Smart Systems Integration (SSI)

The presentation sketches the mutations and the challenges introduced by the advent of ubiquitous Internet of Things solutions. Our society is increasingly reliant on smart devices and services, from home automation to manufacturing, medicine, finance and transport. These billions of inter-connected devices with sensors and actuators, reachable almost instantaneously through the ubiquitous Internet from any location and any other device in the world, are collectively called the Internet of Things (IoT). All too often, “reachable” means reachable by unauthorized entities as well as intended users. Consequently, as a society and global economy, we have become very exposed to a plethora of new IoT security-related threats that never existed before, some of which have the potential to impact profoundly on our way of life.

The active medical implants will soon become flexible, both structurally and functionally. In this presentation, I will address how we can shape this change in packaging, encapsulation and functionality paradigms and how you can truly feel better.

Electronic Control Systems for Decentralized Renewable Energy Infrastructure
Decarbonization of the energy system requires sector coupling and rapidly ramping up decentralized renewable energy (DRE) supply. The challenges this poses for the transmission and distribution infrastructure are analyzed. DRE system solutions addressing these challenges and Smart System Integration opportunities are outlined. Project examples reviewing the actual status and research and innovation opportunities in the field of DRE supply and storage including hydrogen will be presented.

As electronic systems become more complex and CMOS scaling becomes more specialized, a variety of heterogenous device technologies will be required to realize them. The highly successful system-on-chip (SoC) design methodology of complex systems will need to evolve to an effectively “3D-SoC” heterogeneous system design methodology. This requires a functional partitioning of the systems in separate die (“chiplets”) that require high bandwidth, low latency, and low energy 2.5D and 3D integration technologies to “reconstitute” the systems. A broad range of possible technologies is available to realize this. Proposing a hierarchical view of the 3D interconnect fabric, we define a 3D interconnect technology landscape, that extends from the package-level all the way to the transistor level, spanning eight orders of magnitude in 3D interconnect density. This landscape is highly dynamic, as each technology has its own roadmap and scaling roadmap. This presentation will cover imec’s contributions to this 3D interconnect scaling technology in the areas of die-to-wafer and wafer-to-wafer stacking.

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Mechanical load is a significant impact on the solder fatigue life of printed circuit board (PCB) components. This contribution discusses both the effects of the mechanical load itself and the interactions with other parameters. Results of a design of experiments are shown and discussed.

A fingerprint architecture for use as a hardware security component is presented. This is based on a micro-electro-mechanical system (MEMS), which acts as a physically unclonable function (PUF) and is used to generate a fingerprint. This should allow electronic components to be clearly identified and thus ensure protection against unauthorized exchange or manipulation. The key is generated and checked via fingerprint electronics connected to the MEMS, which is implemented using an FPGA.

Collaborative robots have intrinsic high task flexibility and scalability with reduced commissioning costs respect to classic automation. However, their level of collaboration is hugely limited by the human-robot interfaces design and by safety regulations. Using motion capture technology to track the worker and feed this information to the robot could improve the collaborative behavior of the robot, itself, maximizing productivity and ensuring the adequate level of safety.
This work presents the creation of an open access database of motion tracking data of the hand, collected from two different motion capture technology while performing several industry 4.0 related tasks.
Preliminary results on the comparison between the two datasets to train AI-based task classifiers are also presented. The ultimate goal in fact is to develop a real-time task classification strategy able to reliably identify the task the operator is performing with minimal sensing technology.

Building construction of high-tech fabs by means of BIM (Building Information Modeling) creates the fundamentals for a digital twin of the real fab. The result is the model of a production facility with a high transparency. But it is only a static model. Furthermore, you can use this model as a fundamental for integrating the data of the fab in operation. This requires the application of Smart Integrated Systems to obtain all measurement data and data analyses. This is prerequisite to get to a well working digital twin of a running fab. By means of that you can create a cyber-physical system.

Eavesdropping on robots: How a tiny acoustic sensor can do the work of a highly trained maintenance specialist. Infineon, GlobalFoundries and others are collaborating to implement predictive maintenance for the overhead hoist transport system used in highly automated semiconductor fabs.

A cost-efficiently produced and environmentally friendly sensor system for plants and agriculture fields is presented. The system continuously measures soil temperature, soil tension and, in the future, leaf wetness and nitrate concentration in the soil. A gateway collects the data transmitted wireless by the distributed sensor devices in the fields and brings it to a central server running an expert system. Due to the biodegradable and inert materials used, the sensor system can remain in the field after the harvest season and does not have to be recollected.

We present a end-to-end solution for the training of vision based pose estimation networks, based on the synthetic images. By sampling real-world application details (surface texture of objects, background, ambient lighting and others), we can generate quasi photo realistic images with perfect annotations. We then show the usefulness of this approach by applying it to an interesting industrial case study.

Hierarchical Machine Learning (ML) can be achieved by splitting an ML model in parts and running it on multiple devices in a network. However, this can result in significantly large intermediate feature maps (activations) that need to be communicated over the network. In this paper, we present a novel entropy-based technique that learns to intelligently compress activations during training and efficiently encodes them during inference. We show that in an early-exit configuration, entropy regularization with Huffman coding can greatly reduce the communication overhead, with a minimal loss in classification accuracy.

In the study, fifteen participants were asked to wear pressure insoles while carrying out three different industry tasks: manual handling, assembly, and pick and place. Statistical and task-specific features were extracted from the data collected, and were used to train a machine learning classifier to identify the task based on plantar pressure of the participants. Task detection, in conjunction with weight assessment of the manipulated object or tool, are key elements in biomechanical models for human endurance, which are also related to fatigue prevention research. Pressure insoles can be included in the wearing equipment of smart workers and be fully integrated within a wireless sensing framework of an industry 5.0 setting, leading to the comprehensive overview and monitoring of the safety status of the industry worker.

Fuel cell (FC) electric vehicles are rapidly gaining importance in the automotive industry, leading to a industry need for precise and efficient test systems. One key component of FC test systems is the hydrogen thermal conditioning unit, for which several optimization approaches through multi-material additive manufacturing (AM) and sensor embedding will be presented and discussed. Aside from novel thermal management concepts, an innovative AM-enabled sensor system for precise gas flow rate measurement in harsh and dynamically changing conditions will be described. The results underline the high potential of AM-enabled measurement systems for the application in automotive test and measurement solutions.

Presentation of the defect detection pipeline that was developed within the PILS project by the vision team withing Flanders Make in cooperation with EDM from the university of Hasselt.

Proof of suitability of ultrasound in versatile ways for simple hand gesture recognition with MEMS ultrasonic transducers. Presentation of pipelines from data acquisition to gesture recognition. Assessment of hardware necessities for different types of gestures. Comparison of different data formats for storage and processing of the acquired data, along with algorithms for hand gesture recognition and verification of the need for machine learning for the task.

-In this work, we present latest achievements at VTT within manufacturing of wearable electronics
-This includes sensor solutions that are based on printing of wirings and direct assembly of electronics components directly on elastic, soft substrates such as thermoplastic polyurethane (TPU); and hybrid approach, in which electronics are placed on a separate re-usable module and attached to a disposable patch using snap connectors.
-In particular, we will focus on roll-to-roll printing and post-processing steps such as lamination, cutting and via formation in realization of a fully functional single-lead wireless ECG sensor patch utilizing the hybrid approach.

We were enabling smart farming applications with bio-compatible microclimate and leaf wetness sensing for disease prediction. Therefore, we took the next step, tested the developed sensor under relevant greenhouse conditions, and compared them to state-of-the-art sensors. With these results and findings, we want to develop an advanced demonstrator.

Air pollution is a serious global problem impacting health of many people every year. A major component of this pollution consists of fine dust known as particulate matter designated as PM2.5, which are solid and liquid particles smaller than 2.5 µm.
Bosch Sensortec innovation brings to you a revolutionary miniaturization of PM2.5 air quality sensor making it the world's smallest. It is a natural fit for ultra-compact loT based smart home and smart building devices.
In this presentation, after briefly touching the air pollution problem, the functionality and benfits of Bosch Sensortec's new particulate matter sensor will be presented.

The electrification of the powertrain is leading to profound changes in the automotive industry. However, manufacturing must continue to maintain high quality standards.
Despite the widespread use of advanced methods for preventive QM management, nonconformities still occur. This presentation will introduce a novel KG-based and interactive IT application for managing nonconformities using problem solving in 8D.

We propose a method based on Artificial Intelligence techniques that allows to
estimate the lifetime of a Power MOSFET starting from the evaluation of the its RDS_on. The model is capable to make predictions for understand when the device may stop working well.

The Internet of Things is becoming a keystone for the prosperity of our society. Powering the microscale sensors of the loT nodes with long-term autonomy in a sustainable manner is a majo challenge that needs to be tackled. In this presentation I will present our approach to that problem, profiting waste heat sources by means of microthermoelectric generators based completely on silicon, a low cost and environmentally sound material.

The presentation summarizes the design and fabrication of hollow polymer microneedles (MN) on flexible substrates. The MN sheets are the key microfluidic elements for the extraction of interstitial fluid in a wearable and minimally invasive sensor patch. The interstitial fluid is a rich source of relevant biomarkers, which surrounds the cells and tissues of the body and its composition is very similar to blood. Therefor it is an ideal candidate for continuous health monitoring applications. Further, we present the results of successful MN penetration experiments and their capabilities towards liquid extraction and transportation. The work presented was performed within the EU H2020 Research and Innovation Action project "SIXTHSENSE", Grant agreement ID: 883315.

This work presents the modelling and characterization of a miniaturized thermal gas sensor. In the proposed measurement technique, a polysilicon heater placed on a thin membrane is excited with a periodic heating voltage and the resulting temperature response is measured in the frequency domain using thermopiles and a lock-in amplifier. A thermal lumped
element model allows to interpret the gas specific temperature signal yielding the estimation of thermal conductivity and volumetric heat capacity. With this approach, we aim to fundamentally improve the gas sensing performance by increasing
sensitvity and selectivity of existing thermal devices.

My presentation focuses on the development of a carbon-based printed thermoelectric generator on paper substrate for cold-chain monitoring. The presentation will initially discuss the preparation of ink to achieve good thermoelectric properties. Then, a thermoelectric characterization of materials printed on paper starting from the previously optimized ink will be described. Finally, a first prototype thermoelectric generator will be presented.

In this contribution selected novel research results and developments related to advanced sensor technologies and system integration methods for innovative automotive test systems will be presented. After a general introduction, novel electronic- and photonic-based sensor concepts and measurement solutions in areas including e-mobility and ADAS/AD will be described. In addition, selected use cases and research results of novel sensor concepts and (pre-)development components enabled by Additive Manufacturing (AM) will be discussed.

A Smart Illuminance Sensor is presented which is a stand-alone measurement device detecting solar and artificial light to perceive and categorize adverse light conditions or critical illumination scenarios & scenes. With respect to ADAS/AD applications on driving vehicles, the Smart Illuminance Sensor determines the direction of sunlight or any other artificial illumination source with respect to the vehicle in real-time. It is based on photosensitive sensor units aligned in a 4-quadrant arrangement from which the directivity/diffusivity of the impinging light is deduced to distinguish direct light from diffuse light situations (e.g.: bright/sunny daylight vs. shadows) or adverse lighting conditions (e.g.: night or thunderstorms).

Three-dimensional ultrasound has initially been used to address volumetric imaging for diagnostic purposes and represents the leading-edge technological orientation in both transducer and IC (integrated circuit) architecture and design. However, new applications are coming up like biomarker measurements, preoperative navigation, real time surgery guidance or therapeutic procedures where 3D ultrasound modalities are key.
This paper presents an ongoing development where a large 8MHz matrix transducer has been assembled with multiple ASIC dies in a reconfigurable way, capable to fully image the upper carotid window.

Harsh environment conditions and different mission profiles create challenging thermos-mechanical requirements for appropriate sensor devices. Furthermore, influences from the specific design or production related tolerances have to be taken into account. A simulation-driven investigation of production related thermos-mechanical effects for an AMR sensor-based current measurement device will be presented. As the device is designed as a molded SO16 System-in-Package (SiP) it undergoes different process and curing steps during the manufacturing process. A resulting deviation of the final offset voltage of the sensor cells can lead to a manifestation of a sensor calibration inaccuracy. The aim was to examine the strain distribution at the AMR sensor surface along the process chain.

With the growing concern for air quality and its impact on human health, interest in environmental gas monitoring has increased. However, chemi-resistive gas sensing devices are plagued by issues of sensor reproducibility during manufacturing. To adress this, this work proposes a novel approach for detecting sensor-to-sensor variations in sensing devices using the explainable AI (XAI) method of SHapley Additive exPlanations (SHAP). This is achieved by identifying sensors that contribute the most to environmental gas concentration estimation via machine learning, and measuring the similarity of feature rankings between sensors to flag deviations or outliers.Overall, the results show that our approach improves the understanding of sensor behavior, successfully detects sensor deviations down to 5-10% from the normal behavior, and leads to more efficient model preparation and calibration. Our method provides a novel solution for identifying deviating sensors, linking inconsistencies in hardware to sensor-to-sensor variations in the manufacturing process on an AI model-level.

This presentation focuses on neuromorphic Oscillatory Neural Networks (ONNs) based on an FPGA implementation of ONN. In particular, we propose a solution to perform on-chip learning with the ONN on FPGA to perform obstacle avoidance on a mobile robot equipped with proximity sensors. We consider training the ONN for obstacle avoidance depending on its response to the environment.

In our paper we study the energy saving effect of approximating sensor signals with piecewise linear approximation techniques on smart wearable sensor platforms in order to reduce the amount of sensor data that has to be transmitted wirelessly. Due to the reduction on the sensor sub-system itself power consumption can be significantly reduced while important signal information for gesture and activity recognition can be preserved.

This presentation covers a fully-digital sigma-delta digital-to-analog converter (DAC) for hearing aids. The design is first synthesized on FPGA hardware. After verification, it is manufactured in 22 nm FDSOI CMOS technology. We present two different topologies and measurement results.

The project integrates a novel design of TEG (provided by Analog Devices) into a simple ultra-low power wireless sensor node. The TEGs are developed at chip-scale (<25mm2) and this makes them more suitable for mass-manufacturing and wearable technologies compared to off-the-shlf TEGs. The presentation details the design, testing, integration and future potential of this technology.

The presentations discusses the properties (dimensions, material, RF) of through SiC vias für interposer technologies in comparison the TSVs. The propagation of RF modes (slow wave, dielectric-quasi-TEM and skin-effect) is calculated. Equivalent circuit and full-wave simulation models are discussed.

The e-mobility is our future.
1. greater efficiency of the transport system
2. lower environmental impact thanks to the reduction of traffic and the pollution it causes.
Electric cars are key to shifting energy use in transportation away from fossil fuels and towards renewables.
Power conversion and traction electronics in electric cars require devices with high-temperature and high-voltage performance.
So the main topic of discussion will on power electronics technologies that enable e-mobility giving power, efficiency, innovation.

Nanostructured carbon can be used as transducer material for electrochemical probes for different analytes, such as polycyclic aromatic hydrocarbons (PAH). The doping of the nanostructured graphite layers with heteroatoms, like nitrogen, during the PECVD growth, improves the electrochemical properties of the carbon material deposited on silicon, in terms of electron transfer or pretreatment requirements. The N-doped nanocrystalline graphite layers (NCG) with different dopant precursor gas flows (ammonia) were tested against different aromatic hydrocarbons, showing the highest affinity for anthracene sensing among them. The N-NCG material with the lowest ammonia flow, in combination with graphite nanowalls, enabled the record of high current intensities in presence of anthracene at different concentrations in electrolyte solution based on lithium perchlorate in acetonitrile/water (v/v: 80/20), to obtain a calibration curve for anthracene quantification as electrochemical probe developed from nanostructured carbon materials.

Using trees as an example, the presentation shows how three-dimensional objects can be recognised and localised. This is done by sensor data fusion. Data from a self-developed panoramic camera and a stereoscopic multispectral camera as well as a commercial DGPS and a digital compass are fused. By combining these sensors and using AI-supported algorithms, real trees can be reliably detected and localised with an accuracy of a few square decimetres for a specific application on a land surveying robot.

This paper presents the preliminary results for developing a sensor based on a Molecularly Imprinted Biopolymer
(MIP)-Surface Acoustic Wave (SAW) device for highly sensitive detection of glyphosate (Gly). The SAW delay line
configuration-based sensor was manufactured on B-LiTaO3 piezoelectric substrate, using the surface micromachining technology. The operation frequency of the sensor was 121 MHz. The MIP film was electrochemically deposited on gold sensing area using the cyclic voltammetry (CV) technique. The MIP was successfully integrated with the SAW device and characterized as Gly recognition element, proving to be a reliable method for on-site herbicide detection.

The work is intended to specify a risk value for a given system, i.e., a lane-keeping robot.
The robot's functional task is to stay between two given lanes base on the camera frame that is fed to the system as the input. The input will be disturbed using a fault injection tool that represents some of the real-world hardware or environmental faults. A health index will be determined according to the risk value and the injected type and intensity of the fault.
According to the health index, the robot will carry out a necessary control action for ensuring the safety of the system.

Electronics supply chains span around the globe and typically involve a larger number of partners. From a security perspective it is challenging to verify that a final product is free of weaknesses and backdoors, and does not contain gray market components. This talk addresses vulnerabilities along the supply chain and presents technologies to increase the trustworthiness of electronics.

We elaborated a proof of concept for a drone guidance system for the application of sensor node attachment on power lines. A vision-based positioning system has been developed that includes a camera cable detection algorithm and a simplified stereo-matching approach. The positioning system has been implemented in python and tested in a simulation environment.

This paper proposes a sensing system that is based on a microfabricated gold three-electrode device (AuE) integrated with Fe2O3 nanoparticles (NPs) loaded on graphene (GR), as nanozyme for the electrochemical sensor for detection of tannic acid (TA). The nanozyme Fe2O3/GR was structurally, morphologically, compositional and electrochemically characterized. Further, the response characteristics (such as limit of detection, sensitivity, etc) for the oxidation of TA was assessed using the DPV technique with the Fe2O3/GR-Au sensor. Finally the developed nanozyme based sensor was validated by measuring the TA, in presence of possible interfering species and from surface water samples.

Advanced Packaging and Heterogeneous Integration – are Key Enabler for Electronic Systems

With the loss of impetus of Moore’s law, the dramatic shift in geopolitical assessment of the semiconductor industry’s position and the tendency of the US and Europe to pull back advanced electronics expertise to their respective main lands, have resulted in a significant push for the role of advanced packaging and an increasing importance of heterogeneous integration. Alongside the path to pursue integration on Si platforms, novel approaches to use chiplet concepts and substrateless integration with much larger fabrication sizes than the established 300mm wafer format are not just emerging, but rushing to mainstream acceptance. This presentation will describe the value of advanced packaging as an HI platform. Key features in leading edge 2D and 3D technologies, such as wafer and panel level technologies will be described and new package developments from SoC to chiplet architecture will be presented. From the perspective of R&D for heterogenous integration and packaging as well as for early technology adopters, this spells a bright future, pushing the envelope on innovation advancement significantly.

In this presentation we show the combination of the ability of electrochemical sensing and mechanical bending sensing in flexible fibers. The fibers were functionalized with sensing membranes, which could successfully detect electrolytes and others by electrochemical sensing. The bending sensing was done by integrated stress-impedance strain sensing elements.

1) Roof structures are evolving to provide new waterproofing materials that increase the comfort of homes and roofs lifespan. Some of the market roof solutions present durability issues and may result in watertightness losses and consequent water infiltration causing anomalies. This presentation will explain the goal of the Smart Roof System, which is to develop a water-based polymeric membrane that presents equivalent technical performance to the best solutions of waterproofing liquid membrane solvent-based using an innovative reinforcing textile structure. This structure comprises the integration of an active heating system with temperature and moisture sensors and an eletronic system capable of monitoring the sensor data and activate the heating system. The resultant product mitigates cracking and reduces durability problems of the water-based polymeric membrane.

2) STVgoDIGITAL PPS4 – Worker aims to develop disruptive solutions based on sensory and active components within a garment to support repetitive movements that may cause injuries and/or pain to seamstresses. A textile-based exoskeleton with ergonomics concerns and a challenging textile-based implementation was developed to reduce  the physical efforts required to perform diferente sewing operations inindustrial process. Besides, it would correspond to essential biomechanical specifications to adapt to the human body and avoid common trade-offs related to human-device interfaces.The textile-based exoskeleton that will support the transition to Worker 4.0 generation integrates: a) a sensing system for the detection of movements in real-time, to make it possible to identify the ergonomic posture of the worker, as well as the risk associated with the execution of repetitive working tasks; b) an actuation system to increase body strength and support the upper limb segments correctly, reducing physical efforts and fatigue, eliminating unnecessary movements, and contributing to develop a better ergonomic assessment of the working postures and layout; and finally c) learning and actuation algorithms, with some degree of variability, focused on several movement natures, such as the abduction and elevation of the upper limbs.

This contribution presents a new approach for optically assessing hazardous road conditions, such as ice patches and wet surfaces, which can easily be integrated with commercially available CMOS image sensors, boosting the safety features of selected Advanced Driver Assistance Systems (ADAS). After a basic introduction to the novel sensor solution, the process of the integration of the system behind the windshield of a test vehicle will be described. Finally the problems encountered that have to be solved before the sensor system can be used in a modern ADAS will be discussed.

Security has evolved as a technological driving force for smart systems. To date, product safety in terms of authenticity of components and other hardware elements of the value chain is realized by analogue and digital methods. Using these technologies fraud is still happening as these technologies do not work for supply chains including goods beyond the component level, e.g. raw or biodegradable materials or a transient morphology. Responsibility and sustainability attributes in the value chain are closely linked to credence attributes. In order to understand how miniaturized smart systems can contribute to secure credence attributes and responsibility in products and along supply chains a SWOT analysis will be presented.

Society is getting older and older, especially in Europe. Technical aids will have to support home care in future. The focus is on the monitoring of the persons and their daily movements. Within this publication for the first time a concept for the application of multiple radars for a home automation application in an age object is presented, the conversion as well as the validation is described.

This contribution shows the development of a micro fuel cell system based on the ceramic multilayer technology. All necessary components, like the hydrogen tank based on metal hydrides, a planar fuel cell stack, as well as necessary micro valves in multilayers are manufactured. The target size of the system is similar to a rechargeable lithium button battery (CR2450) and can substitute these. By use of metal hydrides as hydrogen storage, power densities of up to 290 Wh/l can be achieved and exceed combined with extended operating temperatures and increased cycle stability, the lithium battery (CR2450) by more than 50%. By the potential of miniaturization of the ceramic energy system and the scalability to the specific application dimensions and performance, completely new possibilities are offered as a longterm stable energy storage, for example in the field of autonomous sensor systems for the Internet of Things (IoT).

I will present an approach to automatically translate Simulink models into SystemC-AMS components thereby preserving the model's structure and hierarchy. It is shown that the generated models do not significantly suffer from performance loss. The approach allows the reuse of models from exploration tests for virtual prototypes that are highly used for hardware/software integration.

We present the preliminary results related to synthesizing nanocrystalline graphene fluorinated layers and designing an array of resistive RH sensors based on these layers.These sensitive layers are obtained by different plasma treatments (Ar, Ar-CH3, and Ar-CF4). The morphology and the composition of the sensing layers are investigated through Scanning Electron Microscopy (SEM), Atomic Force Microscopy (AFM), and RAMAN spectroscopy. The RH sensors were fabricated using MEMS technology. These results potentially support further work to optimize the sensing structures to better humidity response in time to develop the resistive sensors for modern agriculture.

Trustworthiness of electronics components and systems has become a mandatory subject that needs to be addressed in microelectronics manufacturing, because trustworthy electronic systems enable reliability, safety and security of the functions provided. Due to the importance of these systems in our everyday life, this effort is seen as a basis to achieve sovereignty on economic and social level. Typically, this topic is dealt with on chip or software level. But also packaging offers relevant contributions to ensure trustworthiness, where three main topics in the field are discussed here:
A) Detection of counterfeit components
B) Protective structures as technological buildings blocks (Protection/Obfuscation)
C) Infrastructural measures to ensure trustworthiness during manufacturing
This publication will showcase some of the solutions found during advanced packaging research and will thus provide examples for the implementation of measures towards trustworthy electronics with a strong focus on packaging technologies.

Mild Cognitive Impairement screening to better understand cognitive abilities of the driver, and adapt autonomous driving functions accordingly, in order to improve road safety, driver acceptance, and inclusiness of mobility.

Aquaculture farming faces challenges to increase production while maintaining welfare of livestock, efficiently use of resources, and being environmentally sustainable.
This research focuses on developing an resource constrained embedded system and associated artificial neural network that can estimate wave height using acceleration and
angular velocity data recorded by a low cost IMU sensors

Quantum Dots(Ag-In-S) is deposited in plasma enhanced gold substrates using force-controlled Fluid-FM technique and micro-pipetting technique. Functional and morphological analysis of the QDs are carried out using Atomic Force Microscope, Optical Microscope, Fluorescene Microscope, PL Microscope.

This paper describes the research on the development on SiC Interposer technology with Through SiC Vias (TSiCV). It demonstrates a SiC Interposer with the Flip-Chip assembled Chips with different thicknesses. It gives an overview over the different approaches of via formation and describes the fabrication of a SiC Interposer and highlights the differences between the via formation between silicon and silicon carbide.

MEMS resonators were vacuum-encapsulated at single Pa by Silicon Migration Sealing (SMS) technology. The tuning-fork resonators were fabricated on a 6-inch SOI wafer and capped with a cap wafer with submicron release holes by direct bonding. After SMS, the encapsulated device was capacitively driven and sensed, and the Q factor showed 18432.8 after 430 ℃ 27 hr. After long term annealing at temperature as low as 145 ℃, the Q factor of the device reached 36759.9. Judging from the Q factor, the vacuum level of the sealed cavity is improved from 8 Pa to 1.5 Pa.

We Leverage synthetic data generation in the context of object detection, and demonstrate
robustness of trained models with respect to :
• Complex and cluttered backgrounds
• Varying exposure/lighting conditions
• Occlusion resistant

In this work, we present the combination of two emerging technologies A Quantum Dot based light emitting diode (QD-LED) with an ultrathin and highly flexible Parylene printed circuit board (PCB) to equip a purely mechanical watch with smart features. Doing so, the target application is the pressure monitoring during diving and alerting the user in the event of an exceeded pressure change rate.

Title: Advanced Packaging in Europe: Enabling a New Generation of Silicon Systems

Demand for new efficiencies in the semiconductor design and manufacturing process is propelling the crucial role of packaging to deliver on requirements related to power, performance, and miniaturization. During his keynote, Jean-Marc Yannou will explore the heterogeneous integration and chiplet era, and describe how advanced packaging technologies are enabling highly complex system integration solutions across automotive, power, and sensor markets. He will then turn his attention to Europe, and delve deeper into regional market and technology nuances and the packaging creativity accelerating a smarter and more sustainable world for generations to come.

I will speak about Advanced Packaging Technology & Market trends. I will share its market forecast for the coming years. I will also present its supply chain and its importance.

In our presentation, we will show how the Ultra-Precise Deposition (UPD) technique (see: Scientific
Reports 12(1), 2022, p. 1-18) approaches the main challenges of additive manufacturing for system
integration on the microscale. These challenges include: 1. Development of materials that can be
reliably printed and offer the desired electrical and mechanical properties; 2. Controlling the printing
process. Ensuring the printed structures are deposited in the correct locations and forming the desired
shapes; 3. Tackle manufacturing complexity, which increases with the complexity of the circuits.

The "BOOSTER PACKAGING", funded by the French Alps Region, was a CSA to guide the Region on how to promote and support this crucial subset of the Chips Industry, map the eco-system, technologies, SWOT, quantification.
With the ultimate goal to suggest policies for the Region to implement. Methodology is described.
One of the output was the foundation for a nation-wide extension and this caught the attention of the Commissionner to use this as a bottom-up industry driven guidance for the EU CHIPS ACT and reserve funds for a "PACKAGING ACT".

The presentation covers the work that has been done in association with the paper. The methods used and the results are described. The paper is characterized by the very practical approach. This should also be the focus of the presentation.

This publication presents the results of the near-field to far-field transformation in the use-case of a spherical dipole used a reference object. The dipole has a comb generator with 10 MHz comb frequency to emit a broadband electromagnetic signal for test and characterization purposes. The tangential near-fields on the Huygens-Box of the dipole are captured at a minimum distance of 1 cm to the sphere. The results of near-field scans are presented and compared to those of a simulation model.

Semiconductor Packaging, Assembly, and Test in Europe: Landscape - Positioning - Challenges for Advanced Packaging": While the packaging industry in other regions of this world is adapting latest advanced packaging technologies such as 2.5D Interposer, 3DIC, Silicon Bridge, Embedded and Fan-Out Wafer- and Panel Level Packaging, Direct D2W and W2W Hybrid Bonding, our European independent Packaging, Assembly, and Test Service Providers (SPAT-SPs) can't even offer Fan-In Wafer Level Packaging/ WLCSP to its customers. European IDMs and Foundries, of course, have these capabilities, but are working captive only. "From Lab-to-Fab" transfer does not work well in Europe. We are facing an innovation barrier here. The gap between our leading-edge packaging R&D and package manufacturing in Europe is large and further increasing. As an opportunity and threat at the same time, the packaging industry is highly competitive. Electronics Manufacturing Services (EMS) are moving upstream in the value chain taking over typical Outsources Semiconductor Assembly, and Test (OSAT) Standard Packaging (SP) business. Foundries and Material Manufacturers are moving upstream in the value chain entering OSAT Advanced Packaging (AP) business. What does it mean for Europe and the targeted higher regional supply chain independency?