Announcement Smart Systems Integration 2023

The annual Smart Systems Integration Conference and Exhibition will be held in Bruges, Belgium, March 28-30, 2023 in the Bruges Meeting & Convention Centre.

At the same time and same place The European Advanced Process Control and Manufacturing (apc|m) Conference will be held as well. For the first time, both conferences and their sessions will be open to all visitors in Bruges. In addition to the closely linked conference areas, the exhibition spaces, networking and evening events of both conferences will then offer new opportunities to share and discuss solutions, products and research results. Synergies are the goal to connect the European tech community even closer.

In early September, we will publish the Call for Papers. Please send us your presentation topics, demonstration ideas and technical inputs then. In addition, the sponsorship and exhibitor packages as well as Early Bird tickets will be available for booking at this time.

Award Winners of the SSI 2022

Already since 2007 it is tradition at the International Smart Systems Integration Conference to award a Best Paper and a Best Poster Award with an endowment of 500 € each. Both prizes are sponsored by EPoSS - the European Platform for Smart Systems Integration and Fraunhofer ENAS. In addition, the third prize is the Thomas Gessner Award, which was awarded for the third time in 2022.
While the best poster will be selected by all participants of the conference and already announced at the end of the conference, the Best Paper Award winner will be nominated by the committee. The award winner will be selected from 7 to 10 candidates based on his presentation and paper and will be announced a few weeks after the conference. The award will be presented to the awardee at the Smart Systems Integration Conference 2023.

Award Winners of the SSI 2022

Best Paper Award

The Best Paper Award of the SSI2022 held in Grenoble on 27/28 April 2022, goes to Moritz Schlagmann, Infineon Technologies for his paper "Miniaturized and Highly Integrated Humidity Sensor with Biocompatible Sensing Material for Smart Farming". Moritz Schlagmann, works at Infineon Technologies in Neubiberg, Germany. The uniqueness of this leaf moisture sensor, developed within the European project "PLANtAR", lies in the combination of miniaturized design (1mm x 1mm), an integrated ASIC for electronic readout, biocompatibility, chemical resistance, temperature independence, moderate hysteresis as well as long-term measurement stability - and is therefore very useful for smart farming in the context of integrated crop protection. The publication reports on the development, manufacture and testing of the sensor, as well as a comparison with other available moisture sensors. The sensor's field of application is not limited to leaves, but wherever moisture needs to be measured and analyzed in situ; a change of housing material makes it suitable for other applications.

Best Paper Award

Best Poster Award

The most exciting poster contribution was awarded on the last day of the event. The winner was Sven Nitzsche from the FZI Research Center for Information Technology for his poster "Comparison of Artificial and Spiking Neural Networks for Ambient-Assisted Living". Mr. Nitzsche is thus already the first confirmed speaker of the 16th SSI next year.

Best Poster Award

Thomas Gessner Award

Already at SSI 2022 in Grenoble, the Thomas Gessner Award for an outstanding scientific PhD thesis was presented for the third time but for the first time to a scientist of TU Chemnitz. The scientist Dr. Apoorva Sharma, staff member of the Chair of Semiconductor Physics headed by Prof. Dr. D. R. T. Zahn, received the Thomas Gessner Award in Grenoble for his dissertation "Correlation Between the Structural, Optical, and Magnetic Properties of CoFeB and CoFeB Based Magnetic Tunnel Junctions Upon Laser or Oven Annealing".
The dissertation was carried out as part of a joint project of the Chemnitz University of Technology, the Fraunhofer Institute for Electronic Nano Systems, and the Laser Institute at Mittweida University of Applied Sciences with financial support from the German Research Foundation (project number 28219353). It provides the first proof of concept that laser annealing can be used as an efficient, fast, and reliable direct-write technique for magnetic multilayer systems.

Thomas Gessner Award

Testimonials

Voices from our conference chairs as well as core team members and reasons for you to attend SSI!

Sébastien DAUVE
Sébastien DAUVECEA LETI

CEA-Leti is proud to host this year’s SSI 2022 in Grenoble, France. Smart integrated systems combine wireless communications, innovative sensor-system design and power management. They have become a key enabler to address societal challenges, including healthcare, industry 4.0, cybersecurity, e-mobility, and much more.

Thomas Otto
Thomas OttoFraunhofer ENAS

Smart systems are the key to meet tomorrow's challenges in all aspects of life. Attend the main European conference in this field - the Smart Systems Integration Conference and Exhibition.

Stefan Finkbeiner
Stefan FinkbeinerEPoSS/ Bosch Sensortec

Digitization is not only increasingly entering our lifes, it is a real game changer! There will be not only advances in individual components and subsystems necessary, especially connectivity and implementation of intelligence “at the edge” integrated in smart modules and systems will be the key. To be successful in future, interdisciplinary approaches are required more than ever.

Rainer Günzler
Rainer GünzlerHahn-Schickard

“A side effect of Corona is the breakthrough of point-of-care diagnostics based on microfluidics.”

Thomas Hammer
Thomas HammerSiemens

“Smart system integration is key to highly automated distribution grids coupling the energy sector with mobility, industry & domestic use. At SSI 2022 you can meet the experts for discussing your interdisciplinary challenge!”

Programme 2022

The pre-event on April 26 is only open for EPoSS members and requires a separate registration (see ticket section).

  • Pre-event April 26, 2022
  • Conference Day 1 April 27, 2022
  • Conference Day 2 April 28, 2022
  • Central
12:00 PM - 04:00 PMWorking group meetings and Task Force meeting (only for EPoSS members) By EPoSS

internal WG meetings for EPoSS community

04:00 PM - 06:30 PMExCom Meeting (only for EPoSS members)

internal meeting for EPoSS community

08:00 PM - 11:00 PMDinner (only for EPoSS members)
  • Central
  • Parallel Session 1
  • Parallel Session 2
  • Parallel Session 3
08:00 AM - 08:45 AMRegistration

Registration of each participant at the registration desk / exhibition and networking

08:45 AM - 09:10 AMWelcome
09:10 AM - 09:40 AMKeynote I: From ECSEL to KDT to CHIPS JU By Bert De Colvenaer, Executive DirectorKDT Joint Undertaking
09:40 AM - 10:10 AMKeynote II: Sense-compute-connect-power: an holistic sensor system approach to enable greener, easier and safer life By Laurent Remont, VP Sensor SolutionsInfineon Technologies AG
10:10 AM - 10:40 AMKeynote III: Overcoming the Data Deluge Challenges with Greener Electronics By Oliver Faynot, Silicon Department HeadCEA-Leti

The purpose of this paper is to propose scientific and technical directions to reach global data and power sobriety while preserving computational efficiency. We present nine opportunities to lower the power consumption of computing units. A growth factor of 100 to 1000 in energy efficiency is achievable in the next 10 years if we take full advantage of all the potential improvements, working simultaneously at all five levels of the technological ecosystem (process steps, circuits, architecture, software and algorithms).

10:40 AM - 11:05 AMCoffee Break

Exhibition and networking

11:05 AM - 12:20 PMParallel sessions
12:20 PM - 01:30 PMLunch break

Exhibition and networking

01:30 PM - 02:45 PMParallel sessions
02:45 PM - 03:15 PMCoffee break

Exhibition and networking

03:15 PM - 04:00 PMPoster pitches and demonstrator pitches
04:00 PM - 04:45 PMTopic tables: KDT Funding Opportunities
04:45 PM - 06:00 PMParallel sessions
06:00 PM - 08:00 PMGrenoble sightseeing tour for all participants

08:00 PM - 11:00 PMGALA Dinner at Maison MINATEC
11:05 AM - 12:20 PMTrack I – Key Enablers for Smart Systems of Next Generation By Louis Fonseca & Wolfgang DettmannCentro Nacional de Microelectronica & Infineon Technologies AG

Session 1/4: Modelling and advanced processing (for device fabrication and integration) Part I

11:05 AM - 11:30 AMHigh-resolution projection lithography for MEMS-applications using thick photoresist AZ® 10XT By Sebastian SchermerFraunhofer ENAS
11:30 AM - 11:55 AMNovel Approach to Deposit Conductive and Insulating Features at Micrometer Scale for Manufacturing of Smart Systems By Łukasz KosiorXTPL SA
Precision Fluid Deposition of Nanostructured Photonic Layers
11:55 AM - 12:20 PMPrecision Fluid Deposition of Nanostructured Photonic Layers By Thomas BlaudeckTU Chemnitz
12:20 PM - 01:30 PMLunch break

Exhibition and networking

01:30 PM - 02:45 PMTrack I – Key Enablers for Smart Systems of Next Generation By Wolfgang Dettmann & Louis FonsecaInfineon Technologies AG & Centro Nacional de Microelectronica


Session 2/4: Modelling and advanced processing (for device fabrication and integration) II

01:30 PM - 01:55 PMDIE-TO-DIE ALIGNMENT FOR LITHOGRAPHIC PROCESSING OF RECONSTRUCTED WAFERS By Jeroen de BoeijKulicke & Soffa Liteq BV
THE ROLE OF DISORDER IN ELEMENTARY PHOTONIC COMPONENTS –THEORETICAL AND EXPERIMENTAL CONSIDERATIONS
01:55 PM - 02:20 PMTHE ROLE OF DISORDER IN ELEMENTARY PHOTONIC COMPONENTS –THEORETICAL AND EXPERIMENTAL CONSIDERATIONS By Thomas BlaudeckTU Chemnitz
02:20 PM - 02:45 PMSmart energy management of closed customized wet workbenches by active smart sensor-actuator systems By Florian KuhlMK Versuchsanlagen und Laborbedarf e.K.
02:45 PM - 03:15 PMCoffee break

Exhibition and networking

04:45 PM - 06:00 PMTrack I – Key Enablers for Smart Systems of Next Generation By Matthias Kuehnel & Sywert BrongersmaRobert Bosch GmbH & IMEC


Session 3/4: Sensor devices and systems I

04:45 PM - 05:10 PMTouch Sensor Based on Highly Compressive Magnetic Foam Composite By Gildas DiguetTohoku University Sendai
05:10 PM - 05:35 PMGas sensing with capacitive micromachined ultrasound transducers By Charles BoutonnetCEA-Leti
05:35 PM - 06:00 PMHigh Precision Liquid Level and Leak Detection Based on Capacitive Micromachined Ultrasound Transducer By Nooshin SaeidiFraunhofer ENAS
11:05 AM - 12:20 PMTrack II – Key Technologies for Smart Systems By Paddy French & Jean-Philippe PolizziTU Delft & CEA LETI

Session1/4: Smart Hardware Solutions

11:05 AM - 11:30 AMParametrically Generated FE Models for the Design for Reliability of Classical and Embedded Power Modules By Kshitij KolasFraunhofer ENAS
11:30 AM - 11:55 AMDesign of a MEMS-based fully passive wireless pressure sensor for harsh environments By Romain AlcesilasCEA Leti
11:55 AM - 12:20 PMImpact of Cell Arrangement and Medium on Acoustic Crosstalk in CMUT – A FEA Study By Dhruvin DarjiTU Chemnitz
12:20 PM - 01:30 PMLunch break

Exhibition and networking

01:30 PM - 02:45 PMTrack II – Key Technologies for Smart Systems By Sywert Brongersma & Paddy FrenchIMEC & TU Delft


Session 2/4: Smart Hardware Solutions II

01:30 PM - 01:55 PMSmart industrial sensor solution concept By Natale TestaSTMicroelectronics
01:55 PM - 02:20 PMDesign, Simulation, and Analysis of a Physical Unclonable Function Based on MEMS AlN Cantilevers By Saeed AbdolinezhadUniversity Offenburg
02:20 PM - 02:45 PMSmartfarming in vertical gardens By Guido ColomboOrchestra srl
02:45 PM - 03:15 PMCoffee break

Exhibition and networking

04:45 PM - 06:00 PMTrack II – Key Technologies for Smart Systems By Christoph Koegler & Harald KuhnT-Systems Multimedia Solutions & Director Fraunhofer ENAS, Director Center for Microtechnologies at TU Chemnitz


Session 3/4: Embedded Intelligence

04:45 PM - 05:10 PMEmbedded artificial intelligence approach for gas recognition in smart agriculture application using low cost MOX gas sensors (invited talk) By Claudia BrunoUniversità degli Studi di Catania
05:10 PM - 05:35 PMSoftware building blocks for gas sensors using artificial intelligence at the edge By Aibin Paul LazarBosch Sensortec
05:35 PM - 06:00 PMA Security Outlook On Embedded Device Development By Paulo MartinezSiemens
11:05 AM - 12:50 PMTrack V – Strategy and Business Creation | Photonics integration: How to bring these worlds together? By Elisabeth Steimetz & Thomas DietrichEPoSS & IVAM

Session 3 addresses the topic of “Photonics integration:
How to bring these worlds together?”

During this SSI session attendees will get insights into

  • the technical state of the art of heterogeneous photonics integration and Silicon photonics
  • funding opportunities for these topics
  • as well as latest market data.

In a Q&A and Panel at the end of the session you will have the opportunity to ask your questions and give the presenters your views and feed-back on what to do next to
“bring these worlds together!”

11:05 AM - 11:25 AMHeterogeneous integration and 3D technologies for silicon photonics By Eléonor HardyCEA Leti
11:25 AM - 11:40 AMEU funding for integrated & silicon photonics By Werner SteinhöglEuropean Commision; DG CNECT
11:40 AM - 11:55 AMAugmented silicon photonics, with integrated lasers, the ultimate integration of photonic system, optimized for co-packaging By Yannick PaillardScintil Photonics
11:55 AM - 12:10 PMSilicon Photonics, beyond the tipping point. By Eric MounierYole
12:10 PM - 12:25 PMPhotonics integration opportunities and challenges from industries perspective By Lucas GinzingerBosch Sensortech
12:25 PM - 12:50 PMQ&A and Panel discussion By All speakers
12:50 PM - 01:30 PMLunch break

Exhibition and networking

01:30 PM - 03:00 PMTRACK V – Strategy and Business Creation | SME & Start-up engagement in European Projects: how to improve particiaption further? By Roland Dörr & Laure QuintinmicroTec SW & MINALOGIC

SMEs and Start-ups often need funding due to limited financial resources for product developments or to bring their product on the market. A promising approach for companies is a participation in European Projects. The funding is usually high but there are often obstacles like the proposal process or administrative challenges. In this Session we want to discuss  from different perspectives how to improve the situation for companies, e.g. what regional clusters can do to better involve SMEs in EU funding schemes. We will have SME pitches, which report about their experiences with EU programmes. Last but not least we will have a Panel discussion with representatives from regional clusters to discuss the topic.

01:30 PM - 01:45 PMEuropean Digital Innovation Hubs & their activities for SMEs By Rainer GünzlerHahn-Schickard
01:45 PM - 02:20 PMSME Pitches By 4 companies

Gonzalo Murillo | Energiot Device: Self-powered IoT for a smarter & dynamic electrical grid
Renauld De Langlade | NovaPack: Packaging in Europe: Status and needs from SME perspective
Lukasz Kosior | XTPL: Impact of European Projects on the Development of Next-Generation Printing Technology
Caterina Taballione | QuiX Quantum B.V.: Quantum Photonic Processing based on Programmable Si3N4 Circuits

02:20 PM - 02:35 PMWhat regional clusters do to better involve SMEs in EU funding schemes By Ben van der ZonHighTech NL
02:35 PM - 03:00 PMPanel discussion with representatives from regional clusters
03:00 PM - 03:15 PMCoffee break
04:45 PM - 06:00 PMTrack V – European Projects By Elisabeth Steimetz & Ben van der ZonEPoSS / HighTech NL
04:45 PM - 05:10 PMDeveloping Entrepreneurship within the Joint International Master Programme in Smart Systems Integrated Solutions By Márta RenczBudapest University of Technology and Economics
05:10 PM - 05:35 PMProject ASCENT+ By Giorgos FagasTyndall National Institute
05:35 PM - 06:00 PMProject NEURONN By Aida Todri-SanialCNRS
  • Central
  • Parallel Session 1
  • Parallel Session 2
  • Parallel Session 3
08:00 AM - 09:00 AMRegistration

conference location is open / exhibition and networking

09:00 AM - 09:30 AMKeynote IV: Making micromirrors system integration friendly: thin-film piezo technology By Andrea Onetti, Executive Vice PresidentST Microelectronics Srl

Micromirrors are the key components of innovative products in the augmented reality and automotive ADAS markets. In addition to the well-known challenges of being an emerging solution such as scalability and the unavoidable race for performance, micromirrors pay the price of an increased complexity of integration. Following years of research, development and partnerships, ST’s piezo technology answers these challenges with its ability to scale resolution and field of view as well as volume occupation and/or power consumption thanks to the enhanced displacement characteristics of the new materials.

09:30 AM - 10:00 AMKeynote V: Smart Systems will create the future By Harald Kuhn, director Fraunhofer ENAS, director Center for Microtechnologies at TU ChemnitzFraunhofer ENAS

More and more intelligent components and intelligent integrated systems are finding their way into a wide range of innovative products and applications that affect all branches of industry and almost all areas of life. The advances in the individual components and subsystems are necessary, but not sufficient, to meet the requirements of today and tomorrow. Especially interdisciplinary approaches as well as the new integration technologies as well as the combination with intelligence in systems and modules are the key and open up new possibilities for the future.

10:00 AM - 10:30 AMPresentation Thomas Gessner Award By Apoorva SharmaTU Chemnitz

The Thomas Gessner Award is a contribution of Fraunhofer ENAS to promote applied research by awarding a prize for excellent scientific work at the annual Smart Systems Integration Conference. The award is aimed at national and international master and PhD students in the field of Smart Systems Integration, whose thesis is at least assessed as “very good” and does not date back more than two years. The evaluation process considers in particular: The novelty of the scientific and methodical approach, Advance of knowledge, Implementation of the scientific results into the application and proof of economic success, Internationality.

The prize committee reflects the aspirations of Fraunhofer-Gesellschaft to support applied research and to ensure that scientific results are put into practical applications. In addition, it also reflects on the broad range of research activities in the field of Smart Systems Integration within Fraunhofer-Gesellschaft.

10:30 AM - 11:00 AMCoffee break

Exhibition and networking

11:00 AM - 12:40 PMParallel sessions
12:40 PM - 01:30 PMLunch break

Exhibition and networking

01:30 PM - 02:45 PMNetworking session in the exhibition area with coffee

Exhibition and networking

02:45 PM - 04:25 PMParallel sessions
04:25 PM - 04:25 PMEnd of conference
11:00 AM - 12:40 PMTrack III – Application Domains: Mobility, Energy, Industry By Antonio Lionetto & Harald PötterSTMicroelectronics & Fraunhofer IZM


Session 1/2: Smart Systems for Monitoring and Control

11:00 AM - 11:25 AMCASCADED H-BRIDGE MULTILEVEL INVERTER WITH A DISTRIBUTED CONTROL SYSTEM FOR SOLAR APPLICATIONS By Thibault Bertin Rivière De La SouchèreCEA-Leti
11:25 AM - 11:50 AMA SMART BATTERY FREE SYSTEM FOR WIRELESS CONDITION MONITORING USING PIEZOELECTRIC ENERGY HARVESTER By Namanu PanayanthattaIMEP LAHC
11:50 AM - 12:15 PMThe mobility scenario vs Green Deal Objectives By Antonio ImbrugliaSTMicroelectronics
12:15 PM - 12:40 PMHIGH-G ACCELERATION SENSORS FOR THE AUTOMOTIVE INDUSTRY By Sebastian PreglInfineon Technologies
12:40 PM - 01:30 PMLunch break
02:45 PM - 04:25 PMTrack III – Application Domains: Mobility, Energy, Industry By Kari Mäki & Antonio LionettoVTT & STMicroelectronics


Session 2/2: Smart Systems in Energy, Mobility and Industry sectors

02:45 PM - 03:10 PMHydroZest: embedded AI for predictive maintenance By Olivier ChevaleriasCATIE
03:10 PM - 03:35 PMPredictive Maintenance for Automated Material Handling Systems By Hans KlingstedtSmart Systems HUB
Nonlinear Model Predictive Control for Lifetime Extension of Self-Reconfigurable Battery
03:35 PM - 04:00 PMNonlinear Model Predictive Control for Lifetime Extension of Self-Reconfigurable Battery By Jérôme BlatterCEA Liten
SMART DOMAIN-ADAPTED VISUAL SALIENCY PERCEPTION IN ADVANCED DRIVER MOTION-ASSISTED SYSTEM
04:00 PM - 04:25 PMSMART DOMAIN-ADAPTED VISUAL SALIENCY PERCEPTION IN ADVANCED DRIVER MOTION-ASSISTED SYSTEM By Francesco RundoST Microelectronics
11:00 AM - 12:40 PMTrack IV – Application Domains: Food, Biomedical, Healthy Living By Rainer Günzler & Han ShaoHahn-Schickard & Tyndall


Session 1/2: Smart Sensing Platform for Biomedical Application

11:00 AM - 11:25 AMModelling and on-chip detector design for a MEMS Photoacoustic System By Akash GuptaHahn-Schickard-Gesellschaft für angewandte Forschung e.V.
11:25 AM - 11:50 AMMiniaturized and Highly Integrated Humidity Sensor With Biocompatible Sensing Material for Smart Farming By Moritz SchlagmannInfineon Technologies AG, Germany
11:50 AM - 12:15 PMAEFishBit: a smart system to monitor fish activity and welfare By Manuel LozanoCSIC
12:15 PM - 12:40 PMEffect of Surface Uniformity and Droplet Volume on Actuation Voltage of PCB Based EWOD Microfluidic System By Wail Al-MogahedTU Chemnitz
12:40 PM - 01:30 PMLunch break
02:45 PM - 04:25 PMTrack IV – Application Domains: Food, Biomedical, Healthy Living By Norman Kachel & Rainer GünzlerB. Braun Melsungen AG & Hahn-Schickard


Session 2/2: Smart Systems for Diagnostics and Monitoring in Health Care

02:45 PM - 03:10 PMThe monitoring of neurological disease (Invited talk) By Napoleon Torres CEA LETI CLINATEC
Real-time Thermographic Object Tracking of the Body Temperature of a Neonate
03:10 PM - 03:35 PMReal-time Thermographic Object Tracking of the Body Temperature of a Neonate By Kianoush RasselsTU Delft
03:35 PM - 04:00 PMStandardized noble metal electrodes integrated on CMOS technologies for medical applications By Christine Dufour XFAB
Bio-Remote Sensing in Predicting Infection in Neonates with Thermal Imaging and Machine Learning
04:00 PM - 04:25 PMBio-Remote Sensing in Predicting Infection in Neonates with Thermal Imaging and Machine Learning By Kianoush RasselsTU Delft
11:00 AM - 12:40 PMTrack I – Key Enablers for Smart Systems of Next Generation By Jean-Philippe Polizzi & Matthias KuehnelCEA LETI & Robert Bosch GmbH


Session 4/4: Sensor devices and systems II

11:00 AM - 11:25 AMLightweight spike-domain beamforming applied to pMUT signals for ultrasonic-based gesture recognition (invited talk) By Bruno FainCEA-Leti
11:25 AM - 11:50 AMStress Impedance Effect MEMS Sensors with Very High Gauge Factor By Joerg FroemelTohoku University Sendai
11:50 AM - 12:15 PMBACKSCATTERED VISUAL LIGHT POSITIONING USING LED SENSING IN COMBINATION WITH EDGE COMPUTING BASED ARTIFICIAL NEURAL NETWORK CLASSIFICATION By Andreas Peter WeissJoanneum Research
12:15 PM - 12:40 PMFunctional CMOS extension with integrated carbon nano devices By Simon BoettgerTU Chemnitz
12:40 PM - 01:30 PMLunch break
02:45 PM - 04:25 PMTrack II – Key Technologies for Smart Systems By Harald Kuhn & Chistoph KoeglerFraunhofer ENAS & T-Systems Multimedia Solutions


Session 4/4: Embedded Intelligence II

On Trustworthy Scalable Hardware/Software Platform Design
02:45 PM - 03:10 PMOn Trustworthy Scalable Hardware/Software Platform Design By Friedrich PaulsBarkhausen Institut gGmbH, Germany
Deep System for physio-to-sobriety augmenteddriving risk assessment in next generation cars
03:10 PM - 03:35 PMDeep System for physio-to-sobriety augmented
driving risk assessment in next generation cars
By Francesco RundoSTMicroelectronics
03:35 PM - 04:00 PMA Methodology for fast data analysis on edge
devices
By Ronny SchwabeAdaptive Systems EAS/ Fraunhofer Institute for Integrated Circuits IIS

Keynote Speakers 2022

Bert De ColvenaerExecutive Director, KDT Joint Undertaking

The tripartite JU funding landscape for the ECS sector is changing quickly : from ECSEL to KDT and soon to the CHIPS JU. The presentation will highlight the successes and the expectations from the Joint Undertaking.

Bert De ColvenaerExecutive Director, KDT Joint Undertaking

The tripartite JU funding landscape for the ECS sector is changing quickly : from ECSEL to KDT and soon to the CHIPS JU. The presentation will highlight the successes and the expectations from the Joint Undertaking.

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Laurent RemontVP sensor systems, Infineon Technologies AG

In order to successfully enable new innovative sensing use-cases in applications like smart home, smart building or consumer product, an holistic sensor system approach is needed. We will explore what it means for example for Radar or MEMS sensors, covering topics like heterogeneous technology integration, edge AI or cloud connectivity.

Laurent RemontVP sensor systems, Infineon Technologies AG

In order to successfully enable new innovative sensing use-cases in applications like smart home, smart building or consumer product, an holistic sensor system approach is needed. We will explore what it means for example for Radar or MEMS sensors, covering topics like heterogeneous technology integration, edge AI or cloud connectivity.

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Olivier FaynotSilicon Department Head, CEA-Leti

The purpose of this paper is to propose scientific and technical directions to reach global data and power sobriety while preserving computational efficiency. We present nine opportunities to lower the power consumption of computing units. A growth factor of 100 to 1000 in energy efficiency is achievable in the next 10 years if we take full advantage of all the potential improvements, working simultaneously at all five levels of the technological ecosystem (process steps, circuits, architecture, software and algorithms).

Olivier FaynotSilicon Department Head, CEA-Leti

The purpose of this paper is to propose scientific and technical directions to reach global data and power sobriety while preserving computational efficiency. We present nine opportunities to lower the power consumption of computing units. A growth factor of 100 to 1000 in energy efficiency is achievable in the next 10 years if we take full advantage of all the potential improvements, working simultaneously at all five levels of the technological ecosystem (process steps, circuits, architecture, software and algorithms).

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Andrea Mario Luigi ONETTIExecutive Vice President - MEMS Sub Group General Manager, STMicroelectronics SRL

Micromirrors are the key components of innovative products in the augmented reality and automotive ADAS markets. In addition to the well-known challenges of being an emerging solution such as scalability and the unavoidable race for performance, micromirrors pay the price of an increased complexity of integration. Following years of research, development and partnerships, ST's piezo technology answers these challenges with its ability to scale resolution and field of view as well as volume occupation and/or power consumption thanks to the enhanced displacement characteristics of the new materials.

Andrea Mario Luigi ONETTIExecutive Vice President - MEMS Sub Group General Manager, STMicroelectronics SRL

Micromirrors are the key components of innovative products in the augmented reality and automotive ADAS markets. In addition to the well-known challenges of being an emerging solution such as scalability and the unavoidable race for performance, micromirrors pay the price of an increased complexity of integration. Following years of research, development and partnerships, ST's piezo technology answers these challenges with its ability to scale resolution and field of view as well as volume occupation and/or power consumption thanks to the enhanced displacement characteristics of the new materials.

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Harald KuhnDirector Fraunhofer ENAS, Director Center for Microtechnologies at TU Chemnitz

More and more intelligent components and intelligent integrated systems are finding their way into a wide range of innovative products and applications that affect all branches of industry and almost all areas of life. The advances in the individual components and subsystems are necessary, but not sufficient, to meet the requirements of today and tomorrow. Especially interdisciplinary approaches as well as the new integration technologies as well as the combination with intelligence in systems and modules are the key and open up new possibilities for the future.

Harald KuhnDirector Fraunhofer ENAS, Director Center for Microtechnologies at TU Chemnitz

More and more intelligent components and intelligent integrated systems are finding their way into a wide range of innovative products and applications that affect all branches of industry and almost all areas of life. The advances in the individual components and subsystems are necessary, but not sufficient, to meet the requirements of today and tomorrow. Especially interdisciplinary approaches as well as the new integration technologies as well as the combination with intelligence in systems and modules are the key and open up new possibilities for the future.

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Speakers 2022

Eleonore HardyCEA-Leti

We will review recent activities at CEA-Leti in the field of Silicon Photonics, with a special focus on heterogeneous integration and technologies for advanced 3D integration of photonic devices.

Eleonore HardyCEA-Leti

We will review recent activities at CEA-Leti in the field of Silicon Photonics, with a special focus on heterogeneous integration and technologies for advanced 3D integration of photonic devices.

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Caterina TaballioneQuiX Quantum BV

Stoichiometric Silicon Nitride offers a unique combination of ultra-low loss and tight optical mode confinement that makes it one of the best platforms for large-scale integrated quantum photonics.
QuiX Quantum's core business is the development of full-stack solutions for quantum information processing based on plug-and-play integrated Silicon Nitride circuits. QuiX Quantum has recently demonstrated the most complex quantum PICs in the world: a universal 20-mode quantum photonic processor.

Caterina TaballioneQuiX Quantum BV

Stoichiometric Silicon Nitride offers a unique combination of ultra-low loss and tight optical mode confinement that makes it one of the best platforms for large-scale integrated quantum photonics.
QuiX Quantum's core business is the development of full-stack solutions for quantum information processing based on plug-and-play integrated Silicon Nitride circuits. QuiX Quantum has recently demonstrated the most complex quantum PICs in the world: a universal 20-mode quantum photonic processor.

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Claudia BrunoUniversità degli Studi di Catania

The aim of the research activity was to investigate the field of smart agriculture in the context of a European project called “SARMENTI”, a multi-sensor IoT secure node to provide decision support to farmers. By considering the SARMENTI system a real use case, my work focused on developing a gas recognition algorithm which embeds a neural network able to recognize different types of gas (Air, NH3, CH4, N2O) on the basis of data coming from a low cost MOX gas sensor. The trained neural network has been integrated in a STM32 microcontroller and tested in ENEA laboratory of Portici (NA).

Claudia BrunoUniversità degli Studi di Catania

The aim of the research activity was to investigate the field of smart agriculture in the context of a European project called “SARMENTI”, a multi-sensor IoT secure node to provide decision support to farmers. By considering the SARMENTI system a real use case, my work focused on developing a gas recognition algorithm which embeds a neural network able to recognize different types of gas (Air, NH3, CH4, N2O) on the basis of data coming from a low cost MOX gas sensor. The trained neural network has been integrated in a STM32 microcontroller and tested in ENEA laboratory of Portici (NA).

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Bruno FainCEA-Leti

pMUT sensors have raised a great interest to generate angular-resolved information by beamforming or triangulation. Yet, these strategies may require to acquire a huge amount of datas. Here, we propose a strategy to build a lightweight gesture recognition system, in line with the expectations for such low-power sensors.

Bruno FainCEA-Leti

pMUT sensors have raised a great interest to generate angular-resolved information by beamforming or triangulation. Yet, these strategies may require to acquire a huge amount of datas. Here, we propose a strategy to build a lightweight gesture recognition system, in line with the expectations for such low-power sensors.

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Napoleon TorresCEA LETI CLINATEC

Chronic neurological disorders are a major public health concern with millions of patients suffering from Alzheimer's disease, Parkinson's disease, amyotrophic lateral sclerosis and epilepsy. Although supportive therapies are now available for more and more patients, there is a persistent lack of disease-modifying treatments and some therapies are insufficiently effective for diseases such as Parkinson’s disease (PD) and drug-refractory epilepsies (DRE). This is mainly due to limitations in accurate disease definition and pathophysiology understanding. It is also due to the limited, yet growing, availability of integrated technologies and solutions allowing a precise diagnosis, treatment and disease follow up. Undoubtedly, improved neurological disease management would be facilitated by recently developed technologies using advanced sensors for biomarker measurement (whether molecular, electrical, optical parameters…), along with associated algorithms and software that will allow closed-loop medical decision making or evaluate disease progression.

Napoleon TorresCEA LETI CLINATEC

Chronic neurological disorders are a major public health concern with millions of patients suffering from Alzheimer's disease, Parkinson's disease, amyotrophic lateral sclerosis and epilepsy. Although supportive therapies are now available for more and more patients, there is a persistent lack of disease-modifying treatments and some therapies are insufficiently effective for diseases such as Parkinson’s disease (PD) and drug-refractory epilepsies (DRE). This is mainly due to limitations in accurate disease definition and pathophysiology understanding. It is also due to the limited, yet growing, availability of integrated technologies and solutions allowing a precise diagnosis, treatment and disease follow up. Undoubtedly, improved neurological disease management would be facilitated by recently developed technologies using advanced sensors for biomarker measurement (whether molecular, electrical, optical parameters…), along with associated algorithms and software that will allow closed-loop medical decision making or evaluate disease progression.

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Apoorva SharmaChemnitz University of Technology

Postprocess annealing is a crucial fabrication step for magnetoresistance (MR) sensors and magnetic random-access memories (MRAM) manufacturing. Annealing is a prerequisite for the crystallisation of particular layers of a magnetic tunnel junction (MTJ), which in turn improves sensitivity, magnetoresistance ratio, and signal to noise ratio. Often, this improved performance comes at the cost of temperature assisted diffusion, which results in difficulties to integrate multiple MTJs and their read-out electronics on temperature sensitive substrates. Here, I present the annealing by the use of laser irradiation as an alternative to the conventional vacuum oven annealing. The selection of laser parameters such as fluence, spot size and scanning speed (/pulse duration) allows for delivering a highly controlled dose of thermal energy at a precise location. Our results show that laser annealing is a promising manufacturing step for the integration of multiple MTJs with their control and read-out electronics on a single die, which will allow to significantly increase the number of devices per wafer.

Apoorva SharmaChemnitz University of Technology

Postprocess annealing is a crucial fabrication step for magnetoresistance (MR) sensors and magnetic random-access memories (MRAM) manufacturing. Annealing is a prerequisite for the crystallisation of particular layers of a magnetic tunnel junction (MTJ), which in turn improves sensitivity, magnetoresistance ratio, and signal to noise ratio. Often, this improved performance comes at the cost of temperature assisted diffusion, which results in difficulties to integrate multiple MTJs and their read-out electronics on temperature sensitive substrates. Here, I present the annealing by the use of laser irradiation as an alternative to the conventional vacuum oven annealing. The selection of laser parameters such as fluence, spot size and scanning speed (/pulse duration) allows for delivering a highly controlled dose of thermal energy at a precise location. Our results show that laser annealing is a promising manufacturing step for the integration of multiple MTJs with their control and read-out electronics on a single die, which will allow to significantly increase the number of devices per wafer.

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Sven LangeUniversity of Paderborn/Fraunhofer ENAS

In this work, methods were developed and verified to calculate coil parameters. These results will be used for a new kind of localization method, which is based on inductive coupling in order to generate training data for AI systems quickly and efficiently and to test localization algorithms.

Sven LangeUniversity of Paderborn/Fraunhofer ENAS

In this work, methods were developed and verified to calculate coil parameters. These results will be used for a new kind of localization method, which is based on inductive coupling in order to generate training data for AI systems quickly and efficiently and to test localization algorithms.

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Akash GuptaHahn-Schickard-Gesellschaft für angewandte Forschung e.V.

It is about the theoretical investigation of a miniaturized and novel gas detection sensor based on photoacoustic sensing technique. The system finds application in various fields depending on the target gas. Analysis is performed for a toxic gas such as ammonia, which is used widely in health, medical, food, and agriculture industry.

Akash GuptaHahn-Schickard-Gesellschaft für angewandte Forschung e.V.

It is about the theoretical investigation of a miniaturized and novel gas detection sensor based on photoacoustic sensing technique. The system finds application in various fields depending on the target gas. Analysis is performed for a toxic gas such as ammonia, which is used widely in health, medical, food, and agriculture industry.

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Philipp RaimannHahn-Schickard-Gesellschaft für angewandte Forschung e.V.

A new approach to fabricate and implement a thermoelectric infrared sensor based on surface micromachining and vapor HF etching is presented. Thermal insulation
is achieved by distancing the absorber from the substrate surface by exploiting
residual stress in thermocouples.

Philipp RaimannHahn-Schickard-Gesellschaft für angewandte Forschung e.V.

A new approach to fabricate and implement a thermoelectric infrared sensor based on surface micromachining and vapor HF etching is presented. Thermal insulation
is achieved by distancing the absorber from the substrate surface by exploiting
residual stress in thermocouples.

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Moritz SchlagmannInfineon Technologies AG

Enabling smart farming applications with bio-compatible humidity sensor. Parylene C humidity response is characterized with a capacitive sensing principle and compared to standard Polyimide material.

Moritz SchlagmannInfineon Technologies AG

Enabling smart farming applications with bio-compatible humidity sensor. Parylene C humidity response is characterized with a capacitive sensing principle and compared to standard Polyimide material.

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Kshitij Anil KolasFraunhofer ENAS

This presentation will summarize the current state and outline the future scope of parametrically generated FE models for the design for reliability of classical and embedded power modules.
Some examples of these parametric models will be illustrated as well as simulation results to verify these models will also be presented.

Kshitij Anil KolasFraunhofer ENAS

This presentation will summarize the current state and outline the future scope of parametrically generated FE models for the design for reliability of classical and embedded power modules.
Some examples of these parametric models will be illustrated as well as simulation results to verify these models will also be presented.

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Christoph MarschaltPaderborn University

This presentation gives an introduction to a novel method for far-field calculation from magnetic near-field measurement data. Here, the boundary element method is applied to the Huygens box measurement method.

Christoph MarschaltPaderborn University

This presentation gives an introduction to a novel method for far-field calculation from magnetic near-field measurement data. Here, the boundary element method is applied to the Huygens box measurement method.

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Romain AlcesilasCEA-Leti

In this paper, we propose to combine an electromagnetic approach with a highly sensitive MEMS sensing element, in which the physical quantity is measured through the electromagnetic transduction principle. With this approach, we design a wireless and battery-less capacitive pressure sensor for harsh environments, composed of a MEMS sensitive element coupled to a planar miniature antenna in the UHF band (300 MHz – 30 GHz). This approach results in sensors with the high sensitivity of MEMS technologies, and the reading range and the compactness of an electrically miniature antenna, without need of additional electronics.

Romain AlcesilasCEA-Leti

In this paper, we propose to combine an electromagnetic approach with a highly sensitive MEMS sensing element, in which the physical quantity is measured through the electromagnetic transduction principle. With this approach, we design a wireless and battery-less capacitive pressure sensor for harsh environments, composed of a MEMS sensitive element coupled to a planar miniature antenna in the UHF band (300 MHz – 30 GHz). This approach results in sensors with the high sensitivity of MEMS technologies, and the reading range and the compactness of an electrically miniature antenna, without need of additional electronics.

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Simon BöttgerChemnitz University of Technology

Nanomaterials such as Carbon Nanotubes (CNTs) prospect significant added value for such systems, as they inherently feature low energy consumption, superior sensitivity for bio- , optical-, and mechanical sensing and
i even high amplification linearity in FETs. However, complemented new functionalities still rely on conventional system architectures requiring CMOS based ASICs with the corresponding FEOL and BEOL. Hence, post-CMOS hetero-integration technologies for upgrading conventional IC's with nanomaterial based devices is a highly promising path in the context of "More than Moore" scaling.

Simon BöttgerChemnitz University of Technology

Nanomaterials such as Carbon Nanotubes (CNTs) prospect significant added value for such systems, as they inherently feature low energy consumption, superior sensitivity for bio- , optical-, and mechanical sensing and
i even high amplification linearity in FETs. However, complemented new functionalities still rely on conventional system architectures requiring CMOS based ASICs with the corresponding FEOL and BEOL. Hence, post-CMOS hetero-integration technologies for upgrading conventional IC's with nanomaterial based devices is a highly promising path in the context of "More than Moore" scaling.

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Natale TestaSTMicroelectronics SRL

Throughout the presentation you will see a smart industrial sensor reference design, with the capabilities to be easily proven in the field, wired connectivity and on-board sensors (i.e. magnetometer) for Edge analysis.

Natale TestaSTMicroelectronics SRL

Throughout the presentation you will see a smart industrial sensor reference design, with the capabilities to be easily proven in the field, wired connectivity and on-board sensors (i.e. magnetometer) for Edge analysis.

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Sebastian SchermerFraunhofer ENAS

DoE study of ideal process parameter for positive AZ 10XT thick resist.
High-precision stepper lithografie is used for structuring the resist.
High aspect ratio was obtained by using standard DRIE process for structial transfer into
silicon wafer.

Sebastian SchermerFraunhofer ENAS

DoE study of ideal process parameter for positive AZ 10XT thick resist.
High-precision stepper lithografie is used for structuring the resist.
High aspect ratio was obtained by using standard DRIE process for structial transfer into
silicon wafer.

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Andreas Peter WeissJoanneum Research

ln this work we combine a backscattering Visible Light Sensing approach with the innovative approach to
utilize LEDs not only as light sources, but also as receiving elements. Our novel approach demonstrates a
sophisticated control mechanism, that uses 4 LEDs as light sources and receiving elements, without any
disturbance in the provided illumination being perceivable to an observer. By utilizing an Artlficial Neural
Network, we perform the task of position determination on the edge, demonstrating the great potential of our
solution approach.

Andreas Peter WeissJoanneum Research

ln this work we combine a backscattering Visible Light Sensing approach with the innovative approach to
utilize LEDs not only as light sources, but also as receiving elements. Our novel approach demonstrates a
sophisticated control mechanism, that uses 4 LEDs as light sources and receiving elements, without any
disturbance in the provided illumination being perceivable to an observer. By utilizing an Artlficial Neural
Network, we perform the task of position determination on the edge, demonstrating the great potential of our
solution approach.

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Ronny SchwabeAdaptive Systems EAS/ Fraunhofer Institute for Integrated Circuits IIS

This paper offers an approach on how to integrate an edge device, e.g. a microcontroller with a communication interface, into a fast data analysis process so that the data communication with the client device or the cloud can be reduced and parts of the required computation are performed on the edge device. A microcontroller serves as a peripheral device in a Bluetooth Low Energy network, from which recorded sensor data is sent wirelessly to a standard workstation, were the data analysis software KNIME can be used to process the data.

Ronny SchwabeAdaptive Systems EAS/ Fraunhofer Institute for Integrated Circuits IIS

This paper offers an approach on how to integrate an edge device, e.g. a microcontroller with a communication interface, into a fast data analysis process so that the data communication with the client device or the cloud can be reduced and parts of the required computation are performed on the edge device. A microcontroller serves as a peripheral device in a Bluetooth Low Energy network, from which recorded sensor data is sent wirelessly to a standard workstation, were the data analysis software KNIME can be used to process the data.

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Zhijian ZhaoTohoku University

We proposed a design of tunable laser for atomic clock application, aiming at the mass production and cost reduction of micro-fabricated atomic clock.

Zhijian ZhaoTohoku University

We proposed a design of tunable laser for atomic clock application, aiming at the mass production and cost reduction of micro-fabricated atomic clock.

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Łukasz KosiorXTPL SA

The presentation will be focused on the unique capabilities of the combination of two features - high-resolution printing (below 10 um in feature size) and high viscous (even above 1.000.000 cp) materials deposition, which enables printing high resolution, multilayer structures and also heterogeneous integration in advanced packaging. During the presentation, I will show the current status of the technology and perspectives for further development.

Łukasz KosiorXTPL SA

The presentation will be focused on the unique capabilities of the combination of two features - high-resolution printing (below 10 um in feature size) and high viscous (even above 1.000.000 cp) materials deposition, which enables printing high resolution, multilayer structures and also heterogeneous integration in advanced packaging. During the presentation, I will show the current status of the technology and perspectives for further development.

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Namanu PanayanthattaIMEP-LAHC

We demonstrate a novel Energy Autonomous Wireless Vibration sensors for condition monitoring of machines engines etc. The sensor is self powered and uses a lead-free piezoelectric energy harvester for sensing.

Namanu PanayanthattaIMEP-LAHC

We demonstrate a novel Energy Autonomous Wireless Vibration sensors for condition monitoring of machines engines etc. The sensor is self powered and uses a lead-free piezoelectric energy harvester for sensing.

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Wail AI-MogahedTU Chemnitz

This presentation discusses the effect of the surface profile and the volume of fluid droplet on the actuation voltage of a PCB based EWOD microfluidic system. The applicability of disposable dielectric-hydraphobic foils in an EWOD system will be reviewed and evaluated. Calculation of the form of the tri pie contact line using Surface Evolver will be shown.

Wail AI-MogahedTU Chemnitz

This presentation discusses the effect of the surface profile and the volume of fluid droplet on the actuation voltage of a PCB based EWOD microfluidic system. The applicability of disposable dielectric-hydraphobic foils in an EWOD system will be reviewed and evaluated. Calculation of the form of the tri pie contact line using Surface Evolver will be shown.

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Antonio ImbrugliaSTMicroelectronics

To achieve the objectives indicated the new Green Deal of July 2021: 2030 (- 55% GHG emissions) and finally 2050 (Getting closer to zero emissions) an important role will be played by mobility. In fact, electric vehicles, have always been the most energy efficient and environmentally sustainable. The case of high-speed railway and electric veichole using new technologies are presented.

Antonio ImbrugliaSTMicroelectronics

To achieve the objectives indicated the new Green Deal of July 2021: 2030 (- 55% GHG emissions) and finally 2050 (Getting closer to zero emissions) an important role will be played by mobility. In fact, electric vehicles, have always been the most energy efficient and environmentally sustainable. The case of high-speed railway and electric veichole using new technologies are presented.

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Christine DufourX-FAB

This presentation will give an overview of X-FAB’s process modules for silicon-based microfluidic applications. It will focus on process integration know-how and challenges for the creation of a standardized noble metal interface between CMOS wafers and microfluidic elements. An application of High-Density Micro-electrode Arrays to study the cellular activity of electrogenic cells will be discussed.

Christine DufourX-FAB

This presentation will give an overview of X-FAB’s process modules for silicon-based microfluidic applications. It will focus on process integration know-how and challenges for the creation of a standardized noble metal interface between CMOS wafers and microfluidic elements. An application of High-Density Micro-electrode Arrays to study the cellular activity of electrogenic cells will be discussed.

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Guido ColomboOrchestra SRL

How Smart Farming can optimize the monitoring and control of processes by maximizing the production of any type of vegetable in aeroponic cultivation.

Guido ColomboOrchestra SRL

How Smart Farming can optimize the monitoring and control of processes by maximizing the production of any type of vegetable in aeroponic cultivation.

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Florian KuhlMK Versuchsanlagen und Laborbedarf e.K.

We will give a short introduction to MK Versuchsanlagen and then sum up some energy demand considerations and especially the energy use in cleanrooms or laboratories. With our solutions of self-sufficient highly integrable minienvironments and metal free workstations we can contribute to energy savings by the implementation of demand controled filtering and an use of recirculating air. These possibilities will be presented with respect to sensor-actuator systems controled by PLC and integrated into the whole Building managment system.

Florian KuhlMK Versuchsanlagen und Laborbedarf e.K.

We will give a short introduction to MK Versuchsanlagen and then sum up some energy demand considerations and especially the energy use in cleanrooms or laboratories. With our solutions of self-sufficient highly integrable minienvironments and metal free workstations we can contribute to energy savings by the implementation of demand controled filtering and an use of recirculating air. These possibilities will be presented with respect to sensor-actuator systems controled by PLC and integrated into the whole Building managment system.

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Hans KlingstedtSmart Systems Hub GmbH

The presentation will show a best practice AI-based acoustic sensor application for Predictive Maintenance solution for Automated Material Handling Systems inside a semiconductor manufacuring fab. The Predictive Maintenance solution increases significantly the automation equipment effectiveness and was developed during a fast innovation sprint as part of “digital product factory” from Smart Sytems Hub.

Hans KlingstedtSmart Systems Hub GmbH

The presentation will show a best practice AI-based acoustic sensor application for Predictive Maintenance solution for Automated Material Handling Systems inside a semiconductor manufacuring fab. The Predictive Maintenance solution increases significantly the automation equipment effectiveness and was developed during a fast innovation sprint as part of “digital product factory” from Smart Sytems Hub.

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Giorgos FagasTyndall National Institute

ASCENT+ brings together 15 partners integrating a unique research infrastructure for advances in micro/nano-electronics, and serving as a direct entry point to key enabling capabilities in state-of-the-art processing, modelling and simulation data sets, metrology and characterization, and devices and test structures. The ASCENT+ programme offers free-of-charge transnational access to these capabilities and infrastructure, to enable its user community to bridge the gap between scientific exploration and development of proof-of-concept technologies. Here, I will present the access programme and focus on some examples for smart systems integration.

Giorgos FagasTyndall National Institute

ASCENT+ brings together 15 partners integrating a unique research infrastructure for advances in micro/nano-electronics, and serving as a direct entry point to key enabling capabilities in state-of-the-art processing, modelling and simulation data sets, metrology and characterization, and devices and test structures. The ASCENT+ programme offers free-of-charge transnational access to these capabilities and infrastructure, to enable its user community to bridge the gap between scientific exploration and development of proof-of-concept technologies. Here, I will present the access programme and focus on some examples for smart systems integration.

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Aibin Paul LazarBosch Sensortec GmbH

To “smell” a gas mixture, the BME688 gas sensor offers programmable selectivity that relies on a metal oxide temperature profiling method coupled with an AI classifier. Even users with limited knowledge on gas sensing or Artificial Intelligence can adapt the functionality of their sensor to their own needs. This presentation is about the building blocks of the BME AI studio software used for dynamic data collection in the field and continuous improvement of the algorithm.

Aibin Paul LazarBosch Sensortec GmbH

To “smell” a gas mixture, the BME688 gas sensor offers programmable selectivity that relies on a metal oxide temperature profiling method coupled with an AI classifier. Even users with limited knowledge on gas sensing or Artificial Intelligence can adapt the functionality of their sensor to their own needs. This presentation is about the building blocks of the BME AI studio software used for dynamic data collection in the field and continuous improvement of the algorithm.

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Tom SanderUniversity of Paderborn

In this presentation, we first introduce the used dataset and the related problem. Then, the results of the supervised and semi-supervised learning methods are discussed. Finally, the results are compared with each other.

Tom SanderUniversity of Paderborn

In this presentation, we first introduce the used dataset and the related problem. Then, the results of the supervised and semi-supervised learning methods are discussed. Finally, the results are compared with each other.

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Christian HelkeTU Chemnitz, Center for Microtechnologies and Fraunhofer ENAS

This presentation describes the process chain for fabrication of 8" Nanoimprint-Lithography (NIL) masters with optical nano gratings by the use of an i-line wafer stepper and RIE etching for NIL master replication. Afterwards, the NIL master is used for multiple replications using SmartNIL™ technology from EV Group. The corresponding results are shown in the presentation.

Christian HelkeTU Chemnitz, Center for Microtechnologies and Fraunhofer ENAS

This presentation describes the process chain for fabrication of 8" Nanoimprint-Lithography (NIL) masters with optical nano gratings by the use of an i-line wafer stepper and RIE etching for NIL master replication. Afterwards, the NIL master is used for multiple replications using SmartNIL™ technology from EV Group. The corresponding results are shown in the presentation.

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Joerg FroemelTohoku University

This presentation reports a new type of mechanical MEMS sensors, based on the stress-impedance (SI) effect, using FeCuNbSiB soft magnetic alloy. The stress-impedance effect will be introduced, as well as device fabrication and test.

Joerg FroemelTohoku University

This presentation reports a new type of mechanical MEMS sensors, based on the stress-impedance (SI) effect, using FeCuNbSiB soft magnetic alloy. The stress-impedance effect will be introduced, as well as device fabrication and test.

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Jeroen de BoeijKulicke and Soffa Liteq BV

This paper reports on the implementation of die-to-die alignment process using the LITEQ 500 lithographic projection stepper from Kulicke & Soffa. The accuracy of die-to-die alignment on 200 mm wafers is evaluated experimentally in collaboration between Kulicke & Soffa and CEA LETI. The wafer layout consists of 120 dies of 4 mm x 4 mm size and 70 dies of 10 mm x 10 mm size, with different amounts of translation (up to 50 microns) and rotation (up to 10 milliradians) applied to individual dies to emulate typical errors found in reconstructed wafer.

Jeroen de BoeijKulicke and Soffa Liteq BV

This paper reports on the implementation of die-to-die alignment process using the LITEQ 500 lithographic projection stepper from Kulicke & Soffa. The accuracy of die-to-die alignment on 200 mm wafers is evaluated experimentally in collaboration between Kulicke & Soffa and CEA LETI. The wafer layout consists of 120 dies of 4 mm x 4 mm size and 70 dies of 10 mm x 10 mm size, with different amounts of translation (up to 50 microns) and rotation (up to 10 milliradians) applied to individual dies to emulate typical errors found in reconstructed wafer.

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Sebastian PreglInfineon Technologies Dresden GmbH & Co. KG

Two MEMS accelerometer technologies will be presented, which were developed within the joint cooperation between ENAS Fraunhofer Institute and Infineon Techologies. Target application of these high-g, high bandwidth devices is an intelligent tire monitoring system.

Sebastian PreglInfineon Technologies Dresden GmbH & Co. KG

Two MEMS accelerometer technologies will be presented, which were developed within the joint cooperation between ENAS Fraunhofer Institute and Infineon Techologies. Target application of these high-g, high bandwidth devices is an intelligent tire monitoring system.

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Manuel LozanoIMB-CNM (CSIC)

Aquaculture is a sector with a rapid grown and a great potential. It is very important to monitor fish behavior to for the simultaneous improvement of the productivity and the welfare of group-housed animals.
In the framework of AQUAEXCEL2020 EU project we have developed an ultra-low-power, stand-alone, miniature microsystem (AEFishBIT) with the double aim to combine measurements of physical activity and energy demand. The system includes a tri-axial accelerometer and has been designed to be externally implanted on fish operculum and by signal filtering, allows the measurements of physical activity and respiratory frequency.

Manuel LozanoIMB-CNM (CSIC)

Aquaculture is a sector with a rapid grown and a great potential. It is very important to monitor fish behavior to for the simultaneous improvement of the productivity and the welfare of group-housed animals.
In the framework of AQUAEXCEL2020 EU project we have developed an ultra-low-power, stand-alone, miniature microsystem (AEFishBIT) with the double aim to combine measurements of physical activity and energy demand. The system includes a tri-axial accelerometer and has been designed to be externally implanted on fish operculum and by signal filtering, allows the measurements of physical activity and respiratory frequency.

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Dhruvinkumar DarjiFraunhofer ENAS, Chemnitz

This work studies the difference between the behaviors of CMUT cells located at the edges of different arrangements in contrast to those located more centrally. It extends the understanding of crosstalk in CMUTs beyond reported literature. These simulations, for the first time, have been performed for different media to study the effect of medium on the crosstalk. It also shows the change in behavior of each arrangement for varying neighboring cell pitches. Investigating immersion media dependent cell to cell crosstalk, is crucial for optimum design of application specific CMUTs and to enhance their performance.

Dhruvinkumar DarjiFraunhofer ENAS, Chemnitz

This work studies the difference between the behaviors of CMUT cells located at the edges of different arrangements in contrast to those located more centrally. It extends the understanding of crosstalk in CMUTs beyond reported literature. These simulations, for the first time, have been performed for different media to study the effect of medium on the crosstalk. It also shows the change in behavior of each arrangement for varying neighboring cell pitches. Investigating immersion media dependent cell to cell crosstalk, is crucial for optimum design of application specific CMUTs and to enhance their performance.

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Julia WeckerFraunhofer Institute for Electronic Nano Systems ENAS

As part of a future optical platform, an on-chip multimode silicon waveguide for the long infrared wavelength range is designed, fabricated and investigated. The waveguide is coupled to a laser source and a detector using optical fibers together with optical couplers on the chip.

Julia WeckerFraunhofer Institute for Electronic Nano Systems ENAS

As part of a future optical platform, an on-chip multimode silicon waveguide for the long infrared wavelength range is designed, fabricated and investigated. The waveguide is coupled to a laser source and a detector using optical fibers together with optical couplers on the chip.

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Thibault Bertin Rivière De La SouchèreCEA-Leti

The aim of this presentation is to introduce a new hardware architecture for Cascaded H-Bridge Multilevel Inverter for solar applications. An adapted control scheme, which ensures independent control for each solar panel and maximum energy extraction, is also presented. The work is concluded by experimental results with 6 individually controlled solar panels and a switching frequency of 20kHz.

Thibault Bertin Rivière De La SouchèreCEA-Leti

The aim of this presentation is to introduce a new hardware architecture for Cascaded H-Bridge Multilevel Inverter for solar applications. An adapted control scheme, which ensures independent control for each solar panel and maximum energy extraction, is also presented. The work is concluded by experimental results with 6 individually controlled solar panels and a switching frequency of 20kHz.

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Charles BoutonnetCEA LETI

CMUTs are silicium micromechanical gravimetric sensors. We used this technology as gas sensors to demonstrate their relevance for electronic noses. We built a dedicated system around CMUTs that demonstrated fast response and a good limit of detection when exposed to volatile organic compounds.

Charles BoutonnetCEA LETI

CMUTs are silicium micromechanical gravimetric sensors. We used this technology as gas sensors to demonstrate their relevance for electronic noses. We built a dedicated system around CMUTs that demonstrated fast response and a good limit of detection when exposed to volatile organic compounds.

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Sven NitzscheZI Research Center for Information Technology

We compare a neuromorphic processing pipeline using an event-based camera and spiking neural networks to an artificial neural network for human action recognition. In particular, we investigate whether it is feasible to deploy state of the art neuromorphic computing to embedded systems for productive use and show advantages and downsides.

Sven NitzscheZI Research Center for Information Technology

We compare a neuromorphic processing pipeline using an event-based camera and spiking neural networks to an artificial neural network for human action recognition. In particular, we investigate whether it is feasible to deploy state of the art neuromorphic computing to embedded systems for productive use and show advantages and downsides.

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Gildas DiguetTohoku University Sendai

This presentation is showing the touch sensing capabability of a system based on Soft Magnetic layer. Spatial detection is verified. Good time resolution is also observed. (~0.15s)

Gildas DiguetTohoku University Sendai

This presentation is showing the touch sensing capabability of a system based on Soft Magnetic layer. Spatial detection is verified. Good time resolution is also observed. (~0.15s)

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Márta RenczBME

The paper presents the different efforts and methods to develope entrepreneurship within the students of the Joint International Master program in Smart Systems Integrated Solutions, delivered jointly by Aalto University Finland, USN Norway and BME Hungary.

Márta RenczBME

The paper presents the different efforts and methods to develope entrepreneurship within the students of the Joint International Master program in Smart Systems Integrated Solutions, delivered jointly by Aalto University Finland, USN Norway and BME Hungary.

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Paulo MartinezSiemens AG

In this presentation, I will give a short summary of the security components present in the development of embedded devices , such as secure boot, encryption and trusted execution environments, and their impact in product development. Moreover, I will also discuss the current security landscape in ARM Cortex-M and RISC-V based solutions.

Paulo MartinezSiemens AG

In this presentation, I will give a short summary of the security components present in the development of embedded devices , such as secure boot, encryption and trusted execution environments, and their impact in product development. Moreover, I will also discuss the current security landscape in ARM Cortex-M and RISC-V based solutions.

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Nooshin SaeidiFraunhofer ENAS

The presentation concerns a miniaturized liquid level sensor using Capacitive Micromachined Ultrasound Transducer (CMUT), and provides some details on sensor concept, sensor fabrication as well as characterization results that confirm the sensor sensitivity to very small volume changes.

Nooshin SaeidiFraunhofer ENAS

The presentation concerns a miniaturized liquid level sensor using Capacitive Micromachined Ultrasound Transducer (CMUT), and provides some details on sensor concept, sensor fabrication as well as characterization results that confirm the sensor sensitivity to very small volume changes.

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Gonzalo MurilloENERGIOT | IMB-CNM (CSIC)

We propose the global deployment of millions of self-powered IoT devices installed in different assets along the electrical grid. These devices are maintenance free, with no battery replacement, low-cost and easy to install, thanks to a piezoelectric energy harvesting method. Two different pilots, with Iberdrola (DSO in Spain) and ENERCAL (DSO and TSO in New Caledonia) to validate dynamic line rating and smart monitoring use cases.

Gonzalo MurilloENERGIOT | IMB-CNM (CSIC)

We propose the global deployment of millions of self-powered IoT devices installed in different assets along the electrical grid. These devices are maintenance free, with no battery replacement, low-cost and easy to install, thanks to a piezoelectric energy harvesting method. Two different pilots, with Iberdrola (DSO in Spain) and ENERCAL (DSO and TSO in New Caledonia) to validate dynamic line rating and smart monitoring use cases.

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Saeed AbdolinezhadHochschule Offenburg

e presentation consists of our activities around the evaluation of Piezoelectric AlN cantilevers as Physical Unclonable Function (PUF) primitives. We present an architecture for such elements to be used as security anchors in IoT applications.

Saeed AbdolinezhadHochschule Offenburg

e presentation consists of our activities around the evaluation of Piezoelectric AlN cantilevers as Physical Unclonable Function (PUF) primitives. We present an architecture for such elements to be used as security anchors in IoT applications.

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Renauld De LangladeNovaPack Technologies

Within the session on "SME & Start-up engagement in European Projects : how to improve participation further ", I will testimony our company experiences in EU funding, and its forward looking needs / requests and suggestions to the financing entities and organisational bodies.

1/ we must realize and tell decisions makers that behind the "chips" issues, there are stringent "packaging" issues, shortages, shortfalls. The Chips Act should have a Packaging Act to go with it.
2/ we must substitute Critical Raw Materials (CRM) for packaging, as they can be avoided using EU based, EU made composites, and produced at much lower CO2 or environmental costs.
3/ we must "reshore" every single technology brick of the "packaging" activity that had gone away from Europe to S-E ASIA (above 95%). As the USA will, it is crucial for EU too, just because of ITAR.
4/ NOVAPACK leads and I chair of the "BOOSTER PACKAGING" mission,
This is sponsored here by the French Alps Region, to map this activity, geographically and technologically, within the Region, and offer the Member State Authorities, the 3As and Chips Act leaders to help/fund us to scale-up Nation-wide and EU-wide, and fuel the CHIPS ACT to support this crucial activity for the soverignty and strategic independance of our continent.
Our (Regional) public executive summary report is due on June 26-27, at the IMAPS organized "MINAPAD" 2022, here in Grenoble, to the President of the French Alps Region.

Renauld De LangladeNovaPack Technologies

Within the session on "SME & Start-up engagement in European Projects : how to improve participation further ", I will testimony our company experiences in EU funding, and its forward looking needs / requests and suggestions to the financing entities and organisational bodies.

1/ we must realize and tell decisions makers that behind the "chips" issues, there are stringent "packaging" issues, shortages, shortfalls. The Chips Act should have a Packaging Act to go with it.
2/ we must substitute Critical Raw Materials (CRM) for packaging, as they can be avoided using EU based, EU made composites, and produced at much lower CO2 or environmental costs.
3/ we must "reshore" every single technology brick of the "packaging" activity that had gone away from Europe to S-E ASIA (above 95%). As the USA will, it is crucial for EU too, just because of ITAR.
4/ NOVAPACK leads and I chair of the "BOOSTER PACKAGING" mission,
This is sponsored here by the French Alps Region, to map this activity, geographically and technologically, within the Region, and offer the Member State Authorities, the 3As and Chips Act leaders to help/fund us to scale-up Nation-wide and EU-wide, and fuel the CHIPS ACT to support this crucial activity for the soverignty and strategic independance of our continent.
Our (Regional) public executive summary report is due on June 26-27, at the IMAPS organized "MINAPAD" 2022, here in Grenoble, to the President of the French Alps Region.

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Ben van der ZonHigh Tech NL, Silicon Europe Alliance

The current European ambitions to triple the semiconductor activities require April 4
2020 a healthy collaboration of all the players in the exosystem. The Silicon Europe
Alliance can support in the forming of collaborations throughout Europe that involve not only the known major players but also the small and medium sized enterprises.

Ben van der ZonHigh Tech NL, Silicon Europe Alliance

The current European ambitions to triple the semiconductor activities require April 4
2020 a healthy collaboration of all the players in the exosystem. The Silicon Europe
Alliance can support in the forming of collaborations throughout Europe that involve not only the known major players but also the small and medium sized enterprises.

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Lucas GinzingerBosch Sensortec GmbH

Starting with business opportunities for integrated silicon and photonics systems, challenges to be solved will be shown in order to push Europe into a leading role in this field.

Lucas GinzingerBosch Sensortec GmbH

Starting with business opportunities for integrated silicon and photonics systems, challenges to be solved will be shown in order to push Europe into a leading role in this field.

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Yannick PaillardSCINTIL Photonics

Augmented silicon photonics, with integrated lasers, the ultimate integration of photonic system, optimized for co-packaging.

Yannick PaillardSCINTIL Photonics

Augmented silicon photonics, with integrated lasers, the ultimate integration of photonic system, optimized for co-packaging.

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Aida Todri SanialCNRS-LIRMM

This talk will give an overview of a novel unconventional computing paradigm inspired by neuronal oscillations or oscillatory neural networks (ONNs). ONNs compute based on the dynamics of coupled oscillators while performing fast and low power computations. This talk will cover aspects of materials, devices, architectures and ONN implementation, and show a few ONN-based demonstrators for AI applications.

Aida Todri SanialCNRS-LIRMM

This talk will give an overview of a novel unconventional computing paradigm inspired by neuronal oscillations or oscillatory neural networks (ONNs). ONNs compute based on the dynamics of coupled oscillators while performing fast and low power computations. This talk will cover aspects of materials, devices, architectures and ONN implementation, and show a few ONN-based demonstrators for AI applications.

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Eric MounierYOLE INTELLIGENCE

Presentation will give an overview of Silicon Photonics. Applications, market forecast, technological trends and challenges will be discussed.

Eric MounierYOLE INTELLIGENCE

Presentation will give an overview of Silicon Photonics. Applications, market forecast, technological trends and challenges will be discussed.

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Werner SteinhöglHead of Sector Photonics, European Commission, DG CONNECT

The talk will give an overview on the EU funded programmes ad actions related to photonic integration.

Werner SteinhöglHead of Sector Photonics, European Commission, DG CONNECT

The talk will give an overview on the EU funded programmes ad actions related to photonic integration.

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Olivier ChevaleriasCATIE

The project concerns the Development of a solution based on embedded AI for the predictive maintenance of the Main Inlet Valves in power dams.
The system is based on 6TRON, an open hardware prototyping platform from CATIE.
The software performs the fusion of multiple sensors.
Dedicated AI algorithms permit the detection of abnormalities and failure during the operation of the valves.
The industrial prototype is under design.

Olivier ChevaleriasCATIE

The project concerns the Development of a solution based on embedded AI for the predictive maintenance of the Main Inlet Valves in power dams.
The system is based on 6TRON, an open hardware prototyping platform from CATIE.
The software performs the fusion of multiple sensors.
Dedicated AI algorithms permit the detection of abnormalities and failure during the operation of the valves.
The industrial prototype is under design.

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Rainer GünzlerHahn-Schickard

Within the Digital Europe Programme a big network of so-called "European Digital Innovation Hubs" will be started soon. While collaborating at the European level, single EDIHs will focus on a specific region and set of technologies. The ultimate goal of EDIHs is to help SMEs and public authorities in digitalisation. The presentation will inform about this new initiative.

Rainer GünzlerHahn-Schickard

Within the Digital Europe Programme a big network of so-called "European Digital Innovation Hubs" will be started soon. While collaborating at the European level, single EDIHs will focus on a specific region and set of technologies. The ultimate goal of EDIHs is to help SMEs and public authorities in digitalisation. The presentation will inform about this new initiative.

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    Look Back 2022

    On April 27th and 28th, the Smart Systems Integration Conference & Exhibition, SSI for short, took place. More than 100 participants from all over Germany, Europe and the world attended the event in Grenoble, France, which was diversified as well as exciting. Highly interesting keynotes, a total of 70 speakers spread over five tracks, 15 technical sessions, a poster session and an exhibitor pitch session dealt intensively with Smart Systems along the entire value chain. The participants took advantage of the numerous insights, best practices, presentations, keynotes and demonstrations to network intensively afterwards. Finally yet importantly, the Thomas Gessner Award was presented for the third time during the event.

    On April 27th, the two conference chairs Dr. Stefan Finkbeiner (Bosch Sensortec) and Prof. Thomas Otto (Fraunhofer ENAS) opened the now 15th Smart Systems Integration Conference at the Maison MINATEC in Grenoble/France. Organized by Fraunhofer ENAS, EPoSS – – European Association on Smart Systems Integration and Silicon Saxony, this year’s SSI conference and exhibition also put the spotlight on Smart Systems. Thanks to the support of the SSI core team, the scientific committee and the two main sponsors Bosch Sensortec and Critical Manufacturing, the SSI once again offered a diversified conference and supporting program for the more than 100 participants. 70 technical papers in 15 sessions dealt intensively with a total of five technological tracks. Joint excursions and conference dinner after eventful hours of technical exchange offered all participants the best opportunity to get to know each other better.

    The high-ranked keynote speeches covered the full thematic scope of the SSI. They were held by Bert De Colvenaer, Executive Director of KDT Joint Undertaking (“From ECSEL to KDT to CHIPS JU”); Laurent Remont, Vicepresident of Sensor Solutions at Infineon Technologies (“Sense-compute-connect-power: a holistic sensor system approach to enable greener, easier and safer life”); Olivier Faynot, Silicon Department Head of CEA-Leti (“Overcoming the Data Deluge Challenges with Greener Electronics”), Andrea Onetti, Executive Vice President of ST Microelectronics Srl Italy (“Making micromirrors system integration friendly: thin-film piezo technology”), and Harald Kuhn, Director of Fraunhofer ENAS and Director of the Center for Microtechnologies at TU Chemnitz (“Smart Systems will create the future”).

    The participants were offered a free choice of topics in the five conference tracks “Key Enablers for Next Generation Smart Systems”, “Key Technologies for Smart Systems”, “Application Domains: Mobility, Energy, Industry”, “Application Domains: Food, Biomedical, Healthy Living” or “Strategy and Business Creation” – as well as the best input from experts in the respective fields. The topics were oriented along the complete value chain of Smart Systems and addressed the Technology Readiness Levels (TRL) between 1 and 9, ranging from “Key Enablers for Smart Systems of the Next Generation” over technologies to applications in various industries. The track “Strategy and Business Creation” organized by EPoSS Association focused on Photonics Integration on the one hand and on Digital Innovation Hubs and the integration of start-ups and SMEs on the other hand.

    For the third time, the “Thomas Gessner Award” was presented. By this, Fraunhofer ENAS promotes applied research by awarding this prize for excellent scientific work within the annual Smart Systems Integration Conference. The award is aimed at national and international master and doctoral students in the field of Smart Systems Integration, whose thesis has been evaluated at least “very good” and does not date back more than two years. The evaluation procedure takes particular into account the novelty of the scientific and methodological approach, the progress of knowledge, the translation of scientific results into application and the proof of commercial success. This year, the prize went to the young scientist Apoorva Sharma from Chemnitz University of Technology for his contribution “Prospects of laser annealing for magnetoresistive sensors and MRAM manufacturing”.

    The most exciting poster contribution was awarded on the last day of the event. The winner was Sven Nitzsche from the FZI Research Center for Information Technology for his poster “Comparison of Artificial and Spiking Neural Networks for Ambient-Assisted Living”. Mr. Nitzsche is thus already the first confirmed speaker of the 16th SSI next year. He follows his predecessor, Claudia Bruno, who was the winner of the Best Poster Award 2021. This year, virtually connected, she presented her talk on last year’s winning paper and subsequent progress once again. In addition, Bruno Fain of CEA Leti received the Best Paper Award 2021 during this year’s conference dinner – i.e., the award for the best conference paper of the previous year.

    The organizers of SSI – Fraunhofer ENAS, EPoSS Association and Silicon Saxony – would like to thank all speakers for their contributions and the participating companies and institutions Robert Bosch, Bosch Sensortec, Lynred, Renault, Infineon Technologies, STMicroelectronics, Fraunhofer ENAS, Fraunhofer IPMS, Tyndall National Institute, CEA-Leti, TU Chemnitz and TU Delft for their exciting technical content. Finally yet importantly, we would like to thank all participants of this year for their interest and all sponsors for their important support.

    We are already looking forward to the Smart Systems Integration 2023 in Flanders/Belgium.

    Look Back 2021

    The 1st completely virtual edition of the Smart Systems Integration Conference & Exhibition, short SSI, took place from April 27 to 29, 2021. More than 120 participants from all over Germany, Europe and the world took part in the online event. Originally it was planned to hold the conference in Grenoble/France. Now the event took place on an individually provided online platform due to present circumstances. Highly interesting keynotes, a total of 53 speakers spread over five tracks and nine sessions as well as a poster session with a total of ten contributions and organized topic tables for discussions were among the highlights of the three-day event. In addition, the Thomas Gessner Award was presented for the second time during the event.

    With a new technical organizer, Silicon Saxony, the 14th Smart Systems Integration Conference 2021 started for the first time as an online event. Even before the start of the SSI, the participants received a small Saxon welcome. Sponsored by the Saxony Economic Development Corporation, small care packages with snacks and information materials were sent out to bring a smile to the faces of all participants during these times of limited contact. Accordingly, the participants of the SSI started their first day of the event on April 27 in a good mood and well strengthend. The Conference Chairs Prof. Thomas Otto (Fraunhofer ENAS), Dr. Stefan Finkbeiner (Bosch Sensortec and EPoSS) and Emmanuel Sabonnadiere (CEA-Leti) opened the conference.

    Already the four keynotes by Lucilla Sioli, Director for Artificial Intelligence and Digital Industry, European Commission (Electronic and Photonic Smart Systems: Contributing to a European green, digital and sovereign future), Jean-François Delepau, CEO Lynred (LYNRED's leadership at the dawn of infrared imaging applications), Remi Bastien, Renault Group (Power Electronics - An opportunity for Europe's Industry and a valuable field of cooperation between Automotive & Electronics) and Elisa Vianello, CEA-Leti (The role of resistive memories to enable frugal AI devices) showed the scope of this year's SSI. The five tracks were oriented along the entire value chain of Smart Systems and addressed Technology Readiness Levels (TRL) between 1 and 9, ranging from key enablers for smart systems of the next generation, to technologies and applications in various industries. Strategic topics were also discussed. 53 speakers - some live, some in recorded presentations - provided ample input and reasons for personal exchange.

    The Thomas Gessner Award was presented for the 2nd time. It is a contribution of Fraunhofer ENAS to promote applied research by awarding a prize for excellent scientific work within the annual Smart Systems Integration Conference. The award is aimed at national and international master and doctoral students in the field of Smart Systems Integration whose thesis is evaluated at least with "very good" and does not date back more than two years. The evaluation procedure takes particularly into account the novelty of the scientific and methodological approach, the progress of knowledge, the implementation of the scientific results in application and proof of economic success This year, the prize went to the young scientist Dr.-Ing. Ulrike Nabholz, Robert Bosch GmbH, for her doctoral thesis on "Physical Modeling and Identification of Nonlinear Effects in Microelectromechanical Systems", which she prepared in cooperation with the Chemnitz University of Technology and successfully defended in 2020. All participants of the conference were able to evaluate the poster contributions. On the last day of the event, the most exciting contribution was awarded the Best Poster Award. The winner was Claudia Bruno from STMicroelectronics for her poster presentation on "Embedded artificial intelligence approach for gas recognition in smart agriculture application using low cost MOX gas sensors".

    Also in the next three months, all contributions of this year's SSI will still be available on the event platform. We would like to thank all speakers for their contributions and especially the companies and institutions Robert Bosch, Bosch Sensortec, Lynred, Renault, Infineon Technologies, STMicroelectronics, Fraunhofer , Tyndall National Institute, CEA-Leti, TU Chemnitz and TU Delft for their exciting technical presentations. Fraunhofer ENAS, EPoSS and Silicon Saxony would like to thank all participants for their interest and all sponsors for their important support during these difficult conference times.

    Best Poster and Best Paper Award Winner 2021 selected

    Since the establishment of the conference in 2007, it is a tradition to select and award the best poster as well as the best paper at the Smart Systems Integration Conference. Both awardees receive a donation of 500 euros that are sponsored by EPoSS – the European Platform on Smart Systems Integration and the Fraunhofer Institute for Electronic Nano Systems ENAS.

    All attendees of the conference vote for the best poster of the conference. The selected winner is announced at the end of the conference during closing remarks. The committee also nominates the best paper candidates and the winner is selected out of 7 to 10 candidates based on the presentation as well as the written paper.

    Best Poster and Best Paper Award Winner 2021 selected

    The best poster award winner at the SSI 2021 is Claudia Bruno from STMicroelectronics with her poster titled “Embedded artificial intelligence approach for gas recognition in smart agriculture application using low cost MOX gas sensors”, as previously published in the after conference press release.

    The best paper award winner of the 1st fully virtual edition of the SSI 2021 is Dr. Bruno Fain from CEA-LETI with his paper “Beamforming with AlN-based bimorph piezoelectric micromachined ultrasonic transducers“. In his paper, he presented a piezoelectric micromechanical ultrasonic transducer (pMUT) with multiple membranes used for airborne pulse-echo measurements with an angular resolution of 18 degrees.

    Both awards will be presented to the winners at the Smart Systems Integration Conference & Exhibition 2022, which will take place April 26 to 28, 2022 in Grenoble.