• Conference & exhibition: April 8 – 10, 2025
  • Conference Dinner: April 9, 2025
  • Conference Language: English
  • Conference Location: Prague Congress Centre

PROGRAM / TICKETS 2025

You can view the program for the SSI conference 2025 here. It has not yet been finalized.
Book your EARLY BIRD ticket and save money untill February 28!

Check out the abstracts of the SSI speakers 2025

Conference venue 2025

The conference venue is the Prague Congress Centre. It´s located in the wider city centre of the metropolis directly at Metro C-Line Station - Vyšehrad, only two stations away from the centre of Prague.

Welcome!

Welcome to the Smart Systems Integration Conference! Our key mission is to align research, technology and dissemination activities along the entire value chain for future smart and sustainable system solutions. The Smart Systems community is joint by the system integration aspect covering the value chain from System on Chip via System in Package to System Applications – including hardware and software aspects. The conference connects participants from academia and industry as well as policy and decision makers. The three-day event is commonly organized by Fraunhofer ENAS together with the European Association on Smart Systems Integration – EPoSS to link technology and policy aspects in one event, while Silicon Saxony technically supports the conference organization.

The envisaged European autonomy on chips and the requirements for secure communication enhances the demand for joint efforts for integrated smart and sustainable system solutions on all levels. Still, the autonomy on chips must be discussed in the international context.

In an engaging and compact format, the conference provides a unique and valuable opportunity to interact with the stakeholders of the Smart Systems community along the value chain by means of technical sessions, strategy panels, job opportunities, podium discussions and exhibition booths.

Networking at the SSI

Once again, the SSI will be co-located with apc|m europe at the same place and time. A single ticket allows you to attend both conferences and increase your networking range.
A variety of networking offers enrich the scientific program: Exhibition booths of sponsors, exhibitors and companies and job opportunities enable a fruitful transfer within the community. Book your next interview with the smart system integration experts in the conference app.

PROGRAM 2025

The program for the SSI 2025 has not yet been finalized.

  • Conference Day 1 April 8, 2025
  • Conference Day 2 April 9, 2025
  • Conference Day 3 April 10, 2025
  • Central
12:00 PM - 01:00 PMREGISTRATION

apc|m and SSI participants

01:00 PM - 04:00 PMOPENING AND WELCOME

Joint opening of the apc|m and SSI Conference 2025 in Prague
Keynote 1: Heterogenous Integration – Evolution of a Speciality Foundry
Volker Herbig, Vice President BU Microsystems | X-FAB MEMS Foundry GmbH
Keynote 2:
Dr. Christina Hirschl, Chief Executive Officer (CEO) | Silicon Austria Labs GmbH

04:00 PM - 04:30 PMCOFFEE BREAK & EXHIBITION

Snacks & networking for apc|m and SSI participants

04:30 PM - 06:00 PMPOSTER PITCHES

SSI and apc|m poster speakers

SSI poster speakers:

  • Max Huber| Fraunhofer ENAS: Influence of surface roughness on water diffusion in the direct wafer bonding interface
  • Stefan Karanovic | AVL List GmbH: Advanced Current Measurement Sensor Enabled by Multi-Material Additive Manufacturing
  • Dominic Richter | Fraunhofer ENAS/TU Chemnitz: Influence of plasma activation on direct wafer bonding of the heterogeneous material combination LiTaO3/SiO2
  • Roy Knechtel | Schmalkalden University of Applied Sciences: Assessment for Identification of an Optimal Wafer Bonding Process for Industrial Production of Highly Integrated MEMS Applications in a Wafer Foundry
  • Zaid Ali | Budapest University of Technology and Economics: Enhancing Stability and Performance in Renewable Energy Systems Through Optimization-Based Tuning of Grid-Forming Controllers
  • Eunchong Park | Sungkyunkwan University: Latent Diffusion Model-based Plasma Etching Endpoint Detection with Optical Emission Spectroscopy
  • Mathis Janßen | TU Chemnitz: DNA origami stability in liquid and defect analysis
  • Mario Costanza | IPES, Tyndall National Institute: Simulation Framework for the Design of Energy-Autonomous IOT Applications
  • Stella Vallejos Vargas | Institute of Microelectronics of Barcelona: Electronic Gas/Vapor Sensors for Plant Monitoring
  • George Kornaros | Hellenic Medditerranean University: IoT Devices Resource Management through Extending Kubernetes Device Plugin
  • Cedric Mwangi | Kenyatta University: Wearable Devices Incorporating Multi-Modal Sensor Fusion and Machine Learning Algorithms for Monitoring and Early Detection of Seizures
  • Ali Kareem Abdulrazzaq | TU Chemnitz: Bridging Verification and Testing with SysMLv2: A Practical Approach for IC Development
  • Sanaz Ghazavi | TU Chemnitz: Customized SysMLv2 Profile for Model-Driven Circuit Test Development
  • Katrin Unger | Silicon Austria Labs GmbH: Industrial Internet of Things Sensor System: Encapsulation for Robust Performance in Harsh Environments
  • Harshita Sharma | Fraunhofer ENAS: Development of a Python-Based Mastercurvecreator Tool for Viscoelastic Materials
  • Elfi Fertl | Infineon Technologies AG Neubiberg: Beam Steering with AURIX microcontroller vs. Additional Loudspeaker with PSoC microcontroller
  • Xiangzhen Kong |Eindhoven University of Technology: Developing A Digital Twin For Predicting Visual Comfort In Office Environments: An Experimental Approach
  • Alessio Viticchiè | AlphaWaves: AI-Driven Automation for Industrial Digitalization: A Scalable Framework for Network Discovery and Digital Twin Deployment
  • Anılcan Erciyes | Marmara University: High-Fidelity Synthetic Data-Driven Machine Learning Framework for Predictive Maintenance of Three-Phase Industrial Motors
  • Binaman Amuri | Marmara University: Generative Pattern Learning for Missing Sensor Data Imputation in Industrial IoT
  • Jaehyeon Kim | Sungkyunkwan University: Root Cause Analysis of Plasma Process from Optical Emission Spectroscopy Signals with Recurrent Neural Network
  • Ferdinand Heinrich | Fraunhofer EMFT: Flexible Data Augmentation Methods for Federated Learning with Non-IID Data Distribution
  • Joris Liebermann | Fraunhofer IIS/EAS: Self-Detection of Mounting Looseness with a MEMS Accelerometer
  • Brendan O‘Flynn | University College Cork: AURORA: Precision Tracking Systems for Cultural Heritage Monitoring
  • Elise Saoutieff | University Grenoble Alpes: Bio-sensing system for water real-time monitoring in BioSensei project
  • Chang-Hua Lin | National Taiwan University of Science and Technology: Comparison and verification of control strategies of energy storage systems in DC Microgrids
  • Chang-Hua Lin | National Taiwan University of Science and Technology: Compensation Techniques for Voltage Detection in Battery Management Systems
  • Paddy French | Delft University of Technology: Bio-Remote Sensing in Real-Time Thermographic Face Detection and Respiratory Rate Measurement
  • Abdelatif Mariche | Budapest University of Technology and Economics: Photonics and Quantum Technology Relevant Properties of Nitrogen-Vacancy Centers in Diamond
  • Torsten Thieme | DEAXO GmbH: Advanced micro integration technologies for fabrication of micro-ion-traps for a trapped-ion quantum computer
  • Travis Scott | Fine Tech: Indium bump Interconnect flip chip bonding
06:00 AM - 07:00 AMPOSTER RECEPTION

For all SSI and apc|m participants

  • Central
08:00 AM - 09:00 AMREGISTRATION
09:00 AM - 10:00 AMKEYNOTE SESSION
10:00 AM - 10:30 AMCOFFEE BREAK & EXHIBITION

Snacks & networking for apc|m and SSI participants

10:30 AM - 12:00 PMSESSIONS
12:00 PM - 01:00 PMLUNCH BREAK & EXHIBITION

Good food & networking for apc|m and SSI participants

01:00 PM - 03:00 PMSESSIONS
03:00 PM - 04:00 PMCOFFEE BREAK & EXHIBITION

Snacks & networking for apc|m and SSI participants

04:00 PM - 06:00 PMSESSIONS
06:00 PM - 11:00 PMCONFERENCE DINNER

For apc|m and SSI participants in the centre of Prague

  • Central
08:00 AM - 09:00 AMREGISTRATION
09:00 AM - 10:00 AMKEYNOTE SESSION
10:00 AM - 10:30 AMCOFFEE BREAK & EXHIBITION

Snacks & networking for apc|m and SSI participants

10:30 AM - 12:00 PMSESSIONS
12:00 PM - 01:00 PMLUNCH & EXHIBITION

Good food & networking for apc|m and SSI participants

01:00 PM - 03:00 PMSESSIONS
03:00 PM - 04:00 PMCLOSING SESSION

Presentation of best poster & best paper awards

See you @ SSI 2025 in Prague!

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Conference Chairs

  • Harald Kuhn, Institute Director Fraunhofer ENAS
  • Wolfgang Dettmann, Vice President R&D Funding,
    Infineon Technologies (Acting)

Core team

The conference is prepared by a core team of high-ranking experts from industry as well as from basic and applied research organisations:

  • Boisseau Sébastien, Univ. Grenoble Alpes, CEA, Leti
  • Sywert Brongersma, IMEC
  • Wolfgang Dettmann, Infineon Technologies AG
  • Adrian Dinescu, IMT Bucharest
  • Albrecht Donat, Siemens AG
  • Luis Fonseca, Centro Nacional de Microelectronica (CNM-IMB)
  • Jens Förstner, Uni Paderborn
  • Paddy French, TU Delft
  • Francesco Gennaro, STMicroelectronics
  • Thomas Hammer, Siemens Erlangen
  • Christian Hedayat, Fraunhofer ENAS
  • Ulrich Heinkel, Chemnitz University of Technology, ZfM
  • Karla Hiller, Chemnitz University of Technology
  • Antonio Imbruglia, STMicroelectronics
  • Michael Jank, Technology IISB
  • Yvonne Joseph, TU Bergakademie Freiberg
  • Norman Kachel, B. Braun Melsungen AG
  • Jyrki Kiihamäki, VTT
  • Christoph Koegler, Infineon Technologies AG
  • Matthias Kühnel, Robert Bosch GmbH
  • Steffen Kurth, Fraunhofer ENAS
  • Jan Langer, Fraunhofer ENAS
  • Antonio Lionetto, STMicroelectronics
  • Kari Mäki , VTT Technical Research Centre of Finland Ltd.
  • Harald Mathis, Fraunhofer-Institut für Angewandte Informationstechnik FIT
  • Dirk Mayer, Fraunhofer EAS – Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EAS
  • Harald Pötter, Fraunhofer IZM
  • Parvaneh Rahimi, TU Freiberg
  • Sven Rzepka, Fraunhofer ENAS
  • Michael Scholles, Fraunhofer IPMS
  • Stefan Schulz, Fraunhofer ENAS
  • Han Shao, Tyndall
  • Yukio Suzuki, Tohoku University
  • Bart Vandevelde, IMEC
  • Bernhard Wunderle, Chemnitz University of Technology

Keynote Speakers 2025

Coming soon!

Testimonials

Voices from our conference chairs as well as core team members and reasons for you to attend SSI!

Thomas Otto
Thomas OttoFraunhofer ENAS

Smart systems are the key to meet tomorrow's challenges in all aspects of life. Attend the main European conference in this field - the Smart Systems Integration Conference and Exhibition.

Stefan Finkbeiner
Stefan FinkbeinerEPoSS/ Bosch Sensortec

Digitization is not only increasingly entering our lifes, it is a real game changer! There will be not only advances in individual components and subsystems necessary, especially connectivity and implementation of intelligence “at the edge” integrated in smart modules and systems will be the key. To be successful in future, interdisciplinary approaches are required more than ever.

Rainer Günzler
Rainer GünzlerHahn-Schickard

“A side effect of Corona is the breakthrough of point-of-care diagnostics based on microfluidics.”

Thomas Hammer
Thomas HammerSiemens

“Smart system integration is key to highly automated distribution grids coupling the energy sector with mobility, industry & domestic use. At SSI 2023 you can meet the experts for discussing your interdisciplinary challenge!”

Contact Us

Don’t hesitate to get in touch!

Send Message

If you have any questions or just want to get in touch, use the form below. We look forward to hearing from you!

    General conditions of participation:
    If there are any changes to your participation, please refer to our general conditions of participation.