 and 9, ranging from “Key Enablers for Smart Systems of the Next Generation” over technologies to applications in various industries. The track “Strategy and Business Creation” organized by EPoSS Association focused on Photonics Integration on the one hand and on Digital Innovation Hubs and the integration of start-ups and SMEs on the other hand.

    For the third time, the “Thomas Gessner Award” was presented. By this, Fraunhofer ENAS promotes applied research by awarding this prize for excellent scientific work within the annual Smart Systems Integration Conference. The award is aimed at national and international master and doctoral students in the field of Smart Systems Integration, whose thesis has been evaluated at least “very good” and does not date back more than two years. The evaluation procedure takes particular into account the novelty of the scientific and methodological approach, the progress of knowledge, the translation of scientific results into application and the proof of commercial success. This year, the prize went to the young scientist Apoorva Sharma from Chemnitz University of Technology for his contribution “Prospects of laser annealing for magnetoresistive sensors and MRAM manufacturing”.

    The most exciting poster contribution was awarded on the last day of the event. The winner was Sven Nitzsche from the FZI Research Center for Information Technology for his poster “Comparison of Artificial and Spiking Neural Networks for Ambient-Assisted Living”. Mr. Nitzsche is thus already the first confirmed speaker of the 16th SSI next year. He follows his predecessor, Claudia Bruno, who was the winner of the Best Poster Award 2021. This year, virtually connected, she presented her talk on last year’s winning paper and subsequent progress once again. In addition, Bruno Fain of CEA Leti received the Best Paper Award 2021 during this year’s conference dinner – i.e., the award for the best conference paper of the previous year.

    The organizers of SSI – Fraunhofer ENAS, EPoSS Association and Silicon Saxony – would like to thank all speakers for their contributions and the participating companies and institutions Robert Bosch, Bosch Sensortec, Lynred, Renault, Infineon Technologies, STMicroelectronics, Fraunhofer ENAS, Fraunhofer IPMS, Tyndall National Institute, CEA-Leti, TU Chemnitz and TU Delft for their exciting technical content. Finally yet importantly, we would like to thank all participants of this year for their interest and all sponsors for their important support.

    We are already looking forward to the Smart Systems Integration 2023 in Flanders/Belgium.

    Award Winners of the SSI 2022

    Already since 2007 it is tradition at the International Smart Systems Integration Conference to award a Best Paper and a Best Poster Award with an endowment of 500 € each. Both prizes are sponsored by EPoSS - the European Platform for Smart Systems Integration and Fraunhofer ENAS. In addition, the third prize is the Thomas Gessner Award, which was awarded for the third time in 2022.
    While the best poster will be selected by all participants of the conference and already announced at the end of the conference, the Best Paper Award winner will be nominated by the committee. The award winner will be selected from 7 to 10 candidates based on his presentation and paper and will be announced a few weeks after the conference. The award will be presented to the awardee at the Smart Systems Integration Conference 2023.

    Award Winners of the SSI 2022

    Best Paper Award

    The Best Paper Award of the SSI2022 held in Grenoble on 27/28 April 2022, goes to Moritz Schlagmann, Infineon Technologies for his paper "Miniaturized and Highly Integrated Humidity Sensor with Biocompatible Sensing Material for Smart Farming". Moritz Schlagmann, works at Infineon Technologies in Neubiberg, Germany. The uniqueness of this leaf moisture sensor, developed within the European project "PLANtAR", lies in the combination of miniaturized design (1mm x 1mm), an integrated ASIC for electronic readout, biocompatibility, chemical resistance, temperature independence, moderate hysteresis as well as long-term measurement stability - and is therefore very useful for smart farming in the context of integrated crop protection. The publication reports on the development, manufacture and testing of the sensor, as well as a comparison with other available moisture sensors. The sensor's field of application is not limited to leaves, but wherever moisture needs to be measured and analyzed in situ; a change of housing material makes it suitable for other applications.

    Best Paper Award

    Best Poster Award

    The most exciting poster contribution was awarded on the last day of the event. The winner was Sven Nitzsche from the FZI Research Center for Information Technology for his poster "Comparison of Artificial and Spiking Neural Networks for Ambient-Assisted Living". Mr. Nitzsche is thus already the first confirmed speaker of the 16th SSI next year.

    Best Poster Award

    Thomas Gessner Award

    Already at SSI 2022 in Grenoble, the Thomas Gessner Award for an outstanding scientific PhD thesis was presented for the third time but for the first time to a scientist of TU Chemnitz. The scientist Dr. Apoorva Sharma, staff member of the Chair of Semiconductor Physics headed by Prof. Dr. D. R. T. Zahn, received the Thomas Gessner Award in Grenoble for his dissertation "Correlation Between the Structural, Optical, and Magnetic Properties of CoFeB and CoFeB Based Magnetic Tunnel Junctions Upon Laser or Oven Annealing".
    The dissertation was carried out as part of a joint project of the Chemnitz University of Technology, the Fraunhofer Institute for Electronic Nano Systems, and the Laser Institute at Mittweida University of Applied Sciences with financial support from the German Research Foundation (project number 28219353). It provides the first proof of concept that laser annealing can be used as an efficient, fast, and reliable direct-write technique for magnetic multilayer systems.

    Thomas Gessner Award

    Look Back 2021

    The 1st completely virtual edition of the Smart Systems Integration Conference & Exhibition, short SSI, took place from April 27 to 29, 2021. More than 120 participants from all over Germany, Europe and the world took part in the online event. Originally it was planned to hold the conference in Grenoble/France. Now the event took place on an individually provided online platform due to present circumstances. Highly interesting keynotes, a total of 53 speakers spread over five tracks and nine sessions as well as a poster session with a total of ten contributions and organized topic tables for discussions were among the highlights of the three-day event. In addition, the Thomas Gessner Award was presented for the second time during the event.

    With a new technical organizer, Silicon Saxony, the 14th Smart Systems Integration Conference 2021 started for the first time as an online event. Even before the start of the SSI, the participants received a small Saxon welcome. Sponsored by the Saxony Economic Development Corporation, small care packages with snacks and information materials were sent out to bring a smile to the faces of all participants during these times of limited contact. Accordingly, the participants of the SSI started their first day of the event on April 27 in a good mood and well strengthend. The Conference Chairs Prof. Thomas Otto (Fraunhofer ENAS), Dr. Stefan Finkbeiner (Bosch Sensortec and EPoSS) and Emmanuel Sabonnadiere (CEA-Leti) opened the conference.

    Already the four keynotes by Lucilla Sioli, Director for Artificial Intelligence and Digital Industry, European Commission (Electronic and Photonic Smart Systems: Contributing to a European green, digital and sovereign future), Jean-François Delepau, CEO Lynred (LYNRED's leadership at the dawn of infrared imaging applications), Remi Bastien, Renault Group (Power Electronics - An opportunity for Europe's Industry and a valuable field of cooperation between Automotive & Electronics) and Elisa Vianello, CEA-Leti (The role of resistive memories to enable frugal AI devices) showed the scope of this year's SSI. The five tracks were oriented along the entire value chain of Smart Systems and addressed Technology Readiness Levels (TRL) between 1 and 9, ranging from key enablers for smart systems of the next generation, to technologies and applications in various industries. Strategic topics were also discussed. 53 speakers - some live, some in recorded presentations - provided ample input and reasons for personal exchange.

    The Thomas Gessner Award was presented for the 2nd time. It is a contribution of Fraunhofer ENAS to promote applied research by awarding a prize for excellent scientific work within the annual Smart Systems Integration Conference. The award is aimed at national and international master and doctoral students in the field of Smart Systems Integration whose thesis is evaluated at least with "very good" and does not date back more than two years. The evaluation procedure takes particularly into account the novelty of the scientific and methodological approach, the progress of knowledge, the implementation of the scientific results in application and proof of economic success This year, the prize went to the young scientist Dr.-Ing. Ulrike Nabholz, Robert Bosch GmbH, for her doctoral thesis on "Physical Modeling and Identification of Nonlinear Effects in Microelectromechanical Systems", which she prepared in cooperation with the Chemnitz University of Technology and successfully defended in 2020. All participants of the conference were able to evaluate the poster contributions. On the last day of the event, the most exciting contribution was awarded the Best Poster Award. The winner was Claudia Bruno from STMicroelectronics for her poster presentation on "Embedded artificial intelligence approach for gas recognition in smart agriculture application using low cost MOX gas sensors".

    Also in the next three months, all contributions of this year's SSI will still be available on the event platform. We would like to thank all speakers for their contributions and especially the companies and institutions Robert Bosch, Bosch Sensortec, Lynred, Renault, Infineon Technologies, STMicroelectronics, Fraunhofer , Tyndall National Institute, CEA-Leti, TU Chemnitz and TU Delft for their exciting technical presentations. Fraunhofer ENAS, EPoSS and Silicon Saxony would like to thank all participants for their interest and all sponsors for their important support during these difficult conference times.

    Best Poster and Best Paper Award Winner 2021 selected

    Since the establishment of the conference in 2007, it is a tradition to select and award the best poster as well as the best paper at the Smart Systems Integration Conference. Both awardees receive a donation of 500 euros that are sponsored by EPoSS – the European Platform on Smart Systems Integration and the Fraunhofer Institute for Electronic Nano Systems ENAS.

    All attendees of the conference vote for the best poster of the conference. The selected winner is announced at the end of the conference during closing remarks. The committee also nominates the best paper candidates and the winner is selected out of 7 to 10 candidates based on the presentation as well as the written paper.

    Best Poster and Best Paper Award Winner 2021 selected

    The best poster award winner at the SSI 2021 is Claudia Bruno from STMicroelectronics with her poster titled “Embedded artificial intelligence approach for gas recognition in smart agriculture application using low cost MOX gas sensors”, as previously published in the after conference press release.

    The best paper award winner of the 1st fully virtual edition of the SSI 2021 is Dr. Bruno Fain from CEA-LETI with his paper “Beamforming with AlN-based bimorph piezoelectric micromachined ultrasonic transducers“. In his paper, he presented a piezoelectric micromechanical ultrasonic transducer (pMUT) with multiple membranes used for airborne pulse-echo measurements with an angular resolution of 18 degrees.

    Both awards will be presented to the winners at the Smart Systems Integration Conference & Exhibition 2022, which will take place April 26 to 28, 2022 in Grenoble.